loadpatents
Patent applications and USPTO patent grants for Mimura; Toshinori.The latest application filed is for "soldering apparatus".
Patent | Date |
---|---|
Soldering apparatus Grant 8,590,765 - Yoshino , et al. November 26, 2 | 2013-11-26 |
Soldering Apparatus App 20120024938 - Yoshino; Shinji ;   et al. | 2012-02-02 |
Jet Soldering Device And Soldering Method App 20110303737 - Mimura; Toshinori ;   et al. | 2011-12-15 |
Viscous material application apparatus Grant 7,464,838 - Mimura , et al. December 16, 2 | 2008-12-16 |
Printing screen cleaning method and apparatus Grant 7,032,513 - Onishi , et al. April 25, 2 | 2006-04-25 |
Solder paste printing apparatus and printing method Grant 6,935,232 - Onishi , et al. August 30, 2 | 2005-08-30 |
Solder paste printing apparatus and printing method Grant 6,923,117 - Onishi , et al. August 2, 2 | 2005-08-02 |
Viscous material application apparatus App 20040173633 - Mimura, Toshinori ;   et al. | 2004-09-09 |
Method and apparatus for applying viscous material Grant 6,772,937 - Mimura , et al. August 10, 2 | 2004-08-10 |
Solder past printing apparatus and printing method App 20040108368 - Onishi, Hiroaki ;   et al. | 2004-06-10 |
Viscous material application apparatus Grant 6,736,291 - Mimura , et al. May 18, 2 | 2004-05-18 |
Solder paste printing apparatus and printing method App 20040035306 - Onishi, Hiroaki ;   et al. | 2004-02-26 |
Method and apparatus for applying viscous material App 20020038814 - Mimura, Toshinori ;   et al. | 2002-04-04 |
Reflow apparatus and method Grant 5,472,135 - Taniguchi , et al. December 5, 1 | 1995-12-05 |
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