Min; Hyun Sung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Min; Hyun Sung.The latest application filed is for "resin composition for semiconductor package, and prepreg and metal clad laminate using the same".

Company Profile

5.6.8

Min; Hyun Sung - Daejeon KR
MIN; Hyun Sung - B chcml KR
MIN, HYUN SUNG - SEOUL KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition for semiconductor package, prepreg and metal clad laminate using the same Grant 11,214,677 - Shim , et al. January 4, 2	2022-01-04
Resin composition for semiconductor package, prepreg, and metal clad laminate using the same Grant 11,091,630 - Shim , et al. August 17, 2	2021-08-17
Resin composition for semiconductor package, and prepreg and metal clad laminate using the same Grant 10,913,849 - Shim , et al. February 9, 2	2021-02-09
Resin Composition For Semiconductor Package, And Prepreg And Metal Clad Laminate Using The Same App 20200231804 - SHIM; Chang Bo ; et al.	2020-07-23
Resin Composition For Semiconductor Package, Prepreg And Metal Clad Laminate Using The Same App 20190276661 - SHIM; Chang Bo ; et al.	2019-09-12
Resin Composition For Semiconductor Package, Prepreg, And Metal Clad Laminate Using The Same App 20190270881 - SHIM; Chang Bo ; et al.	2019-09-05
Thermosetting resin composition for semiconductor package and prepreg using the same Grant 10,294,341 - Moon , et al.	2019-05-21
Thermosetting resin composition for semiconductor package and prepreg using the same App 20180148555 - MOON; Hwa Yeon ; et al.	2018-05-31
Thermosetting Resin Composition For Semiconductor Package And Prepreg And Metal Clad Laminate Using The Same App 20160369099 - MOON; Hwa Yeon ; et al.	2016-12-22
Thermosetting resin composition and prepreg and metal clad laminate using the same Grant 9,278,505 - Shim , et al. March 8, 2	2016-03-08
Thermosetting Resin Composition And Prepreg And Metal Clad Laminate Using The Same App 20130319609 - Shim; Hee-Yong ; et al.	2013-12-05
Process For Preparing Toughened Thermosetting Structural Materials App 20020147283 - KIM, SUNG CHUL ; et al.	2002-10-10

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