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name:-0.012413024902344
name:-0.010499000549316
name:-0.0027751922607422
Mikalo; Ricardo P. Patent Filings

Mikalo; Ricardo P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mikalo; Ricardo P..The latest application filed is for "heat dissipative element for polysilicon resistor bank".

Company Profile
1.15.18
  • Mikalo; Ricardo P. - Heideblick DE
  • Mikalo; Ricardo P. - Heidelblick N/A DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heat dissipative element for polysilicon resistor bank
Grant 10,256,134 - Mikalo , et al.
2019-04-09
Heat Dissipative Element For Polysilicon Resistor Bank
App 20180358259 - Mikalo; Ricardo P. ;   et al.
2018-12-13
Method and structure for process limiting yield testing
Grant 10,147,659 - Dersch , et al. De
2018-12-04
Methods of forming semiconductor devices with embedded semiconductor material as source/drain regions using a reduced number of spacers
Grant 9,093,554 - Flachowsky , et al. July 28, 2
2015-07-28
Integrated circuits and methods for operating integrated circuits with non-volatile memory
Grant 9,087,587 - Mikalo , et al. July 21, 2
2015-07-21
Integrated Circuits And Methods For Operating Integrated Circuits With Non-volatile Memory
App 20140269060 - Mikalo; Ricardo P. ;   et al.
2014-09-18
Methods of reducing gate leakage
Grant 8,669,170 - Mikalo , et al. March 11, 2
2014-03-11
Fabrication of a semiconductor device with extended epitaxial semiconductor regions
Grant 8,642,420 - Flachowsky , et al. February 4, 2
2014-02-04
Methods of Forming Semiconductor Devices with Embedded Semiconductor Material as Source/Drain Regions Using a Reduced Number of Spacers
App 20130302956 - Flachowsky; Stefan ;   et al.
2013-11-14
Semiconductor devices having encapsulated isolation regions and related fabrication methods
Grant 8,536,019 - Mikalo , et al. September 17, 2
2013-09-17
Methods for the fabrication of integrated circuits including back-etching of raised conductive structures
Grant 8,524,566 - Flachowsky , et al. September 3, 2
2013-09-03
Methods of Forming Device Level Conductive Contacts to Improve Device Performance and Semiconductor Devices Comprising Such Contacts
App 20130207275 - Mikalo; Ricardo P. ;   et al.
2013-08-15
Methods of Reducing Gate Leakage
App 20130183817 - Mikalo; Ricardo P. ;   et al.
2013-07-18
Methods of forming a semiconductor device with recessed source/design regions, and a semiconductor device comprising same
Grant 8,476,131 - Flachowsky , et al. July 2, 2
2013-07-02
Methods For The Fabrication Of Integrated Circuits Including Back-etching Of Raised Conductive Structures
App 20130157421 - Flachowsky; Stefan ;   et al.
2013-06-20
Methods of Forming Highly Scaled Semiconductor Devices Using a Reduced Number of Spacers
App 20130065367 - Flachowsky; Stefan ;   et al.
2013-03-14
Fabrication Of A Semiconductor Device With Extended Epitaxial Semiconductor Regions
App 20130052779 - Flachowsky; Stefan ;   et al.
2013-02-28
Methods of Forming a Semiconductor Device with Recessed Source/Drain Regions, and a Semiconductor Device Comprising Same
App 20130049126 - Flachowsky; Stefan ;   et al.
2013-02-28
Flexible Electronics Wiring
App 20120301688 - MIKALO; Ricardo P. ;   et al.
2012-11-29
Semiconductor Devices Having Encapsulated Isolation Regions And Related Fabrication Methods
App 20120292734 - MIKALO; Ricardo P. ;   et al.
2012-11-22

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