| Patent | Date |
|---|
Electronic Component-embedded Substrate
App 20220301975 - HAM; Ho Hyung ; et al. | 2022-09-22 |
Printed circuit board and antenna module comprising the same
Grant 11,445,598 - Min , et al. September 13, 2 | 2022-09-13 |
Antenna module
Grant 11,437,724 - Min September 6, 2 | 2022-09-06 |
Printed circuit board and antenna module comprising the same
Grant 11,394,104 - Min July 19, 2 | 2022-07-19 |
Printed Circuit Board
App 20220095449 - BYUN; Dae Jung ; et al. | 2022-03-24 |
Printed Circuit Board And Antenna Module Comprising The Same
App 20210399408 - MIN; Tae Hong | 2021-12-23 |
Printed Circuit Board And Antenna Module Comprising The Same
App 20210329777 - MIN; Tae Hong ; et al. | 2021-10-21 |
Antenna Module
App 20210305699 - Min; Tae Hong | 2021-09-30 |
Printed circuit board and package having the same
Grant 11,122,694 - Min , et al. September 14, 2 | 2021-09-14 |
Semiconductor Package Having A High Reliability
App 20210280564 - HWANG; JI-HWAN ; et al. | 2021-09-09 |
Printed circuit board
Grant 11,057,993 - Min July 6, 2 | 2021-07-06 |
Semiconductor package having a high reliability
Grant 11,018,115 - Hwang , et al. May 25, 2 | 2021-05-25 |
Printed circuit board
Grant 10,952,316 - Min , et al. March 16, 2 | 2021-03-16 |
Printed Circuit Board And Antenna Module Comprising The Same
App 20210076492 - Min; Tae Hong ; et al. | 2021-03-11 |
Semiconductor package having recessed adhesive layer between stacked chips
Grant 10,930,613 - Park , et al. February 23, 2 | 2021-02-23 |
Printed Circuit Board
App 20210022243 - Min; Tae Hong | 2021-01-21 |
Printed Circuit Board
App 20210014964 - Min; Tae Hong ; et al. | 2021-01-14 |
Printed Circuit Board
App 20200383208 - CHOI; Jungwoo ; et al. | 2020-12-03 |
Inductor and method of manufacturing the same
Grant 10,847,300 - Choi , et al. November 24, 2 | 2020-11-24 |
Semiconductor Package Having A High Reliability
App 20200219853 - Hwang; Ji-Hwan ; et al. | 2020-07-09 |
Printed Circuit Board And Package Having The Same
App 20200178401 - MIN; Tae-Hong ; et al. | 2020-06-04 |
Printed Circuit Board And Package Including Printed Circuit Board
App 20200178389 - MIN; Tae-Hong ; et al. | 2020-06-04 |
Printed Circuit Board
App 20200163228 - LEE; Sa-Yong ; et al. | 2020-05-21 |
Semiconductor packages
Grant 10,651,154 - Park , et al. | 2020-05-12 |
Semiconductor package having a high reliability
Grant 10,622,335 - Hwang , et al. | 2020-04-14 |
Semiconductor Package And Method Of Manufacturing The Same
App 20200098719 - PARK; Sang Sick ; et al. | 2020-03-26 |
Semiconductor device including multiple semiconductor chips
Grant 10,497,675 - Kwak , et al. De | 2019-12-03 |
Circuit board and manufacturing method thereof
Grant 10,362,667 - Min , et al. | 2019-07-23 |
Inductor Device And Method Of Manufacturing The Same
App 20190139696 - KIM; In-Seok ; et al. | 2019-05-09 |
Semiconductor Package Having A High Reliability
App 20190096856 - Hwang; Ji-Hwan ; et al. | 2019-03-28 |
Circuit board and circuit board assembly
Grant 10,212,803 - Min , et al. Feb | 2019-02-19 |
Semiconductor package having a high reliability
Grant 10,153,255 - Hwang , et al. Dec | 2018-12-11 |
Semiconductor Packages
App 20180331076 - PARK; Sang-Sick ; et al. | 2018-11-15 |
Electronic component package and package-on-package structure including the same
Grant 10,109,588 - Jeong , et al. October 23, 2 | 2018-10-23 |
Semiconductor packages
Grant 10,090,278 - Park , et al. October 2, 2 | 2018-10-02 |
Circuit board and manufacturing method thereof
Grant 10,064,291 - Min , et al. August 28, 2 | 2018-08-28 |
Semiconductor device having stacked semiconductor chips interconnected via TSV
Grant 10,020,290 - Choe , et al. July 10, 2 | 2018-07-10 |
Circuit board comprising heat transfer structure
Grant 10,015,877 - Min , et al. July 3, 2 | 2018-07-03 |
Circuit board and assembly thereof
Grant 9,992,865 - Min , et al. June 5, 2 | 2018-06-05 |
