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Patent applications and USPTO patent grants for Miniet; Jay J..The latest application filed is for "flexible printed circuit board having integrated circuit die or the like affixed thereto".
Patent | Date |
---|---|
Flexible printed circuit board having integrated circuit die or the like affixed thereto Grant 4,677,528 - Miniet June 30, 1 | 1987-06-30 |
Double-sided flexible electronic circuit module Grant 4,567,543 - Miniet January 28, 1 | 1986-01-28 |
Header and housing assembly for electronic circuit modules Grant 4,533,188 - Miniet August 6, 1 | 1985-08-06 |
Socket and flexible PC board assembly and method for making Grant 4,489,999 - Miniet December 25, 1 | 1984-12-25 |
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