loadpatents
name:-0.0003821849822998
name:-0.017328023910522
name:-0.00055193901062012
Miles; Barry M. Patent Filings

Miles; Barry M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miles; Barry M..The latest application filed is for "making solder ball mounting pads on substrates".

Company Profile
0.15.0
  • Miles; Barry M. - Chandler AZ
  • Miles; Barry M. - Plantation FL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Making solder ball mounting pads on substrates
Grant 6,201,305 - Darveaux , et al. March 13, 2
2001-03-13
Molded plastic ball grid array package
Grant 5,831,832 - Gillette , et al. November 3, 1
1998-11-03
Moisture relief for chip carriers
Grant 5,721,450 - Miles February 24, 1
1998-02-24
Low profile exposed die chip carrier package
Grant 5,696,666 - Miles , et al. December 9, 1
1997-12-09
Leadless integrated circuit package
Grant 5,535,101 - Miles , et al. July 9, 1
1996-07-09
Moisture relief for chip carrier
Grant 5,296,738 - Freyman , et al. March 22, 1
1994-03-22
Method for adhering polyimide to a substrate
Grant 5,198,264 - Altman , et al. March 30, 1
1993-03-30
Transfer molded semiconductor device package with integral shield
Grant 5,166,772 - Soldner , et al. November 24, 1
1992-11-24
Transfer molded semiconductor package with improved adhesion
Grant 5,153,385 - Juskey , et al. October 6, 1
1992-10-06
Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate
Grant 5,134,462 - Freyman , et al. July 28, 1
1992-07-28
Grounding an ultra high density pad array chip carrier
Grant 5,077,633 - Freyman , et al. December 31, 1
1991-12-31
Shielded electrical circuit
Grant 5,031,027 - Dorinski , et al. July 9, 1
1991-07-09
Flip-chip package for integrated circuits
Grant 5,019,673 - Juskey , et al. May 28, 1
1991-05-28
Fabrication of pad array carriers from a universal interconnect structure
Grant 5,006,673 - Freyman , et al. April 9, 1
1991-04-09
Pad grid array for receiving a solder bumped chip carrier
Grant 4,940,181 - Juskey, Jr. , et al. July 10, 1
1990-07-10

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