| Patent | Date |
|---|
Surface treated copper foil, copper clad laminate, and printed circuit board
Grant 11,382,217 - Miyamoto , et al. July 5, 2 | 2022-07-05 |
Surface treated copper foil, copper clad laminate, and printed circuit board
Grant 11,375,624 - Miyamoto , et al. June 28, 2 | 2022-06-28 |
Surface treated copper foil, copper clad laminate, and printed circuit board
Grant 11,337,315 - Miyamoto , et al. May 17, 2 | 2022-05-17 |
Surface treated copper foil, copper clad laminate, and printed circuit board
Grant 11,337,314 - Miyamoto , et al. May 17, 2 | 2022-05-17 |
Information processing apparatus and method for collecting communication cable log
Grant 11,294,753 - Miki April 5, 2 | 2022-04-05 |
Method for manufacturing glass panel, and glass panel
Grant 11,279,653 - Miki , et al. March 22, 2 | 2022-03-22 |
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
App 20210362475 - Miyamoto; Nobuaki ; et al. | 2021-11-25 |
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
App 20210360785 - Miyamoto; Nobuaki ; et al. | 2021-11-18 |
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
App 20210331449 - Miyamoto; Nobuaki ; et al. | 2021-10-28 |
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board
App 20210337664 - Miyamoto; Nobuaki ; et al. | 2021-10-28 |
Glass panel and glass window
Grant 11,124,450 - Miki , et al. September 21, 2 | 2021-09-21 |
Correction device for A/D converter and A/D conversion device
Grant 11,070,220 - Miki July 20, 2 | 2021-07-20 |
Information Processing Apparatus And Method For Collecting Communication Cable Log
App 20210165706 - Miki; Atsushi | 2021-06-03 |
Information processing apparatus and optical fiber inspection method
Grant 10,992,378 - Miki April 27, 2 | 2021-04-27 |
Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
Grant 10,925,170 - Ori , et al. February 16, 2 | 2021-02-16 |
Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device
Grant 10,925,171 - Ori , et al. February 16, 2 | 2021-02-16 |
Correction Device For A/d Converter And A/d Conversion Device
App 20210028790 - Miki; Atsushi | 2021-01-28 |
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
Grant 10,820,414 - Arai , et al. October 27, 2 | 2020-10-27 |
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
Grant 10,791,631 - Ori , et al. September 29, 2 | 2020-09-29 |
Parallel processing apparatus and replacing method of failing optical transmission line
Grant 10,771,150 - Miki Sep | 2020-09-08 |
Method For Manufacturing Glass Panel, And Glass Panel
App 20200270175 - Miki; Atsushi ; et al. | 2020-08-27 |
Glass Panel And Glass Window
App 20200262750 - Miki; Atsushi ; et al. | 2020-08-20 |
Information processing apparatus, information processing system, and information processing apparatus control method
Grant 10,664,339 - Miki | 2020-05-26 |
Parallel Processing Apparatus And Replacing Method Of Failing Optical Transmission Line
App 20200119809 - Miki; Atsushi | 2020-04-16 |
Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device
Grant 10,602,620 - Miki , et al. | 2020-03-24 |
Information processing device and burst error reproducing method
Grant 10,581,555 - Maeda , et al. | 2020-03-03 |
Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil
Grant 10,529,992 - Arai , et al. J | 2020-01-07 |
Information Processing Apparatus And Optical Fiber Inspection Method
App 20190379452 - Miki; Atsushi | 2019-12-12 |
Failure Detection Device For Onboard Power Supply Device, And Onboard Power Supply Device
App 20190353715 - MIKI; Atsushi | 2019-11-21 |
Copper foil for printed circuit
Grant 10,472,728 - Arai , et al. Nov | 2019-11-12 |
Voltage converting device
Grant 10,476,391 - Miki Nov | 2019-11-12 |
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
Grant 10,464,291 - Momoi , et al. No | 2019-11-05 |
Voltage Converting Device
App 20190305685 - MIKI; Atsushi | 2019-10-03 |
Surface-treated copper foil
Grant 10,383,222 - Miki , et al. A | 2019-08-13 |
Printed wiring board, electronic device, catheter, and metallic material