Inductor And Method Of Manufacturing The Same
App 20180130595 - Choi; Jung Woo ; et al. | 2018-05-10 |
Multilayer Electronic Component And Method Of Manufacturing The Same
App 20180122555 - KIM; Ki Seok ; et al. | 2018-05-03 |
Apparatus and method for measuring impedance for fuel cell diagnosis
Grant 9,945,911 - Min April 17, 2 | 2018-04-17 |
Coil component and method of manufacturing the same
Grant 9,899,136 - Lee , et al. February 20, 2 | 2018-02-20 |
Circuit board
Grant 9,832,856 - Min , et al. November 28, 2 | 2017-11-28 |
Coil Component And Method Of Manufacturing The Same
App 20170330674 - LEE; Sa Yong ; et al. | 2017-11-16 |
Semiconductor Device Having Stacked Semiconductor Chips Interconnected Via TSV
App 20170330862 - CHOE; Yeong-Hwan ; et al. | 2017-11-16 |
Circuit Board And Manufacturing Method Thereof
App 20170251548 - MIN; Tae-Hong ; et al. | 2017-08-31 |
Semiconductor Packages
App 20170243856 - PARK; Sang-Sick ; et al. | 2017-08-24 |
Semiconductor Package Having A High Reliability
App 20170243857 - HWANG; JI-HWAN ; et al. | 2017-08-24 |
Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same
Grant 9,721,926 - Choe , et al. August 1, 2 | 2017-08-01 |
Circuit board including heat dissipation structure
Grant 9,699,885 - Min , et al. July 4, 2 | 2017-07-04 |
Semiconductor Device
App 20170162544 - KWAK; Byoung Soo ; et al. | 2017-06-08 |
Circuit board
Grant 9,655,229 - Min , et al. May 16, 2 | 2017-05-16 |
Printed Circuit Board And Method For Manufacturing The Same
App 20170094773 - SEO; Il-Jong ; et al. | 2017-03-30 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20170086299 - KANG; Myung-Sam ; et al. | 2017-03-23 |
Semiconductor packages and methods of manufacturing the same
Grant 9,589,947 - Hwang , et al. March 7, 2 | 2017-03-07 |
Chip-stacked semiconductor package
Grant 9,543,276 - Jee , et al. January 10, 2 | 2017-01-10 |
Electronic Component Package And Package-on-package Structure Including The Same
App 20160336296 - JEONG; Sung Won ; et al. | 2016-11-17 |
Circuit Board And Circuit Board Assembly
App 20160309575 - MIN; Tae Hong ; et al. | 2016-10-20 |
Circuit Board
App 20160302298 - MIN; Tae-Hong ; et al. | 2016-10-13 |
Inductor Device And Method Of Manufacturing The Same
App 20160293320 - Kim; In-Seok ; et al. | 2016-10-06 |
Circuit Board And Assembly Thereof
App 20160249457 - MIN; Tae-Hong ; et al. | 2016-08-25 |
Circuit Board And Manufacturing Method Thereof
App 20160249445 - MIN; Tae-Hong ; et al. | 2016-08-25 |
Circuit Board And Manufacturing Method Thereof
App 20160249450 - MIN; Tae-Hong ; et al. | 2016-08-25 |
Circuit Board And Manufacturing Method Thereof
App 20160192471 - MIN; Tae-Hong ; et al. | 2016-06-30 |
Circuit Board, Multilayered Substrate Having The Circuit Board And Method Of Manufacturing The Circuit Board
App 20160192488 - MIN; Tae-Hong ; et al. | 2016-06-30 |
Apparatus And Method For Measuring Impedance For Fuel Cell Diagnosis
App 20160169979 - Min; Tae Hong | 2016-06-16 |
Circuit Board And Method Of Manufacturing The Same
App 20160143132 - MIN; Tae-Hong ; et al. | 2016-05-19 |
Circuit Board
App 20160143129 - MIN; Tae-Hong ; et al. | 2016-05-19 |
Semiconductor package and method of manufacturing the same
Grant 9,324,683 - Min , et al. April 26, 2 | 2016-04-26 |
Circuit Board And Manufacturing Method Thereof
App 20160095202 - MIN; Tae Hong ; et al. | 2016-03-31 |
Circuit Board Including Heat Dissipation Structure
App 20160095198 - MIN; Tae Hong ; et al. | 2016-03-31 |
Circuit Board
App 20160095203 - MIN; Tae Hong ; et al. | 2016-03-31 |
Circuit Board Comprising Heat Transfer Structure
App 20160095201 - MIN; Tae Hong ; et al. | 2016-03-31 |
Semiconductor Device And Method Of Fabricating The Same
App 20160064357 - CHOE; Yeong-Hwan ; et al. | 2016-03-03 |
Chip-stacked Semiconductor Package
App 20160056101 - JEE; Young-kun ; et al. | 2016-02-25 |
Printed Circuit Board And Manufacturing Method Thereof
App 20160037620 - KANG; Myung Sam ; et al. | 2016-02-04 |
