Min; Sung Sig

Patent Applications and Registrations

Patent applications and USPTO patent grants for Min; Sung Sig.The latest application filed is for "polymer alloy composition".

Company Profile

0.6.8

Min; Sung Sig - Seoul KR
MIN; Sung Sig - Uiwang-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polycarbonate resin compositions Grant 8,314,168 - Min , et al. November 20, 2	2012-11-20
Silicone impact modifier with high refractive index and method for preparing the same Grant 7,956,105 - Lee , et al. June 7, 2	2011-06-07
Polycarbonate resin composition and molded articles with the same Grant 7,943,692 - Lee , et al. May 17, 2	2011-05-17
Flame retardant polycarbonate resin composition having good impact, high heat resistance Grant 7,671,143 - Lee , et al. March 2, 2	2010-03-02
Polycarbonate resin composition and molded articles of the same Grant 7,635,735 - Seo , et al. December 22, 2	2009-12-22
Impact modifier for a polymer composition and method for preparing the same Grant 7,541,401 - Lee , et al. June 2, 2	2009-06-02
Polymer Alloy Composition App 20080269401 - LEE; Bong Jae ; et al.	2008-10-30
Silicone Impact Modifier with High Refractive Index and Method for Preparing the Same App 20080097007 - LEE; Han Su ; et al.	2008-04-24
Polycarbonate Resin Compositions App 20070213435 - Min; Sung Sig ; et al.	2007-09-13
Flame Retardant Polycarbonate Resin Composition Having Good Impact, High Heat Resistance App 20070155857 - LEE; Bong Jae ; et al.	2007-07-05
Thermoplastic resin composition with improved properties App 20070072995 - Kang; Tae Gon ; et al.	2007-03-29
Polycarbonate resin composition and molded articles of the same App 20070010620 - Seo; Kyung Hoon ; et al.	2007-01-11
Impact modifier for a polymer composition and method for preparing the same App 20060148946 - Lee; Han Su ; et al.	2006-07-06
Polycarbonate resin composition and molded articles with the same App 20060094820 - Lee; Bong Jae ; et al.	2006-05-04

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