loadpatents
name:-0.046681880950928
name:-0.045315027236938
name:-0.003809928894043
Mikado; Yukinobu Patent Filings

Mikado; Yukinobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mikado; Yukinobu.The latest application filed is for "printed wiring board and method for manufacturing printed wiring board".

Company Profile
2.53.48
  • Mikado; Yukinobu - Ogaki JP
  • Mikado; Yukinobu - Ogaki-shi JP
  • Mikado; Yukinobu - Gifu JP
  • Mikado; Yukinobu - Ohgaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed wiring board and method for manufacturing printed wiring board
Grant 11,277,923 - Mikado , et al. March 15, 2
2022-03-15
Printed Wiring Board And Method For Manufacturing Printed Wiring Board
App 20210176870 - MIKADO; Yukinobu ;   et al.
2021-06-10
Printed Wiring Board And Method For Manufacturing The Same
App 20190104615 - Furutani; Toshiki ;   et al.
2019-04-04
Circuit substrate and method for manufacturing the same
Grant 10,143,092 - Mikado , et al. Nov
2018-11-27
Wiring board and method for manufacturing the same
Grant 9,883,592 - Furutani , et al. January 30, 2
2018-01-30
Circuit substrate and method for manufacturing the same
Grant 9,831,163 - Mikado , et al. November 28, 2
2017-11-28
Circuit Substrate And Method For Manufacturing The Same
App 20160268189 - MIKADO; Yukinobu ;   et al.
2016-09-15
Wiring board and method for manufacturing the same
Grant 9,439,289 - Furutani , et al. September 6, 2
2016-09-06
Circuit Substrate And Method For Manufacturing The Same
App 20160242293 - MIKADO; Yukinobu ;   et al.
2016-08-18
Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
Grant 9,332,657 - Furutani , et al. May 3, 2
2016-05-03
Printed wiring board
Grant 9,320,148 - Mikado , et al. April 19, 2
2016-04-19
Wiring board and method for manufacturing the same
Grant 9,232,656 - Mikado , et al. January 5, 2
2016-01-05
Wiring Board And Method For Manufacturing The Same
App 20150382471 - FURUTANI; Toshiki ;   et al.
2015-12-31
Wiring board with built-in electronic component and method for manufacturing the same
Grant 9,215,805 - Zanma , et al. December 15, 2
2015-12-15
Printed wiring board
Grant 9,204,552 - Furutani , et al. December 1, 2
2015-12-01
Wiring board and method for manufacturing the same
Grant 9,119,322 - Mikado , et al. August 25, 2
2015-08-25
Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board
Grant 9,044,830 - Mikado , et al. June 2, 2
2015-06-02
Multilayered printed circuit board and method for manufacturing the same
Grant 9,027,238 - Ito , et al. May 12, 2
2015-05-12
Method for manufacturing a multilayered circuit board
Grant 8,973,259 - Ito , et al. March 10, 2
2015-03-10
Printed wiring board
Grant 8,957,320 - Furutani , et al. February 17, 2
2015-02-17
Wiring Board And Method For Manufacturing The Same
App 20150022982 - MIKADO; Yukinobu ;   et al.
2015-01-22
Multilayered printed circuit board and method for manufacturing the same
Grant 8,912,451 - Ito , et al. December 16, 2
2014-12-16
Wiring board and method for manufacturing the same
Grant 8,908,387 - Mikado , et al. December 9, 2
2014-12-09
Printed wiring board
Grant 8,891,245 - Furutani , et al. November 18, 2
2014-11-18
Wiring board and method for manufacturing the same
Grant 8,829,357 - Mikado , et al. September 9, 2
2014-09-09
Wiring board with built-in electronic component and method for manufacturing the same
Grant 8,785,788 - Shimizu , et al. July 22, 2
2014-07-22
Method For Forming Cavity, Apparatus For Forming Cavity, Method For Manufacturing Circuit Board, And Circuit Board
App 20140182917 - MIKADO; Yukinobu ;   et al.
2014-07-03
Wiring Board And Method For Manufacturing The Same
App 20140153205 - MIKADO; Yukinobu ;   et al.
2014-06-05
Multilayer printed circuit board
Grant 8,705,248 - Ito , et al. April 22, 2
2014-04-22
Multilayered printed circuit board and method for manufacturing the same
Grant 8,692,132 - Ito , et al. April 8, 2
2014-04-08
Wiring board and method for manufacturing the same
Grant 8,693,209 - Mikado , et al. April 8, 2
2014-04-08
Manufacturing method for a printed wiring board
Grant 8,621,748 - Takahashi , et al. January 7, 2
2014-01-07
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20130284506 - ZANMA; Masahiro ;   et al.
