loadpatents
Patent applications and USPTO patent grants for MIKKOLA; Robert D..The latest application filed is for "electroplating bath".
Patent | Date |
---|---|
Electroplating Bath App 20140238868 - LI; Tina C. ;   et al. | 2014-08-28 |
Leveler compounds Grant 8,506,788 - Wang , et al. August 13, 2 | 2013-08-13 |
Leveler Compounds App 20130001088 - Wang; Deyan ;   et al. | 2013-01-03 |
Leveler compounds Grant 8,262,891 - Wang , et al. September 11, 2 | 2012-09-11 |
Leveler compounds Grant 7,662,981 - Wang , et al. February 16, 2 | 2010-02-16 |
Leveler compounds App 20090139873 - Wang; Deyan ;   et al. | 2009-06-04 |
Leveler compounds Grant 7,510,639 - Wang , et al. March 31, 2 | 2009-03-31 |
Leveler compounds App 20070084732 - Wang; Deyan ;   et al. | 2007-04-19 |
Plating method App 20070012576 - Binstead; Robert A. ;   et al. | 2007-01-18 |
Electrode, electrochemical cell, and method for analysis of electroplating baths Grant 7,144,488 - Binstead , et al. December 5, 2 | 2006-12-05 |
Leveler compounds Grant 7,128,822 - Wang , et al. October 31, 2 | 2006-10-31 |
Leveler compounds App 20060016693 - Wang; Deyan ;   et al. | 2006-01-26 |
Plating method App 20050020068 - Wang, Deyan ;   et al. | 2005-01-27 |
Leveler compounds App 20040249177 - Wang, Deyan ;   et al. | 2004-12-09 |
Electroplating composition App 20040222104 - Wang, Deyan ;   et al. | 2004-11-11 |
Electroplating bath App 20040217009 - Mikkola, Robert D. ;   et al. | 2004-11-04 |
Seed layer repair Grant 6,797,146 - Morrissey , et al. September 28, 2 | 2004-09-28 |
Electrode, electrochemical cell, and method for analysis of electroplating baths App 20040089538 - Binstead, Robert A. ;   et al. | 2004-05-13 |
Method of electrodepositing copper Grant 6,679,983 - Morrissey , et al. January 20, 2 | 2004-01-20 |
Electroplating method Grant 6,649,038 - Mikkola , et al. November 18, 2 | 2003-11-18 |
Electroplating method App 20020074231 - Mikkola, Robert D. ;   et al. | 2002-06-20 |
Seed layer repair App 20020053519 - Morrissey, Denis ;   et al. | 2002-05-09 |
Electrolyte App 20020043467 - Morrissey, Denis ;   et al. | 2002-04-18 |
Seed repair and electroplating bath App 20020043468 - Mikkola, Robert D. ;   et al. | 2002-04-18 |
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