Chip Embedded Substrate And Method Of Manufacturing The Same
App 20160021755 - LEE; Jung Han ; et al. | 2016-01-21 |
Substrate Strip, Substrate Panel, And Manufacturing Method Of Substrate Strip
App 20150373842 - MIN; Tae Hong ; et al. | 2015-12-24 |
Core And Printed Circuit Board
App 20150373841 - CHO; Suk Hyeon ; et al. | 2015-12-24 |
Semiconductor device and method of manufacturing the same
Grant 9,202,767 - Kim , et al. December 1, 2 | 2015-12-01 |
Semiconductor device and method of forming the same
Grant 9,196,505 - Kang , et al. November 24, 2 | 2015-11-24 |
Printed Circuit Board, Printed Circuit Board Strip And Manufacturing Method Thereof
App 20150319852 - MIN; Tae Hong ; et al. | 2015-11-05 |
Embedded Board, Printed Circuit Board And Method Of Manufacturing The Same
App 20150223341 - KIM; Sang Hoon ; et al. | 2015-08-06 |
Method of manufacturing semiconductor device
Grant 9,099,541 - Kim , et al. August 4, 2 | 2015-08-04 |
Semiconductor packages and methods of fabricating the same
Grant 9,059,072 - Choi , et al. June 16, 2 | 2015-06-16 |
Method Of Manufacturing Glass Core
App 20150114553 - MIN; Tae Hong ; et al. | 2015-04-30 |
Multilayer Printed Circuit Board
App 20150107880 - KIM; Hye Jin ; et al. | 2015-04-23 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20150101851 - Ko; Young Gwan ; et al. | 2015-04-16 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20150093857 - HWANG; Jihwan ; et al. | 2015-04-02 |
Semiconductor Package And Method Of Manufacturing The Same
App 20150048493 - MIN; Tae-Hong ; et al. | 2015-02-19 |
Glass Core Substrate And Method For Manufacturing The Same
App 20150034377 - MIN; Tae Hong | 2015-02-05 |
Printed Circuit Board And Manufacture Method Thereof
App 20150021074 - KIM; Sang Hoon ; et al. | 2015-01-22 |
Core Of Printed Circuit Board And Method Of Manufacturing The Same
App 20140357147 - MIN; Tae Hong ; et al. | 2014-12-04 |
Heterojunction structures of different substrates joined and methods of fabricating the same
Grant 8,890,325 - Kang , et al. November 18, 2 | 2014-11-18 |
Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip
Grant 8,884,416 - Lee , et al. November 11, 2 | 2014-11-11 |
Multi-chip package and method of manufacturing the same
Grant 8,884,421 - Kang , et al. November 11, 2 | 2014-11-11 |
Semiconductor Packages And Methods Of Fabricating The Same
App 20140300004 - CHOI; Eun-Kyoung ; et al. | 2014-10-09 |
Image processing method and image processing apparatus
Grant 8,854,489 - Jang , et al. October 7, 2 | 2014-10-07 |
Semiconductor package
Grant 8,816,407 - Kim , et al. August 26, 2 | 2014-08-26 |
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
Grant 8,802,495 - Kim , et al. August 12, 2 | 2014-08-12 |
Stack package and semiconductor package including the same
Grant 8,791,562 - Lee , et al. July 29, 2 | 2014-07-29 |
Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same
Grant 8,778,776 - Choi , et al. July 15, 2 | 2014-07-15 |
Semiconductor packages and methods of fabricating the same
Grant 8,759,147 - Choi , et al. June 24, 2 | 2014-06-24 |
Printed Circuit Board And Method For Manufacturing The Same
App 20140151095 - Cho; Suk Hyeon ; et al. | 2014-06-05 |
Method Of Manufacturing Semiconductor Device
App 20140148007 - KIM; Ji Hwang ; et al. | 2014-05-29 |
Semiconductor Devices Having Through-via And Methods Of Fabricating The Same
App 20140141569 - JO; Chajea ; et al. | 2014-05-22 |
Multi-chip Package And Method Of Manufacturing The Same
App 20140110831 - KANG; Un-Byoung ; et al. | 2014-04-24 |
Semiconductor Packages, Methods Of Manufacturing The Same, And Semiconductor Package Structures Including The Same
App 20140038353 - KIM; Ji Hwang ; et al. | 2014-02-06 |
Printed Circuit Board And Method For Manufacturing The Same
App 20140027163 - MIN; TAE HONG ; et al. | 2014-01-30 |
Multi-chip package and method of manufacturing the same
