Miki; Shota

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miki; Shota.The latest application filed is for "wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate".

Company Profile

2.7.8

Miki; Shota - Nagano JP
Miki; Shota - Nagano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive layer bonding a plurality of substrates having a fillet raised portion Grant 11,233,001 - Miki , et al. January 25, 2	2022-01-25
Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate Grant 10,959,328 - Kobayashi , et al. March 23, 2	2021-03-23
Wiring Substrate, Stacked Wiring Substrate, And Manufacturing Method Of Wiring Substrate App 20210007220 - Kobayashi; Naoki ; et al.	2021-01-07
Interconnect Board, Semiconductor Package, And Method Of Fabricating Interconnect Board App 20200211946 - Miki; Shota ; et al.	2020-07-02
Electronic component device Grant 10,485,098 - Miki Nov	2019-11-19
Semiconductor device Grant 10,340,200 - Miki	2019-07-02
Semiconductor Device App 20180174939 - Miki; Shota	2018-06-21
Electronic component device Grant 9,953,958 - Miki April 24, 2	2018-04-24
Electronic component device and manufacturing method thereof Grant 9,825,006 - Miki November 21, 2	2017-11-21
Semiconductor device and method of manufacturing the same Grant 9,633,978 - Miki April 25, 2	2017-04-25
Semiconductor Device App 20170025386 - MIKI; Shota	2017-01-26
Electronic Component Device App 20170018533 - Miki; Shota	2017-01-19
Electronic Component Device And Manufacturing Method Thereof App 20170018534 - Miki; Shota	2017-01-19
Electronic Component Device App 20160374194 - Miki; Shota	2016-12-22
Semiconductor Device And Method Of Manufacturing The Same App 20150228624 - MIKI; Shota	2015-08-13

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