Mirkarimi; Laura

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mirkarimi; Laura.The latest application filed is for "face-to-face mounted ic dies with orthogonal top interconnect layers".

Company Profile

1.15.10

Mirkarimi; Laura - San Jose CA
Mirkarimi; Laura - Sunol CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Face-to-face mounted IC dies with orthogonal top interconnect layers Grant 10,892,252 - Nequist , et al. January 12, 2	2021-01-12
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers App 20200203318 - Nequist; Eric M. ; et al.	2020-06-25
Face-to-face mounted IC dies with orthogonal top interconnect layers Grant 10,580,757 - Nequist , et al.	2020-03-03
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers App 20180331072 - Nequist; Eric M. ; et al.	2018-11-15
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 9,691,679 - Co , et al. June 27, 2	2017-06-27
Method For Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20160260647 - Co; Reynaldo ; et al.	2016-09-08
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 9,349,706 - Co , et al. May 24, 2	2016-05-24
Method For Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20150017765 - Co; Reynaldo ; et al.	2015-01-15
Interconnect structure Grant 8,853,558 - Gupta , et al. October 7, 2	2014-10-07
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 8,772,152 - Co , et al. July 8, 2	2014-07-08
Wafer level edge stacking Grant 8,680,662 - Haba , et al. March 25, 2	2014-03-25
Method For Package-on-package Assembly With Wire Bonds To Encapsulation Surface App 20130224914 - Co; Reynaldo ; et al.	2013-08-29
Reconstituted wafer stack packaging with after-applied pad extensions Grant 8,461,672 - Haba , et al. June 11, 2	2013-06-11
Method for package-on-package assembly with wire bonds to encapsulation surface Grant 8,372,741 - Co , et al. February 12, 2	2013-02-12
Interconnect Structure App 20120145442 - Gupta; Debabrata ; et al.	2012-06-14
Off-chip vias in stacked chips Grant 8,076,788 - Haba , et al. December 13, 2	2011-12-13
Reconstituted Wafer Stack Packaging With After-applied Pad Extensions App 20110006432 - Haba; Belgacem ; et al.	2011-01-13
Wafer level edge stacking App 20090316378 - Haba; Belgacem ; et al.	2009-12-24
Inorganic coatings for optical and other applications App 20060210425 - Mirkarimi; Laura	2006-09-21
Photonic Crystal Resonator Apparatus With Improved Out Of Plane Coupling App 20060029347 - Sigalas; Mihail ; et al.	2006-02-09
Photonic crystal resonator apparatus with improved out of plane coupling Grant 6,993,234 - Sigalas , et al. January 31, 2	2006-01-31

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