Grant 10,194,534 - Arai , et al. Ja | 2019-01-29 |
Eyelet
Grant D837,685 - Miki J | 2019-01-08 |
Optical communication module, parallel processing apparatus, and adjusting method
Grant 10,153,846 - Miki Dec | 2018-12-11 |
Communication device and inspection method
Grant 10,110,304 - Miki October 23, 2 | 2018-10-23 |
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device
App 20180288884 - Ori; Yuki ; et al. | 2018-10-04 |
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device
App 20180288881 - Ori; Yuki ; et al. | 2018-10-04 |
Information Processing Apparatus, Information Processing System, And Information Processing Apparatus Control Method
App 20180239663 - Miki; Atsushi | 2018-08-23 |
Surface-treated Copper Foil, And Current Collector, Electrode, And Battery Cell Using The Surface-treated Copper Foil
App 20180226655 - Arai; Hideta ; et al. | 2018-08-09 |
Information Processing Device And Burst Error Reproducing Method
App 20180205495 - Maeda; Masahiro ; et al. | 2018-07-19 |
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
App 20180160546 - Ori; Yuki ; et al. | 2018-06-07 |
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device
App 20180160529 - Arai; Hideta ; et al. | 2018-06-07 |
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation
App 20180035529 - ARAI; HIDETA ; et al. | 2018-02-01 |
Printed Wiring Board, Electronic Device, Catheter, And Metallic Material
App 20180035546 - ARAI; HIDETA ; et al. | 2018-02-01 |
Optical Communication Module, Parallel Processing Apparatus, And Adjusting Method
App 20170373760 - Miki; Atsushi | 2017-12-28 |
Communication Device And Inspection Method
App 20170373757 - Miki; Atsushi | 2017-12-28 |
Optical Component
App 20170366256 - Miki; Atsushi | 2017-12-21 |
Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat Radiation
App 20170347493 - Arai; Hideta ; et al. | 2017-11-30 |
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
App 20170291397 - MOMOI; Hajime ; et al. | 2017-10-12 |
Laminate For Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Method Of Manufacturing Electronic Device
App 20170231101 - Miki; Atsushi ; et al. | 2017-08-10 |
Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
Grant 9,724,896 - Momoi , et al. August 8, 2 | 2017-08-08 |
Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate
Grant 9,730,332 - Arai , et al. August 8, 2 | 2017-08-08 |
Surface-Treated Copper Foil
App 20170196083 - Miki; Atsushi ; et al. | 2017-07-06 |
Copper foil for printed circuit
Grant 9,580,829 - Arai , et al. February 28, 2 | 2017-02-28 |
Surface treated copper foil and laminate using the same
Grant 9,504,149 - Arai , et al. November 22, 2 | 2016-11-22 |
Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board
App 20160303829 - Arai; Hideta ; et al. | 2016-10-20 |
Copper Foil For Printed Circuit
App 20160286665 - Arai; Hideta ; et al. | 2016-09-29 |
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
App 20160120017 - MOMOI; HAJIME ; et al. | 2016-04-28 |
Surface treated copper foil and laminate using the same
Grant 9,232,650 - Arai , et al. January 5, 2 | 2016-01-05 |
Surface Treated Copper Foil and Laminate Using the Same
App 20150245477 - Arai; Hideta ; et al. | 2015-08-27 |
Surface Treated Copper Foil And Laminate Using The Same, Printed Wiring Board, And Copper Clad Laminate
App 20150237737 - Arai; Hideta ; et al. | 2015-08-20 |
Oral Pharmaceutical Preparation Of Aripiprazole
App 20150174247 - Dairaku; Masatake ; et al. | 2015-06-25 |
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
Grant 9,060,431 - Arai , et al. June 16, 2 | 2015-06-16 |
Rolled copper or copper-alloy foil provided with roughened surface
Grant 9,049,795 - Arai , et al. June 2, 2 | 2015-06-02 |
Surface Treated Copper Foil and Laminate Using the Same
App 20140355229 - Arai; Hideta ; et al. | 2014-12-04 |
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate
App 20140093743 - Arai; Hideta ; et al. | 2014-04-03 |
Copper Foil For Printed Circuit
