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Patent applications and USPTO patent grants for Mikado; Yukinobu.The latest application filed is for "printed wiring board and method for manufacturing printed wiring board".
Patent | Date |
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Printed wiring board and method for manufacturing printed wiring board Grant 11,277,923 - Mikado , et al. March 15, 2 | 2022-03-15 |
Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20210176870 - MIKADO; Yukinobu ;   et al. | 2021-06-10 |
Printed Wiring Board And Method For Manufacturing The Same App 20190104615 - Furutani; Toshiki ;   et al. | 2019-04-04 |
Circuit substrate and method for manufacturing the same Grant 10,143,092 - Mikado , et al. Nov | 2018-11-27 |
Wiring board and method for manufacturing the same Grant 9,883,592 - Furutani , et al. January 30, 2 | 2018-01-30 |
Circuit substrate and method for manufacturing the same Grant 9,831,163 - Mikado , et al. November 28, 2 | 2017-11-28 |
Circuit Substrate And Method For Manufacturing The Same App 20160268189 - MIKADO; Yukinobu ;   et al. | 2016-09-15 |
Wiring board and method for manufacturing the same Grant 9,439,289 - Furutani , et al. September 6, 2 | 2016-09-06 |
Circuit Substrate And Method For Manufacturing The Same App 20160242293 - MIKADO; Yukinobu ;   et al. | 2016-08-18 |
Multilayer printed wiring board and method for manufacturing multilayer printed wiring board Grant 9,332,657 - Furutani , et al. May 3, 2 | 2016-05-03 |
Printed wiring board Grant 9,320,148 - Mikado , et al. April 19, 2 | 2016-04-19 |
Wiring board and method for manufacturing the same Grant 9,232,656 - Mikado , et al. January 5, 2 | 2016-01-05 |
Wiring Board And Method For Manufacturing The Same App 20150382471 - FURUTANI; Toshiki ;   et al. | 2015-12-31 |
Wiring board with built-in electronic component and method for manufacturing the same Grant 9,215,805 - Zanma , et al. December 15, 2 | 2015-12-15 |
Printed wiring board Grant 9,204,552 - Furutani , et al. December 1, 2 | 2015-12-01 |
Wiring board and method for manufacturing the same Grant 9,119,322 - Mikado , et al. August 25, 2 | 2015-08-25 |
Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board Grant 9,044,830 - Mikado , et al. June 2, 2 | 2015-06-02 |
Multilayered printed circuit board and method for manufacturing the same Grant 9,027,238 - Ito , et al. May 12, 2 | 2015-05-12 |
Method for manufacturing a multilayered circuit board Grant 8,973,259 - Ito , et al. March 10, 2 | 2015-03-10 |
Printed wiring board Grant 8,957,320 - Furutani , et al. February 17, 2 | 2015-02-17 |
Wiring Board And Method For Manufacturing The Same App 20150022982 - MIKADO; Yukinobu ;   et al. | 2015-01-22 |
Multilayered printed circuit board and method for manufacturing the same Grant 8,912,451 - Ito , et al. December 16, 2 | 2014-12-16 |
Wiring board and method for manufacturing the same Grant 8,908,387 - Mikado , et al. December 9, 2 | 2014-12-09 |
Printed wiring board Grant 8,891,245 - Furutani , et al. November 18, 2 | 2014-11-18 |
Wiring board and method for manufacturing the same Grant 8,829,357 - Mikado , et al. September 9, 2 | 2014-09-09 |
Wiring board with built-in electronic component and method for manufacturing the same Grant 8,785,788 - Shimizu , et al. July 22, 2 | 2014-07-22 |
Method For Forming Cavity, Apparatus For Forming Cavity, Method For Manufacturing Circuit Board, And Circuit Board App 20140182917 - MIKADO; Yukinobu ;   et al. | 2014-07-03 |
Wiring Board And Method For Manufacturing The Same App 20140153205 - MIKADO; Yukinobu ;   et al. | 2014-06-05 |
Multilayer printed circuit board Grant 8,705,248 - Ito , et al. April 22, 2 | 2014-04-22 |
Multilayered printed circuit board and method for manufacturing the same Grant 8,692,132 - Ito , et al. April 8, 2 | 2014-04-08 |
Wiring board and method for manufacturing the same Grant 8,693,209 - Mikado , et al. April 8, 2 | 2014-04-08 |
Manufacturing method for a printed wiring board Grant 8,621,748 - Takahashi , et al. January 7, 2 | 2014-01-07 |
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20130284506 - ZANMA; Masahiro ;   et al. | 2013-10-31 |
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20130256007 - Furutani; Toshiki ;   et al. | 2013-10-03 |
Wiring Board And Method For Manufacturing The Same App 20130194764 - MIKADO; Yukinobu ;   et al. | 2013-08-01 |
Printed Wiring Board App 20130192883 - FURUTANI; Toshiki ;   et al. | 2013-08-01 |
Printed Wiring Board App 20130192884 - FURUTANI; Toshiki ;   et al. | 2013-08-01 |
Wiring Board And Method For Manufacturing The Same App 20130182401 - Furutani; Toshiki ;   et al. | 2013-07-18 |
Multilayer printed wiring board Grant 8,481,424 - Takahashi , et al. July 9, 2 | 2013-07-09 |
