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Patent applications and USPTO patent grants for Miles; Barry M..The latest application filed is for "making solder ball mounting pads on substrates".
Patent | Date |
---|---|
Making solder ball mounting pads on substrates Grant 6,201,305 - Darveaux , et al. March 13, 2 | 2001-03-13 |
Molded plastic ball grid array package Grant 5,831,832 - Gillette , et al. November 3, 1 | 1998-11-03 |
Moisture relief for chip carriers Grant 5,721,450 - Miles February 24, 1 | 1998-02-24 |
Low profile exposed die chip carrier package Grant 5,696,666 - Miles , et al. December 9, 1 | 1997-12-09 |
Leadless integrated circuit package Grant 5,535,101 - Miles , et al. July 9, 1 | 1996-07-09 |
Moisture relief for chip carrier Grant 5,296,738 - Freyman , et al. March 22, 1 | 1994-03-22 |
Method for adhering polyimide to a substrate Grant 5,198,264 - Altman , et al. March 30, 1 | 1993-03-30 |
Transfer molded semiconductor device package with integral shield Grant 5,166,772 - Soldner , et al. November 24, 1 | 1992-11-24 |
Transfer molded semiconductor package with improved adhesion Grant 5,153,385 - Juskey , et al. October 6, 1 | 1992-10-06 |
Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate Grant 5,134,462 - Freyman , et al. July 28, 1 | 1992-07-28 |
Grounding an ultra high density pad array chip carrier Grant 5,077,633 - Freyman , et al. December 31, 1 | 1991-12-31 |
Shielded electrical circuit Grant 5,031,027 - Dorinski , et al. July 9, 1 | 1991-07-09 |
Flip-chip package for integrated circuits Grant 5,019,673 - Juskey , et al. May 28, 1 | 1991-05-28 |
Fabrication of pad array carriers from a universal interconnect structure Grant 5,006,673 - Freyman , et al. April 9, 1 | 1991-04-09 |
Pad grid array for receiving a solder bumped chip carrier Grant 4,940,181 - Juskey, Jr. , et al. July 10, 1 | 1990-07-10 |
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