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name:-0.0038988590240479
name:-0.0031008720397949
name:-0.0047378540039062
Min; Byungkwan Patent Filings

Min; Byungkwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Min; Byungkwan.The latest application filed is for "seamless textile covered enclosure".

Company Profile
4.5.4
  • Min; Byungkwan - Kirkland WA
  • Min; Byungkwan - Bellevue WA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Computing device
Grant D962,939 - Escolin , et al. September 6, 2
2022-09-06
Computing device
Grant D962,938 - Escolin , et al. September 6, 2
2022-09-06
Computing device
Grant D962,237 - Escolin , et al. August 30, 2
2022-08-30
Seamless Textile Covered Enclosure
App 20210337689 - PANAY; Panos Costa ;   et al.
2021-10-28
Pattern for increased coefficient of friction of input devices
Grant 10,592,006 - Escolin , et al.
2020-03-17
Self-retaining device assemblies
Grant 10,499,142 - McClary , et al. De
2019-12-03
Near-net Forging Of Cast Metal Part
App 20190351475 - YAO; Zhicong ;   et al.
2019-11-21
Self-retaining Device Assemblies
App 20190349668 - MCCLARY; Gary Russell ;   et al.
2019-11-14
Pattern For Increased Coefficient Of Friction Of Input Devices
App 20180203529 - ESCOLIN; Timothy Mathew G. ;   et al.
2018-07-19

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