Multilayer Printed Wiring Board And Method For Manufacturing Multilayer Printed Wiring Board App 20130081870 - FURUTANI; Toshiki ;   et al. | 2013-04-04 |
Printed Wiring Board App 20130081866 - FURUTANI; Toshiki ;   et al. | 2013-04-04 |
Multilayer Printed Circuit Board And The Manufacturing Method Thereof App 20130033837 - Ito; Sotaro ;   et al. | 2013-02-07 |
Multilayer printed circuit board Grant 8,320,135 - Ito , et al. November 27, 2 | 2012-11-27 |
Wiring Board And Method For Manufacturing The Same App 20120287586 - Mikado; Yukinobu ;   et al. | 2012-11-15 |
Printed Wiring Board App 20120250277 - MIKADO; Yukinobu ;   et al. | 2012-10-04 |
Wiring Board And Method For Manufacturing The Same App 20120186866 - MIKADO; Yukinobu ;   et al. | 2012-07-26 |
Wiring Board And Method For Manufacturing The Same App 20120188734 - MIKADO; Yukinobu ;   et al. | 2012-07-26 |
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20120186861 - SHIMIZU; Keisuke ;   et al. | 2012-07-26 |
Method of forming a multilayer printed wiring board having a bulged via Grant 8,181,341 - Takahashi , et al. May 22, 2 | 2012-05-22 |
Multilayered Printed Circuit Board And Method For Manufacturing The Same App 20120106108 - ITO; Sotaro ;   et al. | 2012-05-03 |
Multilayer wiring board with concave portion for accomodating electronic component Grant 8,168,893 - Ito , et al. May 1, 2 | 2012-05-01 |
Multilayered Printed Circuit Board And Method For Manufacturing The Same App 20120077317 - ITO; Sotaro ;   et al. | 2012-03-29 |
Multilayered printed circuit board and method for manufacturing the same Grant 8,101,868 - Ito , et al. January 24, 2 | 2012-01-24 |
Multilayered Printed Circuit Board And Method For Manufacturing The Same App 20120006587 - Ito; Sotaro ;   et al. | 2012-01-12 |
Multilayer Printed Wiring Board App 20120005889 - Takahashi; Michimasa ;   et al. | 2012-01-12 |
Flex-rigid wiring board and manufacturing method thereof Grant 8,093,502 - Mikado , et al. January 10, 2 | 2012-01-10 |
Multilayered Printed Circuit Board And Method For Manufacturing The Same App 20110314668 - ITO; Sotaro ;   et al. | 2011-12-29 |
Wiring Board And Method For Manufacturing Wiring Board App 20110240354 - FURUHATA; Naoki ;   et al. | 2011-10-06 |
Multilayer Printed Circuit Board And The Manufacturing Method Thereof App 20110176284 - ITO; Sotaro ;   et al. | 2011-07-21 |
Multilayer printed wiring board Grant 7,973,249 - Takahashi , et al. July 5, 2 | 2011-07-05 |
Multilayer printed circuit board Grant 7,957,154 - Ito , et al. June 7, 2 | 2011-06-07 |
Method of manufacturing multilayer printed circuit board Grant 7,929,313 - Ito , et al. April 19, 2 | 2011-04-19 |
Printed wiring board and method of manufacturing the same Grant 7,902,463 - Takahashi , et al. March 8, 2 | 2011-03-08 |
Multilayer printed wiring board Grant 7,834,273 - Takahashi , et al. November 16, 2 | 2010-11-16 |
Multilayer Printed Wiring Board App 20100252318 - TAKAHASHI; Michimasa ;   et al. | 2010-10-07 |
Multilayer printed wiring board Grant 7,759,582 - Takahashi , et al. July 20, 2 | 2010-07-20 |
Multilayer Printed Wiring Board App 20100155130 - Takahashi; Michimasa ;   et al. | 2010-06-24 |
Multilayer Printed Circuit Board And The Manufacturing Method Thereof App 20100159647 - ITO; Sotaro ;   et al. | 2010-06-24 |
Printed Wiring Board And Method Of Manufacturing The Same App 20100021627 - Takahashi; Michimasa ;   et al. | 2010-01-28 |
Multilayer Printed Wiring Board App 20090255111 - Takahashi; Michimasa ;   et al. | 2009-10-15 |
Multilayer Wiring Board And Method Of Manufacturing The Same App 20090188703 - ITO; Sotaro ;   et al. | 2009-07-30 |
Flex-Rigid Wiring Board and Manufacturing Method Thereof App 20080289859 - Mikado; Yukinobu ;   et al. | 2008-11-27 |
Flex-rigid wiring board Grant 7,423,219 - Kawaguchi , et al. September 9, 2 | 2008-09-09 |
Printed Wiring Board And Method Of Manufacturing The Same App 20080185172 - Takahashi; Michimasa ;   et al. | 2008-08-07 |
Flex-rigid Wiring Board App 20080107802 - Kawaguchi; Katsuo ;   et al. | 2008-05-08 |
Multilayered Printed Circuit Board And The Manufacturing Method Thereof App 20080007927 - Ito; Sotaro ;   et al. | 2008-01-10 |
Multilayer printed wiring board App 20070154741 - Takahashi; Michimasa ;   et al. | 2007-07-05 |
Multilayered printed circuit board and method for manufacturing the same App 20070095471 - Ito; Sotaro ;   et al. | 2007-05-03 |
Multilayered printed wiring board App 20070096328 - Takahashi; Michimasa ;   et al. | 2007-05-03 |
Rigid-flex wiring board and method for producing same App 20070012475 - Kawaguchi; Katsuo ;   et al. | 2007-01-18 |
Printed wiring board and method for manufacturing the same Grant 6,242,079 - Mikado , et al. June 5, 2 | 2001-06-05 |
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