Minamitani; Shozo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Minamitani; Shozo.The latest application filed is for "heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components".

Company Profile

0.20.19

Minamitani; Shozo - Ibaraki JP
Minamitani; Shozo - Hirakata JP
Minamitani; Shozo - Osaka JP
Minamitani; Shozo - Kadoma JP
Minamitani; Shozo - Ibaraki-shi JP
Minamitani; Shozo - Kadoma-shi Osaka
Minamitani, Shozo - Hirakata-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component mounting apparatus Grant 8,001,678 - Kabeshita , et al. August 23, 2	2011-08-23
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 7,938,929 - Minamitani , et al. May 10, 2	2011-05-10
Component mounting method, component mounting apparatus, and ultrasonic bonding head Grant 7,861,908 - Minamitani , et al. January 4, 2	2011-01-04
Component mounting apparatus Grant 7,827,677 - Ueno , et al. November 9, 2	2010-11-09
Apparatus and method for removing semiconductor chip Grant 7,637,714 - Kabeshita , et al. December 29, 2	2009-12-29
Component mounting tool, and method and apparatus for mounting component using this tool Grant 7,549,567 - Higashi , et al. June 23, 2	2009-06-23
Heating And Pressurizing Apparatus For Use In Mounting Electronic Components, And Apparatus And Method For Mounting Electronic Components App 20090120998 - Minamitani; Shozo ; et al.	2009-05-14
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 7,490,652 - Minamitani , et al. February 17, 2	2009-02-17
Component Mounting Apparatus App 20090007420 - KABESHITA; Akira ; et al.	2009-01-08
Component mounting method Grant 7,437,818 - Kabeshita , et al. October 21, 2	2008-10-21
Apparatus and method for mounting electronic components Grant 7,296,727 - Onobori , et al. November 20, 2	2007-11-20
Component mounting apparatus and component mounting method Grant 7,290,331 - Onobori , et al. November 6, 2	2007-11-06
Component mounting method Grant 7,281,322 - Onobori , et al. October 16, 2	2007-10-16
Component mounting method, component mounting apparatus, and ultrasonic bonding head App 20070187457 - Minamitani; Shozo ; et al.	2007-08-16
Electronic component mounting method and apparatus and ultrasonic bonding head Grant 7,229,854 - Minamitani , et al. June 12, 2	2007-06-12
Component Mounting Tool, And Method And Apparatus For Mounting Component Using This Tool App 20070119905 - Higashi; Kazushi ; et al.	2007-05-31
Component mounting apparatus including a polishing device Grant 7,219,419 - Higashi , et al. May 22, 2	2007-05-22
Component mounting apparatus and component mounting method App 20070101572 - Kabeshita; Akira ; et al.	2007-05-10
Component Mounting Apparatus And Component Mounting Method App 20070006453 - Onobori; Shunji ; et al.	2007-01-11
Component Mounting Apparatus And Component Mounting Method App 20070006454 - Onobori; Shunji ; et al.	2007-01-11
Apparatus and method for removing semiconductor chip App 20060285965 - Kabeshita; Akira ; et al.	2006-12-21
Apparatus and method for mounting component Grant 7,020,953 - Ueno , et al. April 4, 2	2006-04-04
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components App 20060016562 - Minamitani; Shozo ; et al.	2006-01-26
Apparatus and method for mounting component App 20050283972 - Ueno, Yasuharu ; et al.	2005-12-29
Electronic component mounting method and apparatus and ultrasondic bonding head App 20050227429 - Minamitani, Shozo ; et al.	2005-10-13
Apparatus and method for mounting electronic components App 20050098610 - Onobori, Shunji ; et al.	2005-05-12
Method and device for frictional connection and holding tool used for the frictional connection device Grant 6,706,130 - Minamitani , et al. March 16, 2	2004-03-16
Apparatus and method for mounting component App 20040020043 - Ueno, Yasuharu ; et al.	2004-02-05
Bump joining method App 20030205607 - Minamitani, Shozo ; et al.	2003-11-06
Component mounting tool, and method and apparatus for mounting component using this tool App 20030150108 - Higashi, Kazushi ; et al.	2003-08-14
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components App 20030121616 - Minamitani, Shozo ; et al.	2003-07-03
Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components Grant 6,544,377 - Minamitani , et al. April 8, 2	2003-04-08
Method and apparatus for mounting component Grant 6,506,222 - Minamitani , et al. January 14, 2	2003-01-14
Bump joining method App 20020008132 - Minamitani, Shozo ; et al.	2002-01-24
Bump joining method Grant 6,321,973 - Minamitani , et al. November 27, 2	2001-11-27
Method and apparatus for mounting component App 20010026012 - Minamitani, Shozo ; et al.	2001-10-04
Component mounting apparatus and method Grant 6,246,789 - Hosotani , et al. June 12, 2	2001-06-12
Method and apparatus for mounting component App 20010001469 - Higashi, Kazushi ; et al.	2001-05-24
Component mounting method and apparatus Grant 6,193,136 - Higashi , et al. February 27, 2	2001-02-27

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