Milke; Eugen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Milke; Eugen.The latest application filed is for "shaped parts having uniform mechanical properties, comprising solid metallic glass".

Company Profile

1.8.17

Milke; Eugen - Karlstein DE
Milke; Eugen - Hanau DE
Milke; Eugen - Nidderau DE
Milke; Eugen - Frankfurt DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Shaped Parts Having Uniform Mechanical Properties, Comprising Solid Metallic Glass App 20220161312 - Stolpe; Moritz ; et al.	2022-05-26
Injection molding system for the injection molding of amorphous metals Grant 11,318,649 - Bien , et al. May 3, 2	2022-05-03
Robust Ingot For The Production Of Components Made Of Metallic Solid Glasses App 20220118511 - Glaser; Tim ; et al.	2022-04-21
Copper-based alloy for the production of bulk metallic glasses Grant 11,214,854 - Busch , et al. January 4, 2	2022-01-04
Injection Molding System For The Injection Molding Of Amorphous Metals App 20210162641 - BIEN; Elena ; et al.	2021-06-03
Aluminum coated copper bond wire and method of making the same Grant 9,966,355 - Milke , et al. May 8, 2	2018-05-08
Process For Manufacturing Of A Thick Copper Wire For Bonding Applications App 20170200534 - MILKE; Eugen ; et al.	2017-07-13
Copper Bonding Wire With Angstrom ( ) Thick Surface Oxide Layer App 20170154863 - SARANGAPANI; Murali ; et al.	2017-06-01
Alloyed 2N copper wires for bonding in microelectronics devices Grant 9,589,694 - Sarangapani , et al. March 7, 2	2017-03-07
Coated Wire For Bonding Applications App 20160288272 - LUKAS; Annette ; et al.	2016-10-06
Aluminum alloy wire for bonding applications Grant 9,397,064 - Milke , et al. July 19, 2	2016-07-19
Copper Bond Wire And Method Of Making The Same App 20160078980 - SARANGAPANI; Murali ; et al.	2016-03-17
Core-jacket bonding wire Grant 9,236,166 - Milke , et al. January 12, 2	2016-01-12
Coated Wire For Bonding Applications App 20150360316 - MILKE; Eugen ; et al.	2015-12-17
Aluminum coated copper ribbon Grant 9,214,444 - Milke , et al. December 15, 2	2015-12-15
Aluminum Alloy Wire For Bonding Applications App 20150303165 - MILKE; Eugen ; et al.	2015-10-22
Aluminum Coated Copper Bond Wire And Method Of Making The Same App 20150155252 - Milke; Eugen ; et al.	2015-06-04
Aluminum Coated Copper Ribbon App 20150137390 - Milke; Eugen ; et al.	2015-05-21
Aluminum Coated Copper Bond Wire And Method Of Making The Same App 20150098170 - Milke; Eugen ; et al.	2015-04-09
Core-jacket Bonding Wire App 20130213689 - Milke; Eugen ; et al.	2013-08-22
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices App 20130140084 - SARANGAPANI; Murali ; et al.	2013-06-06
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics Devices App 20130140068 - SARANGAPANI; Murali ; et al.	2013-06-06
3n Copper Wires With Trace Additions For Bonding In Microelectronics Devices App 20130142568 - SARANGAPANI; Murali ; et al.	2013-06-06
Doped 4n Copper Wires For Bonding In Microelectronics Devices App 20130142567 - SARANGAPANI; Murali ; et al.	2013-06-06

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