Mimata; Tsutomu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mimata; Tsutomu.The latest application filed is for "die pickup method and die pickup apparatus".
- Mimata; Tsutomu - Akiruno JP
- Mimata, Tsutomu - Akiruno-shi JP
- Mimata; Tsutomu - Akikawa JP
- Mimata; Tsutomu - Tokyo JA
| Patent | Date |
|---|---|
| Die packing device Grant 6,760,968 - Mimata , et al. July 13, 2 | 2004-07-13 |
| Die pickup method and die pickup apparatus App 20020129899 - Mimata, Tsutomu ; et al. | 2002-09-19 |
| Method and apparatus for processing semiconductor pellets App 20020062916 - Mimata, Tsutomu | 2002-05-30 |
| Die packing device and die bonding apparatus App 20020046460 - Mimata, Tsutomu ; et al. | 2002-04-25 |
| Method for manufacturing semiconductor devices App 20020037631 - Mimata, Tsutomu | 2002-03-28 |
| Conveyor apparatus for dies and small components App 20010051092 - Mimata, Tsutomu ; et al. | 2001-12-13 |
| Multi-chip bonding method and apparatus App 20010005602 - Mimata, Tsutomu ; et al. | 2001-06-28 |
| Method of aligning and bonding tab inner leads Grant 5,059,559 - Takahashi , et al. October 22, 1 | 1991-10-22 |
| Manufacturing apparatus Grant 5,015,425 - Mimata , et al. May 14, 1 | 1991-05-14 |
| Method and apparatus of bonding insulated and coated wire Grant 4,950,866 - Kojima , et al. August 21, 1 | 1990-08-21 |
| Manufacturing apparatus Grant 4,890,780 - Mimata , et al. January 2, 1 | 1990-01-02 |
| Manufacturing apparatus Grant 4,674,670 - Watanabe , et al. June 23, 1 | 1987-06-23 |
| Grinding method Grant 4,016,855 - Mimata April 12, 1 | 1977-04-12 |
| Bonding equipment and method of bonding Grant 3,918,144 - Mimata , et al. November 11, 1 | 1975-11-11 |
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