| Patent | Date |
|---|
Two-dimensional structure to form an embedded three-dimensional structure
Grant 10,490,348 - Velez , et al. Nov | 2019-11-26 |
Varying thickness inductor
Grant 10,354,795 - Kim , et al. July 16, 2 | 2019-07-16 |
Substrate comprising an embedded inductor and a thin film magnetic core
Grant 10,290,414 - Yun , et al. | 2019-05-14 |
Tunable matching network
Grant 10,187,031 - Ma , et al. Ja | 2019-01-22 |
Double-sided circuit
Grant 10,103,703 - Yun , et al. October 16, 2 | 2018-10-16 |
Wafer level package (WLP) ball support using cavity structure
Grant 10,074,625 - Velez , et al. September 11, 2 | 2018-09-11 |
Encapsulation of acoustic resonator devices
Grant 10,069,474 - Yun , et al. September 4, 2 | 2018-09-04 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,966,426 - Mudakatte , et al. May 8, 2 | 2018-05-08 |
Frequency multiplexer
Grant 9,906,318 - Zuo , et al. February 27, 2 | 2018-02-27 |
LC filter layer stacking by layer transfer to make 3D multiplexer structures
Grant 9,876,513 - Yun , et al. January 23, 2 | 2018-01-23 |
Two-dimensional Structure To Form An Embedded Three-dimensional Structure
App 20170372831 - VELEZ; Mario Francisco ; et al. | 2017-12-28 |
Double-sided Circuit
App 20170338788 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Tunable Matching Network
App 20170331445 - Ma; Yunfei ; et al. | 2017-11-16 |
Lc Filter Layer Stacking By Layer Transfer To Make 3d Multiplexer Structures
App 20170288707 - YUN; Changhan Hobie ; et al. | 2017-10-05 |
Superposed structure 3D orthogonal through substrate inductor
Grant 9,666,362 - Berdy , et al. May 30, 2 | 2017-05-30 |
Acoustic Resonator Devices
App 20170141756 - Yun; Changhan Hobie ; et al. | 2017-05-18 |
Wafer Level Package (wlp) Ball Support Using Cavity Structure
App 20170084565 - VELEZ; Mario Francisco ; et al. | 2017-03-23 |
Augmented Capacitor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170077214 - MUDAKATTE; Niranjan Sunil ; et al. | 2017-03-16 |
Substrate Comprising An Embedded Inductor And A Thin Film Magnetic Core
App 20170062120 - Yun; Changhan Hobie ; et al. | 2017-03-02 |
Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package
App 20160381809 - KIM; Daeik Daniel ; et al. | 2016-12-29 |
Varying Thickness Inductor
App 20160358709 - Kim; Daeik Daniel ; et al. | 2016-12-08 |
Face-up substrate integration with solder ball connection in semiconductor package
Grant 9,468,098 - Kim , et al. October 11, 2 | 2016-10-11 |
Varying thickness inductor
Grant 9,449,753 - Kim , et al. September 20, 2 | 2016-09-20 |
High pass filters and low pass filters using through glass via technology
Grant 9,425,761 - Zuo , et al. August 23, 2 | 2016-08-23 |
Metal-insulator-metal (mim) Capacitors Arranged In A Pattern To Reduce Inductance, And Related Methods
App 20160181233 - Yun; Changhan Hobie ; et al. | 2016-06-23 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160163450 - BERDY; David Francis ; et al. | 2016-06-09 |
Stress mitigation structure for wafer warpage reduction
Grant 9,343,403 - Lan , et al. May 17, 2 | 2016-05-17 |
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
Grant 9,343,399 - Lan , et al. May 17, 2 | 2016-05-17 |
Composite dilation mode resonators
Grant 9,331,666 - Zuo , et al. May 3, 2 | 2016-05-03 |
Varactor Device With Backside Contact
App 20160093750 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
Grant 9,264,013 - Zuo , et al. February 16, 2 | 2016-02-16 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160020013 - BERDY; David Francis ; et al. | 2016-01-21 |
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
Grant 9,202,789 - Kim , et al. December 1, 2 | 2015-12-01 |
Die Package Comprising Die-to-wire Connector And A Wire-to-die Connector Configured To Couple To A Die Package
App 20150303148 - Kim; Daeik Daniel ; et al. | 2015-10-22 |
Frequency Multiplexer
App 20150304059 - Zuo; Chengjie ; et al. | 2015-10-22 |
Stress Mitigation Structure For Wafer Warpage Reduction
App 20150287677 - LAN; Je-Hsiung Jeffrey ; et al. | 2015-10-08 |
Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package
App 20150271920 - KIM; Daeik Daniel ; et al. | 2015-09-24 |
Compact 3-D coplanar transmission lines
Grant 9,136,574 - Kim , et al. September 15, 2 | 2015-09-15 |
Complex passive design with special via implementation
Grant 9,001,031 - Lo , et al. April 7, 2 | 2015-04-07 |
Varying Thickness Inductor
App 20150061813 - Kim; Daeik Daniel ; et al. | 2015-03-05 |
Thick Conductive Stack Plating Process With Fine Critical Dimension Feature Size For Compact Passive On Glass Technology
App 20150014812 - LAN; Je-Hsiung ; et al. | 2015-01-15 |
Compact 3-d Coplanar Transmission Lines
App 20140361854 - Kim; Daeik Daniel ; et al. | 2014-12-11 |
Design For High Pass Filters And Low Pass Filters Using Through Glass Via Technology
App 20140354378 - ZUO; Chengjie ; et al. | 2014-12-04 |
Composite Dilation Mode Resonators
App 20140111064 - Zuo; Chengjie ; et al. | 2014-04-24 |
Complex Passive Design With Special Via Implementation
App 20140028543 - Lo; Chi Shun ; et al. | 2014-01-30 |
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