Minamihaba; Gaku

Patent Applications and Registrations

Patent applications and USPTO patent grants for Minamihaba; Gaku.The latest application filed is for "planarization method and planarization apparatus".

Company Profile

1.63.91

Minamihaba; Gaku - Kanagawa-ken JP
Minamihaba; Gaku - Yokohama JP
Minamihaba; Gaku - Kanagawa N/A JP
MINAMIHABA; Gaku - Yokohma-shi JP
MINAMIHABA; Gaku - Yokohama-shi JP
Minamihaba; Gaku - Yokohoma N/A JP
Minamihaba; Gaku - Kawasaki JP
Minamihaba; Gaku - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Planarization method and planarization apparatus Grant 10,283,383 - Gawase , et al.	2019-05-07
Planarization Method And Planarization Apparatus App 20150357212 - GAWASE; Akifumi ; et al.	2015-12-10
Planarization method and planarization apparatus Grant 9,144,879 - Gawase , et al. September 29, 2	2015-09-29
Manufacturing method of semiconductor device and polishing apparatus Grant 9,012,246 - Eda , et al. April 21, 2	2015-04-21
Method of manufacturing semiconductor device Grant 8,871,644 - Matsui , et al. October 28, 2	2014-10-28
Planarization Method And Planarization Apparatus App 20140220778 - GAWASE; Akifumi ; et al.	2014-08-07
Polishing method and method for fabricating semiconductor device Grant 8,778,802 - Fukushima , et al. July 15, 2	2014-07-15
Method For Chemical Planarization And Chemical Planarization Apparatus App 20140187042 - Matsui; Yukiteru ; et al.	2014-07-03
Semiconductor device and method of manufacturing the same Grant 8,754,433 - Matsui , et al. June 17, 2	2014-06-17
Method for chemical planarization and chemical planarization apparatus Grant 8,703,004 - Matsui , et al. April 22, 2	2014-04-22
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device Grant 8,685,857 - Matsui , et al. April 1, 2	2014-04-01
Semiconductor Device Manufacturing Method App 20140073136 - MINAMIHABA; Gaku ; et al.	2014-03-13
Method Of Manufacturing Semiconductor Device And Apparatus For Manufacturing Semiconductor Device App 20140030891 - YAMAMOTO; Susumu ; et al.	2014-01-30
Manufacturing Method Of Semiconductor Device And Polishing Apparatus App 20140004628 - EDA; Hajime ; et al.	2014-01-02
Method For Manufacturing Semiconductor Device App 20140004775 - EDA; Hajime ; et al.	2014-01-02
Semiconductor Device Manufacturing Method And Chemical Mechanical Polishing Method App 20130331004 - MINAMIHABA; Gaku ; et al.	2013-12-12
Semiconductor Device Manufacturing Method App 20130331005 - GAWASE; Akifumi ; et al.	2013-12-12
Semiconductor device manufacturing method Grant 8,575,030 - Minamihaba , et al. November 5, 2	2013-11-05
Method Of Manufacturing Semiconductor Device App 20130273817 - Minamihaba; Gaku ; et al.	2013-10-17
Method of manufacturing semiconductor device Grant 8,480,915 - Minamihaba , et al. July 9, 2	2013-07-09
Method For Chemical Planarization And Chemical Planarization Apparatus App 20130119013 - MATSUI; Yukiteru ; et al.	2013-05-16
Semiconductor Device And Method Of Manufacturing The Same App 20130095656 - MATSUI; Yukiteru ; et al.	2013-04-18
Cmp Method, Cmp Apparatus And Method Of Manufacturing Semiconductor Device App 20130095661 - GAWASE; Akifumi ; et al.	2013-04-18
Substrate Processing Method App 20130084400 - KODERA; Masako ; et al.	2013-04-04
Cmp Slurry And Method For Manufacturing Semiconductor Device App 20130078784 - MINAMIHABA; Gaku ; et al.	2013-03-28
Method Of Manufacturing Semiconductor Device App 20130040456 - EDA; Hajime ; et al.	2013-02-14
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Grant 8,337,715 - Minamihaba , et al. December 25, 2	2012-12-25
Method Of Manufacturing Semiconductor Device App 20120258597 - Minamihaba; Gaku ; et al.	2012-10-11
Manufacturing method of a semiconductor device Grant 8,174,125 - Kurashima , et al. May 8, 2	2012-05-08
Semiconductor Device Manufacturing Method App 20120034846 - MINAMIHABA; Gaku ; et al.	2012-02-09
Semiconductor Device And Method Of Manufacturing The Same App 20110294291 - Matsui; Yukiteru ; et al.	2011-12-01
Aqueous Dispersion For Chemical Mechanical Polishing, Chemical Mechanical Polishing Method, Kit For Chemical Mechanical Polishing, And Kit For Preparing Aqueous Dispersion For Chemical Mechanical Polishing App 20110250756 - UCHIKURA; Kazuhito ; et al.	2011-10-13
Cleaning Apparatus And Method Of Fabricating Semiconductor Device App 20110192420 - KURASHIMA; Nobuyuki ; et al.	2011-08-11
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same App 20110195888 - KURASHIMA; Nobuyuki ; et al.	2011-08-11
