Mikhail; Amanda Elisa Ennis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mikhail; Amanda Elisa Ennis.The latest application filed is for "compensation of thermal expansion in smt interconnects".

Company Profile

0.13.13

Mikhail; Amanda Elisa Ennis - Rochester MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Implementing differential signal circuit board electrical contact Grant 8,007,291 - Gilliland , et al. August 30, 2	2011-08-30
Mounting a heat sink in thermal contact with an electronic component Grant 7,944,698 - Colbert , et al. May 17, 2	2011-05-17
Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member Grant 7,765,693 - Brodsky , et al. August 3, 2	2010-08-03
Compensation Of Thermal Expansion In Smt Interconnects App 20100184305 - BRODSKY; WILLIAM LOUIS ; et al.	2010-07-22
Socket and method for compensating for differing coefficients of thermal expansion Grant 7,632,127 - Beaman , et al. December 15, 2	2009-12-15
Mounting a heat sink in thermal contact with an electronic component Grant 7,606,033 - Colbert , et al. October 20, 2	2009-10-20
Socket and method for compensating for differing coefficients of thermal expansion Grant 7,530,853 - Beaman , et al. May 12, 2	2009-05-12
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference Grant 7,489,224 - Berens , et al. February 10, 2	2009-02-10
Mounting a heat sink in thermal contact with an electronic component Grant 7,486,516 - Colbert , et al. February 3, 2	2009-02-03
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion Grant 7,472,477 - Beaman , et al. January 6, 2	2009-01-06
Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member App 20080282539 - Brodsky; William Louis ; et al.	2008-11-20
Mounting a Heat Sink in Thermal Contact with an Electronic Component App 20080264603 - Colbert; John Lee ; et al.	2008-10-30
Mounting a Heat Sink in Thermal Contact with an Electronic Component App 20080259572 - Colbert; John Lee ; et al.	2008-10-23
Socket and Method for Compensating for Differing Coefficients of Thermal Expansion App 20080182443 - Beaman; Brian Samuel ; et al.	2008-07-31
Socket And Method For Compensating For Differing Coefficients Of Thermal Expansion App 20080090440 - Beaman; Brian Samuel ; et al.	2008-04-17
Socket and method for compensating for differing coefficients of thermal expansion App 20080090439 - Beaman; Brian Samuel ; et al.	2008-04-17
Socket and method for compensating for differing coefficients of thermal expansion Grant 7,303,443 - Beaman , et al. December 4, 2	2007-12-04
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member Grant 7,293,994 - Brodsky , et al. November 13, 2	2007-11-13
Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member App 20070226997 - Brodsky; William Louis ; et al.	2007-10-04
Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member App 20070227769 - Brodsky; William Louis ; et al.	2007-10-04
Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member App 20070134948 - Brodsky; William Louis ; et al.	2007-06-14
Method and apparatus for mounting a heat sink in thermal contact with an electronic component App 20070035937 - Colbert; John Lee ; et al.	2007-02-15
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference App 20070013470 - Berens; Jessica Rose ; et al.	2007-01-18
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference Grant 7,138,896 - Berens , et al. November 21, 2	2006-11-21
V-seal EMC gasket assembly for precise placement, conduction and retention without adhesives Grant 7,084,344 - Gilliland , et al. August 1, 2	2006-08-01
Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference App 20050285708 - Berens, Jessica Rose ; et al.	2005-12-29

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.