Milewski; Joseph M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Milewski; Joseph M..The latest application filed is for "low temperature solder chip attach structure and process to produce a high temperature interconnection".
- Milewski; Joseph M. - Kirkwood NY
- Milewski; Joseph M. - Endicott NY
- Milewski; Joseph M. - Binghamton NY
- Milewski; Joseph M. - Philadelphia PA
| Patent | Date |
|---|---|
| Low temperature solder chip attach structure and process to produce a high temperature interconnection Grant 6,994,243 - Milewski , et al. February 7, 2 | 2006-02-07 |
| Low temperature solder chip attach structure and process to produce a high temperature interconnection App 20050109820 - Milewski, Joseph M. ; et al. | 2005-05-26 |
| Low temperature solder chip attach structure Grant 6,847,118 - Milewski , et al. January 25, 2 | 2005-01-25 |
| Low temperature solder chip attach structure App 20020036227 - Milewski, Joseph M. ; et al. | 2002-03-28 |
| Process to produce a high temperature interconnection Grant 6,330,967 - Milewski , et al. December 18, 2 | 2001-12-18 |
| Level shifting CMOS I/O buffer Grant 6,262,599 - Coughlin, Jr. , et al. July 17, 2 | 2001-07-17 |
| Electronic package structure and method of making same Grant 5,367,435 - Andros , et al. November 22, 1 | 1994-11-22 |
| Smoke alarm having temporary disabling features Grant 4,313,110 - Subulak , et al. January 26, 1 | 1982-01-26 |
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