Milo; Dolores Babaran
Patent Applications and Registrations
Patent applications and USPTO patent grants for Milo; Dolores Babaran.The latest application filed is for "two sided bondable lead frame".
- Milo; Dolores Babaran - Baguio City PH
- Milo; Dolores Babaran - Baguio PH
| Patent | Date |
|---|---|
| Two Sided Bondable Lead Frame App 20220157700 - Milo; Dolores Babaran ; et al. | 2022-05-19 |
| Selective molding for integrated circuit Grant 11,239,130 - Milo , et al. February 1, 2 | 2022-02-01 |
| Package with shifted lead neck Grant 11,211,320 - Milo , et al. December 28, 2 | 2021-12-28 |
| Semiconductor Die Singulation App 20210249306 - Esteron; Connie Alagadan ; et al. | 2021-08-12 |
| Package With Shifted Lead Neck App 20210202365 - Milo; Dolores Babaran ; et al. | 2021-07-01 |
| Semiconductor device package with grooved substrate Grant 11,049,800 - Milo , et al. June 29, 2 | 2021-06-29 |
| Semiconductor die singulation Grant 10,991,621 - Esteron , et al. April 27, 2 | 2021-04-27 |
| Selective Molding For Integrated Circuit App 20210111086 - Milo; Dolores Babaran ; et al. | 2021-04-15 |
| Leadframe With Ground Pad Cantilever App 20210104471 - Rafael, JR.; Ernesto Pentecostes ; et al. | 2021-04-08 |
| Siderail with mold compound relief Grant 10,964,629 - Milo , et al. March 30, 2 | 2021-03-30 |
| Semiconductor Die Singulation App 20210043512 - Esteron; Connie Alagadan ; et al. | 2021-02-11 |
| QFN pin routing thru lead frame etching Grant 10,872,785 - Milo , et al. December 22, 2 | 2020-12-22 |
| Transport packaging and method for expanded wafers Grant 10,811,292 - Esteron , et al. October 20, 2 | 2020-10-20 |
| Siderail With Mold Compound Relief App 20200235043 - Milo; Dolores Babaran ; et al. | 2020-07-23 |
| Semiconductor Device Package With Grooved Substrate App 20200194350 - Milo; Dolores Babaran ; et al. | 2020-06-18 |
| Transport Packaging And Method For Expanded Wafers App 20200083076 - Esteron; Connie Alagadan ; et al. | 2020-03-12 |
| Semiconductor device package with grooved substrate Grant 10,573,583 - Milo , et al. Feb | 2020-02-25 |
| Lead Frame For A Die App 20200043833 - Milo; Dolores Babaran ; et al. | 2020-02-06 |
| Semiconductor Device Package With Grooved Substrate App 20190393138 - Milo; Dolores Babaran ; et al. | 2019-12-26 |
| Two Sided Bondable Lead Frame App 20190355651 - Milo; Dolores Babaran ; et al. | 2019-11-21 |
| Qfn Pin Routing Thru Lead Frame Etching App 20190348302 - MILO; Dolores Babaran ; et al. | 2019-11-14 |
| Integrated circuit (IC) chip socket Grant 10,439,313 - Milo , et al. O | 2019-10-08 |
| QFN pin routing thru lead frame etching Grant 10,361,098 - Milo , et al. | 2019-07-23 |
| Qfn Pin Routing Thru Lead Frame Etching App 20180182642 - MILO; Dolores Babaran ; et al. | 2018-06-28 |
| Integrated Circuit (ic) Chip Socket App 20180159259 - MILO; DOLORES BABARAN ; et al. | 2018-06-07 |
| Air Blow For Semiconductor Wafers In A Vacuum Semiconductor Wafer Laminator System App 20180076072 - ESTERON; Connie Alagadan ; et al. | 2018-03-15 |
| Structure and method for stabilizing leads in wire-bonded semiconductor devices Grant 9,824,959 - Milo , et al. November 21, 2 | 2017-11-21 |
| Structure And Method For Stabilizing Leads In Wire-bonded Semiconductor Devices App 20170278776 - Milo; Dolores Babaran ; et al. | 2017-09-28 |
| Angle referenced lead frame design Grant 9,761,536 - Milo , et al. September 12, 2 | 2017-09-12 |
| BGA spring probe pin design Grant 9,748,686 - Milo , et al. August 29, 2 | 2017-08-29 |
| Bga Spring Probe Pin Design App 20170237192 - Milo; Michael Flores ; et al. | 2017-08-17 |
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