Post-CMP treating liquid and manufacturing method of semiconductor device using the same Grant 7,951,717 - Kurashima , et al. May 31, 2	2011-05-31
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device App 20110062374 - Minamihaba; Gaku ; et al.	2011-03-17
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Grant 7,842,191 - Minamihaba , et al. November 30, 2	2010-11-30
Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device Grant 7,833,431 - Minamihaba , et al. November 16, 2	2010-11-16
Method of manufacturing semiconductor device Grant 7,825,028 - Kurashima , et al. November 2, 2	2010-11-02
Method of manufacturing a semiconductor device Grant 7,700,489 - Matsui , et al. April 20, 2	2010-04-20
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same App 20100093585 - Kurashima; Nobuyuki ; et al.	2010-04-15
Semiconductor device fabrication method Grant 7,682,975 - Fukushima , et al. March 23, 2	2010-03-23
Post-CMP treating liquid and manufacturing method of semiconductor device using the same Grant 7,655,559 - Kurashima , et al. February 2, 2	2010-02-02
Manufacturing Method Of A Semiconductor Device App 20090184415 - Kurashima; Nobuyuki ; et al.	2009-07-23
Chemical Mechanical Polishing Slurry And Semiconductor Device Manufacturing Method App 20090176372 - MINAMIHABA; Gaku ; et al.	2009-07-09
Manufacturing method of a semiconductor device Grant 7,521,350 - Kurashima , et al. April 21, 2	2009-04-21
Polishing Liquid And Method For Manufacturing Semiconductor Device App 20090068840 - MINAMIHABA; Gaku ; et al.	2009-03-12
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device App 20090068841 - Matsui; Yukiteru ; et al.	2009-03-12
Method of manunfacturing semiconductor device App 20090061626 - Kurashima; Nobuyuki ; et al.	2009-03-05
Method for fabricating semiconductor device and polishing method Grant 7,494,931 - Fukushima , et al. February 24, 2	2009-02-24
Method of manufacturing semiconductor device Grant 7,465,668 - Fukushima , et al. December 16, 2	2008-12-16
Slurry for CMP, polishing method and method of manufacturing semiconductor device Grant 7,459,398 - Minamihaba , et al. December 2, 2	2008-12-02
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device Grant 7,452,819 - Matsui , et al. November 18, 2	2008-11-18
Method of manufacturing semiconductor device Grant 7,435,682 - Matsui , et al. October 14, 2	2008-10-14
Chemical Mechanical Polishing Method And Method For Manufacturing Semiconductor Device App 20080227297 - MATSUI; Yukiteru ; et al.	2008-09-18
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same App 20080216415 - KURASHIMA; Nobuyuki ; et al.	2008-09-11
Slurry for CMP, polishing method and method of manufacturing semiconductor device Grant 7,419,910 - Minamihaba , et al. September 2, 2	2008-09-02
Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor Grant 7,402,521 - Matsui , et al. July 22, 2	2008-07-22
Semiconductor device including a discontinuous film and method for manufacturing the same App 20080124927 - Minamihaba; Gaku ; et al.	2008-05-29
Slurry for CMP and CMP method Grant 7,364,667 - Minamihaba , et al. April 29, 2	2008-04-29
Polishing method and polishing liquid Grant 7,354,861 - Nakamura , et al. April 8, 2	2008-04-08
Cleaning Composition, Cleaning Method, And Manufacturing Method Of Semiconductor Device App 20080045016 - Andou; Michiaki ; et al.	2008-02-21
Slurry for CMP, polishing method and method of manufacturing semiconductor device Grant 7,332,104 - Minamihaba , et al. February 19, 2	2008-02-19
Slurry for CMP of Cu film, polishing method and method for manufacturing semiconductor device App 20070293049 - Minamihaba; Gaku ; et al.	2007-12-20
Polishing method and method for fabricating semiconductor device App 20070293047 - Fukushima; Dai ; et al.	2007-12-20
Polishing method of Cu film and method for manufacturing semiconductor device Grant 7,307,023 - Fukushima , et al. December 11, 2	2007-12-11
Semiconductor device including a discontinuous film and method for manufacturing the same Grant 7,307,344 - Minamihaba , et al. December 11, 2	2007-12-11
Slurry for touch-up CMP and method of manufacturing semiconductor device App 20070232068 - Minamihaba; Gaku ; et al.	2007-10-04
Post-cmp Treating Liquid And Manufacturing Method Of Semiconductor Device Using The Same App 20070190770 - Kurashima; Nobuyuki ; et al.	2007-08-16
Aqueous Dispersion For Cmp, Polishing Method And Method For Manufacturing Semiconductor Device App 20070128873 - MINAMIHABA; Gaku ; et al.	2007-06-07
