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name:-0.013658046722412
name:-0.00047898292541504
Mimura; Yoshiki Patent Filings

Mimura; Yoshiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mimura; Yoshiki.The latest application filed is for "process for curing of a resist which has been applied to a large substrate, and device for carrying out of the process".

Company Profile
0.9.3
  • Mimura; Yoshiki - Yokohama JP
  • Mimura, Yoshiki - Kanagawa-ken JP
  • Mimura, Yoshiki - Yokohama-shi JP
  • Mimura; Yoshiki - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device for exposure of a peripheral area of a film circuit board
Grant 6,700,643 - Mimura , et al. March 2, 2
2004-03-02
Apparatus for curing resist
Grant 6,605,814 - Tadika , et al. August 12, 2
2003-08-12
Process for curing of a resist which has been applied to a large substrate, and device for carrying out of the process
App 20030096196 - Mimura, Yoshiki ;   et al.
2003-05-22
Heat treatment device of the light irradiation type and heat treatment process of the irradiation type
App 20030068903 - Suzuki, Shinji ;   et al.
2003-04-10
Device for exposure of a peripheral area of a film circuit board
App 20020085191 - Mimura, Yoshiki ;   et al.
2002-07-04
Process for exposing a peripheral area of a wafer and a device for executing the process
Grant 5,929,976 - Shibuya , et al. July 27, 1
1999-07-27
Heating method of semiconductor wafer
Grant 4,571,486 - Arai , et al. February 18, 1
1986-02-18
Flashlight-radiant apparatus
Grant 4,567,352 - Mimura , et al. January 28, 1
1986-01-28
Heater assembly and a heat-treatment method of semiconductor wafer using the same
Grant 4,535,228 - Mimura , et al. August 13, 1
1985-08-13
Light-radiant heating furnace
Grant 4,511,788 - Arai , et al. April 16, 1
1985-04-16
Method for heating semiconductor wafers by a light-radiant heating furnace
Grant 4,493,977 - Arai , et al. January 15, 1
1985-01-15
Method for heating semiconductor wafer by means of application of radiated light with supplemental circumferential heating
Grant 4,469,529 - Mimura September 4, 1
1984-09-04

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