Mimura; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mimura; Seiichi.The latest application filed is for "multi-wire saw and method for cutting ingot".

Company Profile

0.9.5

Mimura; Seiichi - Chiyoda-ku JP
Mimura; Seiichi - Tokyo JP
Mimura; Seiichi - Kawagoe JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-wire saw and method for cutting ingot Grant 8,256,407 - Kawasaki , et al. September 4, 2	2012-09-04
Slurry for slicing silicon ingot and method for slicing silicon ingot using the same Grant 8,075,647 - Kawasaki , et al. December 13, 2	2011-12-13
Multi-wire Saw And Method For Cutting Ingot App 20100163009 - Kawasaki; Takafumi ; et al.	2010-07-01
Slurry For Slicing Silicon Ingot And Method For Slicing Silicon Ingot Using The Same App 20100037880 - Kawasaki; Takafumi ; et al.	2010-02-18
Multi-wire saw Grant 7,306,508 - Kawasaki , et al. December 11, 2	2007-12-11
Multi-wire saw App 20060249134 - Kawasaki; Takafumi ; et al.	2006-11-09
Thrust converter, method of controlling the same, and controller for controlling the same Grant 6,700,231 - Takamune , et al. March 2, 2	2004-03-02
Thrust converter, and method and apparatus for controlling thrust converter App 20020162409 - Ito, Hidenobu ; et al.	2002-11-07
Thrust Converter, Method Of Controlling The Same, And Controller For Controlling The Same App 20020158520 - Takamune, Kouichi ; et al.	2002-10-31
Method of manufacturing semiconductor device with copper core bumps Grant 5,433,822 - Mimura , et al. July 18, 1	1995-07-18
Resin encapsulated semiconductor device Grant 5,289,039 - Ishida , et al. * February 22, 1	1994-02-22
Resin encapsulated pin grid array and method of manufacturing the same Grant 5,233,225 - Ishida , et al. August 3, 1	1993-08-03
Method of making a resin encapsulated pin grid array with integral heatsink Grant 5,179,039 - Ishida , et al. * January 12, 1	1993-01-12
Method of making a resin encapsulated pin grid array with integral heatsink Grant 5,108,955 - Ishida , et al. April 28, 1	1992-04-28

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