loadpatents
name:-0.028064966201782
name:-0.012188196182251
name:-0.00096607208251953
MIKKOLA; Robert D. Patent Filings

MIKKOLA; Robert D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MIKKOLA; Robert D..The latest application filed is for "electroplating bath".

Company Profile
0.10.15
  • MIKKOLA; Robert D. - Grafton MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electroplating Bath
App 20140238868 - LI; Tina C. ;   et al.
2014-08-28
Leveler compounds
Grant 8,506,788 - Wang , et al. August 13, 2
2013-08-13
Leveler Compounds
App 20130001088 - Wang; Deyan ;   et al.
2013-01-03
Leveler compounds
Grant 8,262,891 - Wang , et al. September 11, 2
2012-09-11
Leveler compounds
Grant 7,662,981 - Wang , et al. February 16, 2
2010-02-16
Leveler compounds
App 20090139873 - Wang; Deyan ;   et al.
2009-06-04
Leveler compounds
Grant 7,510,639 - Wang , et al. March 31, 2
2009-03-31
Leveler compounds
App 20070084732 - Wang; Deyan ;   et al.
2007-04-19
Plating method
App 20070012576 - Binstead; Robert A. ;   et al.
2007-01-18
Electrode, electrochemical cell, and method for analysis of electroplating baths
Grant 7,144,488 - Binstead , et al. December 5, 2
2006-12-05
Leveler compounds
Grant 7,128,822 - Wang , et al. October 31, 2
2006-10-31
Leveler compounds
App 20060016693 - Wang; Deyan ;   et al.
2006-01-26
Plating method
App 20050020068 - Wang, Deyan ;   et al.
2005-01-27
Leveler compounds
App 20040249177 - Wang, Deyan ;   et al.
2004-12-09
Electroplating composition
App 20040222104 - Wang, Deyan ;   et al.
2004-11-11
Electroplating bath
App 20040217009 - Mikkola, Robert D. ;   et al.
2004-11-04
Seed layer repair
Grant 6,797,146 - Morrissey , et al. September 28, 2
2004-09-28
Electrode, electrochemical cell, and method for analysis of electroplating baths
App 20040089538 - Binstead, Robert A. ;   et al.
2004-05-13
Method of electrodepositing copper
Grant 6,679,983 - Morrissey , et al. January 20, 2
2004-01-20
Electroplating method
Grant 6,649,038 - Mikkola , et al. November 18, 2
2003-11-18
Electroplating method
App 20020074231 - Mikkola, Robert D. ;   et al.
2002-06-20
Seed layer repair
App 20020053519 - Morrissey, Denis ;   et al.
2002-05-09
Electrolyte
App 20020043467 - Morrissey, Denis ;   et al.
2002-04-18
Seed repair and electroplating bath
App 20020043468 - Mikkola, Robert D. ;   et al.
2002-04-18

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed