MIN; Byoung-Youl

Patent Applications and Registrations

Patent applications and USPTO patent grants for MIN; Byoung-Youl.The latest application filed is for "method of manufacturing a printed circuit board having embedded electronic components".

Company Profile

0.18.30

MIN; Byoung-Youl - Seongnam-si KR
Min; Byoung Youl - Gyunggi-do KR
Min; Byoung Youl - Seoul KR
Min; Byoung Youl - Kyunggi-do KR
Min; Byoung Youl - Gyeonggi-do KR
Min; Byoung-Youl - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Manufacturing A Printed Circuit Board Having Embedded Electronic Components App 20130042472 - LEE; Doo-Hwan ; et al.	2013-02-21
Carrier Member For Transmitting Circuits, Coreless Printed Circuit Board Using The Carrier Member, And Method Of Manufacturing The Same App 20120073865 - Kang; Myung Sam ; et al.	2012-03-29
Adhesive on wire stacked semiconductor package Grant 8,143,727 - Oh , et al. March 27, 2	2012-03-27
Fabricating method for printed circuit board Grant 8,065,797 - Watanabe , et al. November 29, 2	2011-11-29
Method of manufacturing heat radiation substrate having metal core Grant 8,061,025 - Cho , et al. November 22, 2	2011-11-22
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same Grant 8,022,311 - Kim , et al. September 20, 2	2011-09-20
Method of manufacturing heat radiation substrate having metal core App 20110115121 - Cho; Seung Hyun ; et al.	2011-05-19
Adhesive On Wire Stacked Semiconductor Package App 20110089564 - Oh; Kwang Seok ; et al.	2011-04-21
Printed circuit board including embedded capacitor and method of fabricating same Grant 7,888,599 - Kim , et al. February 15, 2	2011-02-15
Heat radiation substrate having metal core and method of manufacturing the same Grant 7,875,340 - Cho , et al. January 25, 2	2011-01-25
Adhesive on wire stacked semiconductor package Grant 7,863,723 - Oh , et al. January 4, 2	2011-01-04
Manufacturing method of bottom substrate of package App 20100255634 - Park; Jung-Hyun ; et al.	2010-10-07
Method of manufacturing a printed circuit board having embedded electronic components App 20100154210 - Lee; Doo-Hwan ; et al.	2010-06-24
Printed circuit board having embedded electronic components and manufacturing method thereof Grant 7,697,301 - Lee , et al. April 13, 2	2010-04-13
Printed Circuit Board With Embedded Capacitors Therein, And Process For Manufacturing The Same App 20090325105 - Lee; Seok-Kyu ; et al.	2009-12-31
Heat radiation substrate having metal core and method of manufacturing the same App 20090297801 - Cho; Seung Hyun ; et al.	2009-12-03
Printed circuit board with embedded capacitors therein, and process for manufacturing the same Grant 7,570,491 - Lee , et al. August 4, 2	2009-08-04
Adhesive on wire stacked semiconductor package App 20090134507 - Oh; Kwang Seok ; et al.	2009-05-28
Method of forming a stacked semiconductor package Grant 7,485,490 - Oh , et al. February 3, 2	2009-02-03
Printed Circuit Board Including Embedded Capacitor And Method Of Fabricating Same App 20080314863 - Kim; Young Woo ; et al.	2008-12-25
Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same App 20080264684 - Kang; Myung Sam ; et al.	2008-10-30
Method for manufacturing circuit board App 20080251494 - Park; Jung-Hyun ; et al.	2008-10-16
Printed circuit board including embedded capacitor and method of fabricating same Grant 7,435,911 - Kim , et al. October 14, 2	2008-10-14
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same App 20080212299 - Kim; Tae Eui ; et al.	2008-09-04
Printed circuit board having axially parallel via holes Grant 7,408,120 - Kim , et al. August 5, 2	2008-08-05
Method of manufacturing printed circuit board App 20080115355 - Park; Jung-Hyun ; et al.	2008-05-22
Fabricating method for printed circuit board App 20080052905 - Watanabe; Ryoichi ; et al.	2008-03-06
Printed circuit board with embedded capacitors and manufacturing method thereof Grant 7,326,858 - Lee , et al. February 5, 2	2008-02-05
Bottom substrate of package on package and manufacturing method thereof App 20080006942 - Park; Jung-Hyun ; et al.	2008-01-10
Printed circuit board and method of manufacturing the same App 20080000680 - Cho; Suk Hyeon ; et al.	2008-01-03
Printed circuit board for package of electronic components and manufacturing method thereof App 20070290344 - Kang; Myung-Sam ; et al.	2007-12-20
Printed circuit board having embedded electronic components and manufacturing method thereof App 20070132536 - Lee; Doo-Hwan ; et al.	2007-06-14
Printed circuit board having three-dimensional spiral inductor and method of fabricating same Grant 7,170,384 - Kim , et al. January 30, 2	2007-01-30
Method for manufacturing electronic component-embedded printed circuit board App 20060258053 - Lee; Doo Hwan ; et al.	2006-11-16
Printed circuit board with embedded capacitors therein, and process for manufacturing the same Grant 7,092,237 - Lee , et al. August 15, 2	2006-08-15
Printed circuit board including embedded capacitor and method of fabricating same App 20060144617 - Kim; Young Woo ; et al.	2006-07-06
Printed circuit board having three-dimensional spiral inductor and method of fabricating same App 20060145805 - Kim; Han ; et al.	2006-07-06
Method of forming a stacked semiconductor package App 20060071315 - Oh; Kwang Seok ; et al.	2006-04-06
Printed circuit board with embedded capacitors therein, and process for manufacturing the same App 20050199681 - Lee, Seok-Kyu ; et al.	2005-09-15
Printed circuit board having axially parallel via holes App 20050178585 - Kim, Young Woo ; et al.	2005-08-18
Printed circuit board with embedded capacitors therein, and process for manufacturing the same Grant 6,910,266 - Lee , et al. June 28, 2	2005-06-28
Printed circuit board with embedded capacitors and manufacturing method thereof App 20040118602 - Lee, Seok-Kyu ; et al.	2004-06-24
Printed circuit board with embedded capacitors therein, and process for manufacturing the same App 20040118600 - Lee, Seok-Kyu ; et al.	2004-06-24
Printed circuit board with embedded capacitors therein, and process for manufacturing the same App 20040121266 - Lee, Seok-Kyu ; et al.	2004-06-24
Stacking structure of semiconductor chips and semiconductor package using it App 20020125556 - Oh, Kwang Seok ; et al.	2002-09-12
Exchangeable membrane probe testing of circuits Grant 5,841,291 - Liu , et al. November 24, 1	1998-11-24
Membrane probing of circuits Grant 5,623,213 - Liu , et al. April 22, 1	1997-04-22

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