Grant 8,633,579 - Kang , et al. January 21, 2 | 2014-01-21 |
Methods Of Treating A Device-substrate And Support-substrates Used Therein
App 20130330925 - MIN; Tae Hong ; et al. | 2013-12-12 |
Semiconductor device including a stack of semiconductor chips, underfill material and molding material
Grant 8,604,615 - Lee , et al. December 10, 2 | 2013-12-10 |
Method of forming semiconductor device
Grant 8,563,349 - Myung , et al. October 22, 2 | 2013-10-22 |
Semiconductor Device And Method Of Forming The Same
App 20130260551 - Kang; Un-Byoung ; et al. | 2013-10-03 |
Semiconductor Package
App 20130221493 - Kim; Jong-yeon ; et al. | 2013-08-29 |
Multi-layer TSV insulation and methods of fabricating the same
Grant 8,492,902 - Lee , et al. July 23, 2 | 2013-07-23 |
Semiconductor device and method of forming the same
Grant 8,450,856 - Kang , et al. May 28, 2 | 2013-05-28 |
Digital photographing apparatus, method of controlling the digital photographing apparatus, and recording medium storing program to implement the method
Grant 8,373,767 - Chang , et al. February 12, 2 | 2013-02-12 |
Semiconductor Packages And Methods Of Manufacuring The Same
App 20120280405 - HWANG; Jihwan ; et al. | 2012-11-08 |
Semiconductor Device And Method Of Manufacturing The Same
App 20120235305 - KIM; Ji-Hwang ; et al. | 2012-09-20 |
Semiconductor Device And Method Of Manufacturing The Same
App 20120228780 - Kim; Ji Hwang ; et al. | 2012-09-13 |
Semiconductor Package Including Connecting Member Having Controlled Content Ratio Of Gold
App 20120223433 - Jee; Young-kun ; et al. | 2012-09-06 |
Semiconductor Device And Method Of Fabricating The Same
App 20120193779 - Lee; Chung-Sun ; et al. | 2012-08-02 |
Semiconductor Package And Method Of Manufacturing The Same
App 20120175782 - Im; Yunhyeok ; et al. | 2012-07-12 |
Semiconductor Packages And Methods Of Fabricating The Same
App 20120171814 - CHOI; Eun-Kyoung ; et al. | 2012-07-05 |
Heterojunction Structures Of Different Substrates Joined And Methods Of Fabricating The Same
App 20120168792 - KANG; Un-Byoung ; et al. | 2012-07-05 |
Semiconductor Device and Method of Forming the Same
App 20120153498 - Kang; Un-Byoung ; et al. | 2012-06-21 |
Method Of Forming Semiconductor Device
App 20120156823 - MYUNG; Jong-Yun ; et al. | 2012-06-21 |
Semiconductor Package And Method Of Manufacturing The Same
App 20120139097 - JIN; JEONGGI ; et al. | 2012-06-07 |
Solar Cell Module And Method Of Manufacturing The Same
App 20120085393 - Cho; Young-Sang ; et al. | 2012-04-12 |
Solar Cell Module And Method Of Manufacturing The Same
App 20120085383 - Cho; Young-Sang ; et al. | 2012-04-12 |
Methods of Forming a Semiconductor Package Using a Seed Layer and Semiconductor Packages Formed Using the Same
App 20120083097 - Choi; Ju-il ; et al. | 2012-04-05 |
Multi-layer Tsv Insulation And Methods Of Fabricating The Same
App 20120074584 - LEE; Ho-Jin ; et al. | 2012-03-29 |
Multi-chip Package And Method Of Manufacturing The Same
App 20120049352 - KANG; Un-Byoung ; et al. | 2012-03-01 |
Image Processing Method And Image Processing Apparatus
App 20120038797 - Jang; Soon-geun ; et al. | 2012-02-16 |
Semiconductor Apparatus Having Through Vias
App 20120018885 - Lee; Go Eun ; et al. | 2012-01-26 |
Stack Package And Semiconductor Package Including The Same
App 20120018871 - LEE; Chung-sun ; et al. | 2012-01-26 |
Digital Photographing Apparatus, Method Of Controlling The Digital Photographing Apparatus, And Recording Medium Storing Program To Implement The Method
App 20100328482 - Chang; Soon-keun ; et al. | 2010-12-30 |
Lectin protein prepared from Korean marine crab Philyra pisum, process for preparing the same and the use thereof
Grant 7,015,313 - Kim , et al. March 21, 2 | 2006-03-21 |
Lectin protein prepared from korean marine crab philyra pisum, process for preparing the same and the use thereof
App 20040185428 - Kim, Ha-Hyung ; et al. | 2004-09-23 |
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