Min; Byoung-jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Min; Byoung-jun.The latest application filed is for "semiconductor test apparatus".

Company Profile

0.5.6

Min; Byoung-jun - Asan-si KR
Min; Byoung-jun - Chungcheongnam KR
Min, Byoung-Jun - Cheonan-city KR
Min; Byoung-jun - Ahsan KR
MIN, BYOUNG JUN - CHUNGCHEONGNAM-DO KR
Min, Byoung-jun - Ahsan-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor test apparatus Grant 10,120,016 - Lee , et al. November 6, 2	2018-11-06
Semiconductor Test Apparatus App 20170102427 - LEE; Dong-young ; et al.	2017-04-13
Contact Structure For A Test Handler, Test Handler Having The Contact Structure And Method Of Testing Integrated Circuit Devices Using The Test Handler App 20160061884 - CHO; Jung-Hyun ; et al.	2016-03-03
Test socket, and test apparatus with test socket to control a temperature of an object to be tested Grant 8,564,317 - Han , et al. October 22, 2	2013-10-22
Test kit for semiconductor package and method for testing semiconductor package using the same Grant 7,017,428 - Min , et al. March 28, 2	2006-03-28
Integrated monitoring burn-in test method for multi-chip package App 20040145387 - Yun, Geum-Jin ; et al.	2004-07-29
Test kit for semiconductor package and method for testing semiconductor package using the same App 20040112142 - Min, Byoung-Jun ; et al.	2004-06-17
Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith Grant 6,462,534 - Kang , et al. October 8, 2	2002-10-08
Socket, Circuit Board, And Sub-circuit Board For Semiconductor Integrated Circuit Device App 20020037672 - MIN, BYOUNG JUN ; et al.	2002-03-28
Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith App 20010026152 - Kang, Seong-goo ; et al.	2001-10-04

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