Min; Yongki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Min; Yongki.The latest application filed is for "substrate integrated inductor".

Company Profile

9.29.46

Min; Yongki - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate integrated inductor with composite magnetic resin layer Grant 11,335,616 - Sankarasubramanian , et al. May 17, 2	2022-05-17
Substrate Integrated Inductor App 20210098326 - Sankarasubramanian; Malavarayan ; et al.	2021-04-01
Methods To Pattern Tfc And Incorporation In The Odi Architecture And In Any Build Up Layer Of Organic Substrate App 20200294938 - JAIN; Rahul ; et al.	2020-09-17
Magnetic small footprint inductor array module for on-package voltage regulator Grant 10,741,536 - Min , et al. A	2020-08-11
Magnetic Mold Material Inductors For Electronic Packages App 20200203470 - Dhane; Kedar ; et al.	2020-06-25
Magnetic Core/shell Particles For Inductor Arrays App 20200203067 - Sankarasubramanian; Malavarayan ; et al.	2020-06-25
Magnetic Solder Mask On Package Substrate Above Magnetic Inductor Array App 20200013533 - SANKARASUBRAMANIAN; Malavarayan ; et al.	2020-01-09
Magnetic Encapsulant For Package Magnetic Inductors App 20200005983 - SANKARASUBRAMANIAN; Malavarayan ; et al.	2020-01-02
Magnetic Small Footprint Inductor Array Module For On-package Voltage Regulator App 20190279973 - Min; Yongki ; et al.	2019-09-12
Magnetic small footprint inductor array module for on-package voltage regulator Grant 10,340,260 - Min , et al.	2019-07-02
Component stiffener architectures for microelectronic package structures Grant 10,157,860 - Karhade , et al. Dec	2018-12-18
Magnetic Small Footprint Inductor Array Module For On-package Voltage Regulator App 20180197845 - Min; Yongki ; et al.	2018-07-12
Component Stiffener Architectures For Microelectronic Package Structures App 20180182718 - Karhade; Omkar G. ; et al.	2018-06-28
Magnetic small footprint inductor array module for on-package voltage regulator Grant 9,911,723 - Min , et al. March 6, 2	2018-03-06
Magnetic Small Footprint Inductor Array Module For On-package Voltage Regulator App 20170179094 - Min; Yongki ; et al.	2017-06-22
Sol-gel And Mask Patterning For Thin-film Capacitor Fabrication, Thin-film Capacitors Fabricated Thereby, And Systems Containing Same App 20140111924 - SEH; Huankiat ; et al.	2014-04-24
Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same Grant 8,623,737 - Seh , et al. January 7, 2	2014-01-07
Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor Grant 8,618,593 - Salama , et al. December 31, 2	2013-12-31
Embedding thin film resistors in substrates in power delivery networks Grant 8,228,680 - Myat , et al. July 24, 2	2012-07-24
Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor Grant 8,143,697 - Seh , et al. March 27, 2	2012-03-27
Low Temperature Deposition And Ultra Fast Annealing Of Integrated Circuit Thin Film Capacitor App 20110304018 - Salama; Islam A. ; et al.	2011-12-15
Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor Grant 8,003,479 - Salama , et al. August 23, 2	2011-08-23
Systems and methods to laminate passives onto substrate Grant 7,981,758 - Seh , et al. July 19, 2	2011-07-19
Carbon nanotube coated capacitor electrodes Grant 7,983,020 - Min , et al. July 19, 2	2011-07-19
Systems And Methods To Laminate Passives Onto Substrate App 20110034002 - Seh; Huankiat ; et al.	2011-02-10
Systems and methods to laminate passives onto substrate Grant 7,838,419 - Seh , et al. November 23, 2	2010-11-23
Carbon nanotube coated capacitor electrodes App 20100177475 - Min; Yongki ; et al.	2010-07-15
Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same Grant 7,738,257 - Salama , et al. June 15, 2	2010-06-15
Passive device structure Grant 7,733,626 - Palanduz , et al. June 8, 2	2010-06-08
Embedding Thin Film Resistors in Substrates in Power Delivery Networks App 20100134992 - Myat; Myitzu Soe ; et al.	2010-06-03
Microelectronic package interconnect and method of fabrication thereof Grant 7,727,814 - Suh , et al. June 1, 2	2010-06-01
Carbon nanotube coated capacitor electrodes Grant 7,710,709 - Min , et al. May 4, 2	2010-05-04
Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same Grant 7,705,458 - Suh , et al. April 27, 2	2010-04-27
Pre-patterned thin film capacitor and method for embedding same in a package substrate Grant 7,687,366 - Min March 30, 2	2010-03-30
Method, Apparatus, And System For Low Temperature Deposition And Irradiation Annealing Of Thin Film Capacitor App 20090273057 - Seh; Huankiat ; et al.	2009-11-05
Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same Grant 7,588,992 - Min September 15, 2	2009-09-15
Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor Grant 7,572,709 - Seh , et al. August 11, 2	2009-08-11
Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method Grant 7,553,738 - Min , et al. June 30, 2	2009-06-30
Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength Grant 7,525,140 - Min , et al. April 28, 2	2009-04-28
Microelectronic package interconnect and method of fabrication thereof App 20090068830 - Suh; Daewoong ; et al.	2009-03-12
Method of providing a pre-patterned high-k dielectric film Grant 7,435,675 - Seh , et al. October 14, 2	2008-10-14
Carbon Nanotube Coated Capacitor Electrodes App 20080239620 - Min; Yongki ; et al.	2008-10-02
Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same Grant 7,416,938 - Seh , et al. August 26, 2	2008-08-26
Microelectronic package interconnect and method of fabrication thereof Grant 7,402,909 - Suh , et al. July 22, 2	2008-07-22
System and methods to laminate passives onto substrate App 20080148560 - Seh; Huankiat ; et al.	2008-06-26
Microelectronic Device Including Bridging Interconnect To Top Conductive Layer Of Passive Embedded Structure And Method Of Making Same App 20080142253 - Salama; Islam ; et al.	2008-06-19
Polymer-based Integrated Thin Film Capacitors, Packages Containing Same And Methods Related Thereto App 20080145622 - Roy; Mihir K. ; et al.	2008-06-19
Method Of Fabricating A Microelectronic Device Includling Embedded Thin Film Capacitor By Over-etching Thin Film Capacitor Bottom Electrode And Microelectronic Device Made According To The Method App 20080137263 - Min; Yongki ; et al.	2008-06-12
Method of providing a pre-patterned high-k dielectric film App 20080003764 - Seh; Huankiat ; et al.	2008-01-03
Method, Apparatus, And System For Low Temperature Deposition And Irradiation Annealing Of Thin Film Capacitor App 20080003765 - Seh; Huankiat ; et al.	2008-01-03
Bulk Metallic Glass Solders, Foamed Bulk Metallic Glass Solders, Foamed-solder Bond Pads In Chip Packages, Methods Of Assembling Same, And Systems Containing Same App 20070290339 - Suh; Daewoong ; et al.	2007-12-20
Passive device structure App 20070271752 - Palanduz; Cengiz A. ; et al.	2007-11-29
Method for making a passive device structure Grant 7,290,315 - Palanduz , et al. November 6, 2	2007-11-06
Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same App 20070242414 - Seh; Huankiat ; et al.	2007-10-18
Room Temperature Joining Process With Piezoelectric Ceramic-activated Reactive Multilayer Foil App 20070235500 - Suh; Daewoong ; et al.	2007-10-11
Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same App 20070228517 - Seh; Huankiat ; et al.	2007-10-04
Low Temperature Deposition And Ultra Fast Annealing Of Integrated Circuit Thin Film Capacitor App 20070222030 - Salama; Islam A. ; et al.	2007-09-27
Method of providing a via opening in a dielectric film of a thin film capacitor App 20070202655 - Min; Yongki	2007-08-30
Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength App 20070132063 - Min; Yongki ; et al.	2007-06-14
Pre-patterned thin film capacitor and method for embedding same in a package substrate App 20070065973 - Min; Yongki	2007-03-22
Pre-patterned thin film capacitor and method for embedding same in a package substrate App 20060289976 - Min; Yongki	2006-12-28
Embedding thin film resistors in substrates in power delivery networks App 20060291174 - Myat; Myitzu Soe ; et al.	2006-12-28
Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same App 20060281278 - Min; Yongki	2006-12-14
Microelectronic package interconnect and method of fabrication thereof App 20060243958 - Suh; Daewoong ; et al.	2006-11-02
Capacitor with co-planar electrodes App 20060228855 - Min; Yongki ; et al.	2006-10-12
IC package with prefabricated film capacitor App 20060220167 - Min; Yongki ; et al.	2006-10-05
Electronic substrates with thin-film resistors coupled to one or more relatively thick traces App 20060176145 - Min; Yongki ; et al.	2006-08-10
Thin film capacitor App 20060099803 - Min; Yongki	2006-05-11
Passive device structure App 20060097246 - Palanduz; Cengiz A. ; et al.	2006-05-11
Ceramic thin film on base metal electrode App 20060091495 - Palanduz; Cengiz A. ; et al.	2006-05-04
Metal Oxide Ceramic Thin Film On Base Metal Electrode App 20060000542 - Min; Yongki ; et al.	2006-01-05

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