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Patent applications and USPTO patent grants for Minegishi; Keiichi.The latest application filed is for "fluid pressure device and manufacturing method for fluid pressure device".
Patent | Date |
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Bonding method and apparatus therefor Grant 8,901,465 - Ohashi , et al. December 2, 2 | 2014-12-02 |
Fluid flow passage structure and manufacturing method thereof Grant 8,109,296 - Minegishi , et al. February 7, 2 | 2012-02-07 |
Laminated structure for a fluid Grant 7,923,124 - Minegishi , et al. April 12, 2 | 2011-04-12 |
Bonding Method And Apparatus Therefor App 20090139646 - OHASHI; Osamu ;   et al. | 2009-06-04 |
Fluid Pressure Device And Manufacturing Method For Fluid Pressure Device App 20090140196 - MINEGISHI; Keiichi ;   et al. | 2009-06-04 |
Laminated Structure For A Fluid App 20090098407 - MINEGISHI; Keiichi ;   et al. | 2009-04-16 |
Fluid Flow Passsage Structure And Manufacturing Method Thereof App 20090078329 - Minegishi; Keiichi ;   et al. | 2009-03-26 |
Method of connecting aluminum alloy die cast member Grant 7,468,493 - Ohashi , et al. December 23, 2 | 2008-12-23 |
Method of connecting aluminum alloy die cast member App 20050067383 - Ohashi, Osamu ;   et al. | 2005-03-31 |
Material for destroying concrete structures Grant 4,409,030 - Minegishi , et al. October 11, 1 | 1983-10-11 |
Process for producing hydraulic cements Grant 4,404,031 - Sudoh , et al. September 13, 1 | 1983-09-13 |
Humidity sensor element Grant 4,344,062 - Sudoh , et al. August 10, 1 | 1982-08-10 |
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