Polishing method of Cu film and method for manufacturing semiconductor device App 20070093064 - Fukushima; Dai ; et al.	2007-04-26
CMP slurry and method of manufacturing semiconductor device Grant 7,198,729 - Kurashima , et al. April 3, 2	2007-04-03
Method for fabricating semiconductor device and polishing method App 20070072427 - Fukushima; Dai ; et al.	2007-03-29
Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices App 20070049180 - Shida; Hirotaka ; et al.	2007-03-01
Slurry for CMP, polishing method and method of manufacturing semiconductor device Grant 7,166,017 - Minamihaba , et al. January 23, 2	2007-01-23
Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor App 20070000872 - Matsui; Yukiteru ; et al.	2007-01-04
Semiconductor device fabrication method App 20060293191 - Fukushima; Dai ; et al.	2006-12-28
Semiconductor device and method of manufacturing the same Grant 7,144,804 - Minamihaba , et al. December 5, 2	2006-12-05
Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry Grant 7,138,073 - Minamihaba , et al. November 21, 2	2006-11-21
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device App 20060243702 - Minamihaba; Gaku ; et al.	2006-11-02
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20060197055 - Minamihaba; Gaku ; et al.	2006-09-07
Method of manufacturing semiconductor device App 20060175296 - Fukushima; Dai ; et al.	2006-08-10
Manufacturing method of a semiconductor device App 20060151888 - Kurashima; Nobuyuki ; et al.	2006-07-13
Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function Grant 7,071,108 - Matsui , et al. July 4, 2	2006-07-04
Semiconductor device and method for manufacturing the same App 20060131751 - Minamihaba; Gaku ; et al.	2006-06-22
Slurry for CMP, polishing method and method of manufacturing semiconductor device Grant 7,060,621 - Minamihaba , et al. June 13, 2	2006-06-13
Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device Grant 7,052,620 - Matsui , et al. May 30, 2	2006-05-30
Semiconductor device containing a dummy wire Grant 7,042,099 - Kurashima , et al. May 9, 2	2006-05-09
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20060030503 - Minamihaba; Gaku ; et al.	2006-02-09
Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device Grant 6,995,090 - Minamihaba , et al. February 7, 2	2006-02-07
Method of manufacturing semiconductor device App 20060012047 - Kurashima; Nobuyuki ; et al.	2006-01-19
Method of making semiconductor device by polishing with intermediate clean polishing Grant 6,984,582 - Fukushima , et al. January 10, 2	2006-01-10
Method of manufacturing semiconductor device App 20050266355 - Matsui, Yukiteru ; et al.	2005-12-01
Method of manufacturing semiconductor device App 20050218008 - Fukushima, Dai ; et al.	2005-10-06
Polishing apparatus and method for manufacturing semiconductor device App 20050205207 - Minamihaba, Gaku ; et al.	2005-09-22
Semiconductor device fabrication method and apparatus Grant 6,945,854 - Kurashima , et al. September 20, 2	2005-09-20
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Grant 6,935,928 - Uchikura , et al. August 30, 2	2005-08-30
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device Grant 6,924,227 - Minamihaba , et al. August 2, 2	2005-08-02
Post-CMP treating liquid and method for manufacturing semiconductor device App 20050118819 - Minamihaba, Gaku ; et al.	2005-06-02
Polishing apparatus, polishing method, and semiconductor device fabrication method App 20050118937 - Fukushima, Dai ; et al.	2005-06-02
Semiconductor device and method of manufacturing the same App 20050116348 - Minamihaba, Gaku ; et al.	2005-06-02
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20050118821 - Minamihaba, Gaku ; et al.	2005-06-02
Semiconductor device fabrication method and apparatus App 20050113001 - Kurashima, Nobuyuki ; et al.	2005-05-26
Method of manufacturing semiconductor device including two-step polishing operation for cap metal Grant 6,897,143 - Toyoda , et al. May 24, 2	2005-05-24
CMP slurry and method for manufacturing a semiconductor device Grant 6,896,590 - Minamihaba , et al. May 24, 2	2005-05-24
Method of manufacturing a semiconductor device App 20050106874 - Matsui, Yukiteru ; et al.	2005-05-19
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20050064796 - Minamihaba, Gaku ; et al.	2005-03-24
Semiconductor device having an improved construction in the interlayer insulating film Grant 6,858,936 - Minamihaba , et al. February 22, 2	2005-02-22