App 20140057123 - Arai; Hideta ; et al. | 2014-02-27 |
Rolled Copper or Copper-Alloy Foil Provided with Roughened Surface
App 20140037976 - Arai; Hideta ; et al. | 2014-02-06 |
Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
Grant 8,449,987 - Kobayashi , et al. May 28, 2 | 2013-05-28 |
Laminate For Flexible Wiring
App 20130071652 - Yamanishi; Keisuke ; et al. | 2013-03-21 |
Shooting device and method with function for guiding an object to be shot
Grant 8,395,673 - Fukuda , et al. March 12, 2 | 2013-03-12 |
Copper Foil for Printed Circuit
App 20130011690 - Arai; Hideta ; et al. | 2013-01-10 |
Copper Foil For Negative Electrode Current Collector Of Secondary Battery
App 20130011734 - Arai; Hideta ; et al. | 2013-01-10 |
Surface-Treated Copper Foil
App 20120276412 - Miki; Atsushi | 2012-11-01 |
Method of roughening rolled copper or copper alloy foil
Grant 8,252,166 - Kobayashi , et al. August 28, 2 | 2012-08-28 |
Method of Roughening Rolled Copper or Copper Alloy Foil
App 20120012463 - Kobayashi; Yousuke ; et al. | 2012-01-19 |
Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil
App 20090162685 - Kobayashi; Yousuke ; et al. | 2009-06-25 |
Photographing apparatus photographing method and computer program
Grant 7,522,824 - Fukui , et al. April 21, 2 | 2009-04-21 |
Image taking device, method for controlling light sources and computer program
Grant 7,415,202 - Fujimoto , et al. August 19, 2 | 2008-08-19 |
Image capture apparatus
Grant 7,406,198 - Aoki , et al. July 29, 2 | 2008-07-29 |
Image taking device and personal identification system
Grant 7,340,159 - Sugiura , et al. March 4, 2 | 2008-03-04 |
Photographing apparatus photographing method and computer program
App 20060210256 - Fukui; Satoshi ; et al. | 2006-09-21 |
Image taking device, method for controlling light sources and computer program
App 20060110145 - Fujimoto; Naoyuki ; et al. | 2006-05-25 |
Image taking device and personal identification system
App 20060018652 - Sugiura; Takayuki ; et al. | 2006-01-26 |
Image capture apparatus
App 20040208373 - Aoki, Takahiro ; et al. | 2004-10-21 |
Optical module and optical device
Grant 6,805,494 - Miki , et al. October 19, 2 | 2004-10-19 |
Shooting device and shooting method
App 20040189829 - Fukuda, Mitsuaki ; et al. | 2004-09-30 |
Image transmitting method, image transmitter, and memory product
App 20040029552 - Miki, Atsushi ; et al. | 2004-02-12 |
Image transmitting method, image transmitter, and memory product
App 20040029526 - Miki, Atsushi ; et al. | 2004-02-12 |
Optical module and optical device
App 20030112500 - Miki, Atsushi ; et al. | 2003-06-19 |
Semiconductor laser module
Grant 6,400,011 - Miki June 4, 2 | 2002-06-04 |
Semiconductor laser module
App 20010021210 - Nakaya, Hiroyuki ; et al. | 2001-09-13 |
Optical module
Grant 6,094,515 - Miki , et al. July 25, 2 | 2000-07-25 |
Semiconductor laser device
Grant 5,436,924 - Kamei , et al. July 25, 1 | 1995-07-25 |
Method of measuring junction temperature
Grant 5,401,099 - Nishizawa , et al. March 28, 1 | 1995-03-28 |
Method of mounting semiconductor elements
Grant 5,348,214 - Nishiguchi , et al. * September 20, 1 | 1994-09-20 |
Substrate for packaging a semiconductor device
Grant 5,298,460 - Nishiguchi , et al. March 29, 1 | 1994-03-29 |
Method for packaging a semiconductor device
Grant 5,262,355 - Nishiguchi , et al. November 16, 1 | 1993-11-16 |
Apparatus for packaging a semiconductor device
Grant 5,212,880 - Nishiguchi , et al. May 25, 1 | 1993-05-25 |
Substrate for packaging a semiconductor device
Grant 5,214,308 - Nishiguchi , et al. May 25, 1 | 1993-05-25 |
Substrate for packaging a semiconductor device having particular terminal and bump structure
Grant 5,196,726 - Nishiguchi , et al. March 23, 1 | 1993-03-23 |
Method for packaging semiconductor device
Grant 5,092,033 - Nishiguchi , et al. March 3, 1 | 1992-03-03 |
Fuel cell using liquid electrolyte
Grant 4,808,492 - Uozumi , et al. February 28, 1 | 1989-02-28 |
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