Miller; Leah M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miller; Leah M..The latest application filed is for "removable protective cover".
- Miller; Leah M. - Avoca WI
- Miller; Leah M. - Fremont CA
| Patent | Date |
|---|---|
| Preventing damage with separators Grant 7,993,741 - Hartig , et al. August 9, 2 | 2011-08-09 |
| High speed interface design Grant 7,414,322 - Miller , et al. August 19, 2 | 2008-08-19 |
| Ball assignment system Grant 7,319,272 - Ramakrishnan , et al. January 15, 2 | 2008-01-15 |
| Scaling of functional assignments in packages Grant 7,298,036 - Miller , et al. November 20, 2 | 2007-11-20 |
| Removable Protective Cover App 20070231553 - Hartig; Klaus ; et al. | 2007-10-04 |
| Scaling of functional assignments in packages App 20070114644 - Miller; Leah M. ; et al. | 2007-05-24 |
| High speed interface design App 20070023930 - Miller; Leah M. ; et al. | 2007-02-01 |
| Ball assignment system App 20060223341 - Ramakrishnan; Arun ; et al. | 2006-10-05 |
| Routing structure for transceiver core Grant 7,062,742 - Miller June 13, 2 | 2006-06-13 |
| Designing a ball assignment for a ball grid array package Grant 7,051,434 - Miller , et al. May 30, 2 | 2006-05-30 |
| Multi-chip package having a contiguous heat spreader assembly Grant 6,963,129 - Evans , et al. November 8, 2 | 2005-11-08 |
| Multi chip module Grant 6,858,930 - Miller , et al. February 22, 2 | 2005-02-22 |
| Routing structure for transceiver core App 20040216071 - Miller, Leah M. | 2004-10-28 |
| Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate Grant 6,791,177 - Miller , et al. September 14, 2 | 2004-09-14 |
| Dual clock package option Grant 6,768,386 - Miller July 27, 2 | 2004-07-27 |
| Ball assignment for ball grid array package Grant 6,762,366 - Miller , et al. July 13, 2 | 2004-07-13 |
| Preventing damage with separators App 20040109982 - Hartig, Klaus ; et al. | 2004-06-10 |
| Isolated stripline structure Grant 6,744,130 - Miller , et al. June 1, 2 | 2004-06-01 |
| Multi chip module App 20040065951 - Miller, Leah M. ; et al. | 2004-04-08 |
| Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source Grant 6,701,270 - Miller , et al. March 2, 2 | 2004-03-02 |
| Multi chip module Grant 6,680,532 - Miller , et al. January 20, 2 | 2004-01-20 |
| Ball assignment for ball grid array package App 20030183419 - Miller, Leah M. ; et al. | 2003-10-02 |
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