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name:-0.012418985366821
name:-0.015668153762817
name:-0.00343918800354
Mimura; Kenji Patent Filings

Mimura; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mimura; Kenji.The latest application filed is for "insulating molded body and gas circuit breaker".

Company Profile
2.12.8
  • Mimura; Kenji - Chiyoda-ku JP
  • Mimura; Kenji - Tokyo JP
  • Mimura; Kenji - Asahi-ku Yokohama-shi JP
  • MIMURA, KENJI - KANAGAWA JP
  • Mimura; Kenji - Yokohama-shi Kanagawa 241 JP
  • Mimura; Kenji - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Insulating molded body and gas circuit breaker
Grant 11,322,322 - Hiza , et al. May 3, 2
2022-05-03
Insulating Molded Body And Gas Circuit Breaker
App 20200357587 - HIZA; Shuichi ;   et al.
2020-11-12
Thermosetting resin composition, method of producing thermal conductive sheet, and power module
Grant 10,351,728 - Takahara , et al. July 16, 2
2019-07-16
Heat conductive insulating sheet, power module, and manufacturing method thereof
Grant 10,177,068 - Mimura , et al. J
2019-01-08
Thermosetting Resin Composition, Method Of Producing Thermal Conductive Sheet, And Power Module
App 20160115343 - TAKAHARA; Mariko ;   et al.
2016-04-28
Heat Conductive Insulating Sheet, Power Module, And Manufacturing Method Thereof
App 20160013116 - MIMURA; Kenji ;   et al.
2016-01-14
Thermosetting resin composition, B-stage heat conductive sheet, and power module
Grant 9,029,438 - Yamamoto , et al. May 12, 2
2015-05-12
Thermosetting Resin Composition, B-stage Heat Conductive Sheet, And Power Module
App 20130012621 - Yamamoto; Kei ;   et al.
2013-01-10
Semiconductor device and process for producing same
Grant 8,236,666 - Hiramatsu , et al. August 7, 2
2012-08-07
Heat conductive sheet and method for producing same, and powder module
Grant 8,193,633 - Mimura , et al. June 5, 2
2012-06-05
Heat Conductive Sheet And Power Module
App 20100226095 - Mimura; Kenji ;   et al.
2010-09-09
Semiconductor Device And Process For Producing Same
App 20100201002 - Hiramatsu; Seiki ;   et al.
2010-08-12
Differential gear
Grant 7,204,778 - Mimura April 17, 2
2007-04-17
Transmission
App 20020042314 - MIMURA, KENJI
2002-04-11
Design evaluation method, equipment thereof, and goods design method
App 20010029341 - Mimura, Kenji
2001-10-11
Differential gear
Grant 6,120,407 - Mimura September 19, 2
2000-09-19
Rotary compressor
Grant 6,039,552 - Mimura March 21, 2
2000-03-21
Variable speed change gear
Grant 5,937,701 - Mimura August 17, 1
1999-08-17
Differential gear
Grant 5,897,453 - Mimura April 27, 1
1999-04-27

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