Post-CMP treating liquid and method for manufacturing semiconductor device Grant 6,858,539 - Minamihaba , et al. February 22, 2	2005-02-22
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method App 20050037693 - Uchikura, Kazuhito ; et al.	2005-02-17
Slurry for CMP, and method of manufacturing semiconductor device App 20050009322 - Matsui, Yukiteru ; et al.	2005-01-13
CMP slurry and method of manufacturing semiconductor device App 20050003666 - Kurashima, Nobuyuki ; et al.	2005-01-06
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20050003743 - Minamihaba, Gaku ; et al.	2005-01-06
Slurry for CMP, polishing method and method of manufacturing semiconductor device App 20040261323 - Minamihaba, Gaku ; et al.	2004-12-30
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device App 20040253822 - Matsui, Yukiteru ; et al.	2004-12-16
Slurry for CMP, and method of manufacturing semiconductor device Grant 6,794,285 - Matsui , et al. September 21, 2	2004-09-21
Process for fabricating a metal wiring and metal contact in a semicondutor device Grant 6,794,286 - Aoyama , et al. September 21, 2	2004-09-21
CMP slurry and method of manufacturing semiconductor device Grant 6,790,769 - Kurashima , et al. September 14, 2	2004-09-14
Slurry For Cmp, And Method Of Manufacturing Semiconductor Device App 20040161932 - Matsui, Yukiteru ; et al.	2004-08-19
Semiconductor device manufacturing method App 20040152318 - Fukushima, Dai ; et al.	2004-08-05
Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry App 20040152308 - Minamihaba, Gaku ; et al.	2004-08-05
Semiconductor device and its manufacturing method App 20040119164 - Kurashima, Nobuyuki ; et al.	2004-06-24
Aqueous Dispersion, Aqueous Dispersion For Chemical Mechanical Polishing Used For Manufacture Of Semiconductor Devices, Method For Manufacture Of Semiconductor Devices, And Method For Formation Of Embedded Writing Grant 6,740,590 - Yano , et al. May 25, 2	2004-05-25
Post-CMP treating liquid and method for manufacturing semiconductor device App 20040082180 - Minamihaba, Gaku ; et al.	2004-04-29
Semiconductor device and method of manufacturing the same App 20040070077 - Minamihaba, Gaku ; et al.	2004-04-15
Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper Grant 6,720,250 - Minamihaba , et al. April 13, 2	2004-04-13
Method of manufacturing semiconductor device and semiconductor device App 20040005774 - Toyoda, Hiroshi ; et al.	2004-01-08
Polishing apparatus, polishing method and method of manufacturing semiconductor device App 20040002292 - Fukushima, Dai ; et al.	2004-01-01
Aqueous dispersion for chemical mechanical polishing used for polishing of copper Grant 6,653,267 - Yano , et al. November 25, 2	2003-11-25
Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device App 20030173329 - Matsui, Yukiteru ; et al.	2003-09-18
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process App 20030165412 - Matsui, Yukiteru ; et al.	2003-09-04
Semiconductor device having a damascene type wiring layer Grant 6,611,060 - Toyoda , et al. August 26, 2	2003-08-26
Polishing slurry for use in CMPof SiC series compound, polishing method, and method of manufacturing semiconductor device App 20030124850 - Minamihaba, Gaku ; et al.	2003-07-03
Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry App 20030104699 - Minamihaba, Gaku ; et al.	2003-06-05
CMP slurry and method of manufacturing semiconductor device App 20030100186 - Kurashima, Nobuyuki ; et al.	2003-05-29
Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function App 20030022502 - Matsui, Yukiteru ; et al.	2003-01-30
CMP slurry and method for manufacturing a semiconductor device App 20030017786 - Minamihaba, Gaku ; et al.	2003-01-23
Semiconductor device and process of fabricating the same App 20020173116 - Apyama, Hisako ; et al.	2002-11-21
Slurry for CMP and CMP method App 20020148997 - Minamihaba, Gaku ; et al.	2002-10-17
Slurry for CMP and CMP method Grant 6,444,139 - Minamihaba , et al. September 3, 2	2002-09-03
Slurry for chemical mechanical polishing and method of manufacturing semiconductor device App 20020023389 - Minamihaba, Gaku ; et al.	2002-02-28
Aqueous dispersion for chemical mechanical polishing used for polishing of copper App 20020016275 - Yano, Hiroyuki ; et al.	2002-02-07
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process App 20020006728 - Matsui, Yukiteru ; et al.	2002-01-17
Semiconductor device having a wiring layer with a barrier layer Grant 5,592,024 - Aoyama , et al. January 7, 1	1997-01-07