Minervini; Anthony

Patent Applications and Registrations

Patent applications and USPTO patent grants for Minervini; Anthony.The latest application filed is for "microphone package with an integrated digital signal processor".

Company Profile

0.10.12

Minervini; Anthony - Palo Hills IL
Minervini; Anthony - Palos Hills IL
Minervini; Anthony - Palos Heights IL
Minervini; Anthony - Orland Park IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite fuse element and method of making Grant 10,134,556 - Zheng , et al. November 20, 2	2018-11-20
Microphone package with an integrated digital signal processor Grant 10,123,112 - Murgia , et al. November 6, 2	2018-11-06
Integrated CMOS back cavity acoustic transducer and the method of producing the same Grant 9,828,240 - Liu , et al. November 28, 2	2017-11-28
Microphone Package With An Integrated Digital Signal Processor App 20170164107 - Murgia; Carlo ; et al.	2017-06-08
Integrated Cmos Back Cavity Acoustic Transducer And The Method Of Producing The Same App 20160167956 - Liu; Fang ; et al.	2016-06-16
Integrated CMOS back cavity acoustic transducer and the method of producing the same Grant 9,299,671 - Liu , et al. March 29, 2	2016-03-29
Integrated Cmos Back Cavity Acoustic Transducer And The Method Of Producing The Same App 20150102390 - Liu; Fang ; et al.	2015-04-16
Composite Fuse Element And Method Of Making App 20140240082 - Zheng; Ben ; et al.	2014-08-28
Package with a CMOS die positioned underneath a MEMS die Grant 8,791,531 - Loeppert , et al. July 29, 2	2014-07-29
Microelectromechanical system package with strain relief bridge Grant 8,450,817 - Minervini May 28, 2	2013-05-28
Package With A CMOS Die Positioned Underneath A MEMS Die App 20120161259 - Loeppert; Peter V. ; et al.	2012-06-28
Package With A Cmos Die Positioned Underneath A Mems Die App 20120161258 - Loeppert; Peter V. ; et al.	2012-06-28
Microphone Having Reduced Vibration Sensitivity App 20120039499 - Ryan; William ; et al.	2012-02-16
Microphone Having Reduced Vibration Sensitivity App 20100303274 - Ryan; William ; et al.	2010-12-02
Microelectromichanical System Package With Strain Relief Bridge App 20100038733 - Minervini; Anthony	2010-02-18
Mems Package Having At Least One Port And Manufacturing Method Thereof App 20080217709 - Minervini; Anthony ; et al.	2008-09-11
Method Of Creating Solid Object From A Material And Apparatus Thereof App 20080142475 - Loeppert; Peter V. ; et al.	2008-06-19
Microelectromechanical system assembly and method for manufacturing thereof App 20070215962 - Minervini; Anthony ; et al.	2007-09-20
Containment of tin diffusion bar Grant 6,078,245 - Fritz , et al. June 20, 2	2000-06-20
Electrical apparatus for overcurrent protection of electrical circuits Grant 5,939,968 - Nguyen , et al. August 17, 1	1999-08-17

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