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Patent applications and USPTO patent grants for Miks; Jeffrey A..The latest application filed is for "semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate".
Patent | Date |
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Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate Grant 8,018,072 - Miks , et al. September 13, 2 | 2011-09-13 |
Thermal via heat spreader package and method Grant 7,960,827 - Miller, Jr. , et al. June 14, 2 | 2011-06-14 |
Drop resistant bumpers for fully molded memory cards Grant 7,485,952 - Miks , et al. February 3, 2 | 2009-02-03 |
Interposer for interconnecting components in a memory card Grant 7,358,600 - d'Estries , et al. April 15, 2 | 2008-04-15 |
Tape supported memory card leadframe structure Grant 7,074,654 - Miks , et al. July 11, 2 | 2006-07-11 |
Electronic component assembly and method of making the same Grant 6,201,186 - Daniels , et al. March 13, 2 | 2001-03-13 |
Semiconductor device and method of manufacture Grant 6,103,548 - Miks , et al. August 15, 2 | 2000-08-15 |
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