2013-10-31
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20130256007 - Furutani; Toshiki ;   et al.
2013-10-03
Wiring Board And Method For Manufacturing The Same
App 20130194764 - MIKADO; Yukinobu ;   et al.
2013-08-01
Printed Wiring Board
App 20130192883 - FURUTANI; Toshiki ;   et al.
2013-08-01
Printed Wiring Board
App 20130192884 - FURUTANI; Toshiki ;   et al.
2013-08-01
Wiring Board And Method For Manufacturing The Same
App 20130182401 - Furutani; Toshiki ;   et al.
2013-07-18
Multilayer printed wiring board
Grant 8,481,424 - Takahashi , et al. July 9, 2
2013-07-09
Multilayer Printed Wiring Board And Method For Manufacturing Multilayer Printed Wiring Board
App 20130081870 - FURUTANI; Toshiki ;   et al.
2013-04-04
Printed Wiring Board
App 20130081866 - FURUTANI; Toshiki ;   et al.
2013-04-04
Multilayer Printed Circuit Board And The Manufacturing Method Thereof
App 20130033837 - Ito; Sotaro ;   et al.
2013-02-07
Multilayer printed circuit board
Grant 8,320,135 - Ito , et al. November 27, 2
2012-11-27
Wiring Board And Method For Manufacturing The Same
App 20120287586 - Mikado; Yukinobu ;   et al.
2012-11-15
Printed Wiring Board
App 20120250277 - MIKADO; Yukinobu ;   et al.
2012-10-04
Wiring Board And Method For Manufacturing The Same
App 20120186866 - MIKADO; Yukinobu ;   et al.
2012-07-26
Wiring Board And Method For Manufacturing The Same
App 20120188734 - MIKADO; Yukinobu ;   et al.
2012-07-26
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20120186861 - SHIMIZU; Keisuke ;   et al.
2012-07-26
Method of forming a multilayer printed wiring board having a bulged via
Grant 8,181,341 - Takahashi , et al. May 22, 2
2012-05-22
Multilayered Printed Circuit Board And Method For Manufacturing The Same
App 20120106108 - ITO; Sotaro ;   et al.
2012-05-03
Multilayer wiring board with concave portion for accomodating electronic component
Grant 8,168,893 - Ito , et al. May 1, 2
2012-05-01
Multilayered Printed Circuit Board And Method For Manufacturing The Same
App 20120077317 - ITO; Sotaro ;   et al.
2012-03-29
Multilayered printed circuit board and method for manufacturing the same
Grant 8,101,868 - Ito , et al. January 24, 2
2012-01-24
Multilayered Printed Circuit Board And Method For Manufacturing The Same
App 20120006587 - Ito; Sotaro ;   et al.
2012-01-12
Multilayer Printed Wiring Board
App 20120005889 - Takahashi; Michimasa ;   et al.
2012-01-12
Flex-rigid wiring board and manufacturing method thereof
Grant 8,093,502 - Mikado , et al. January 10, 2
2012-01-10
Multilayered Printed Circuit Board And Method For Manufacturing The Same
App 20110314668 - ITO; Sotaro ;   et al.
2011-12-29
Wiring Board And Method For Manufacturing Wiring Board
App 20110240354 - FURUHATA; Naoki ;   et al.
2011-10-06
Multilayer Printed Circuit Board And The Manufacturing Method Thereof
App 20110176284 - ITO; Sotaro ;   et al.
2011-07-21
Multilayer printed wiring board
Grant 7,973,249 - Takahashi , et al. July 5, 2
2011-07-05
Multilayer printed circuit board
Grant 7,957,154 - Ito , et al. June 7, 2
2011-06-07
Method of manufacturing multilayer printed circuit board
Grant 7,929,313 - Ito , et al. April 19, 2
2011-04-19
Printed wiring board and method of manufacturing the same
Grant 7,902,463 - Takahashi , et al. March 8, 2
2011-03-08
Multilayer printed wiring board
Grant 7,834,273 - Takahashi , et al. November 16, 2
2010-11-16
Multilayer Printed Wiring Board
App 20100252318 - TAKAHASHI; Michimasa ;   et al.
2010-10-07
Multilayer printed wiring board
Grant 7,759,582 - Takahashi , et al. July 20, 2
2010-07-20
Multilayer Printed Wiring Board
App 20100155130 - Takahashi; Michimasa ;   et al.
2010-06-24
Multilayer Printed Circuit Board And The Manufacturing Method Thereof
App 20100159647 - ITO; Sotaro ;   et al.
2010-06-24
Printed Wiring Board And Method Of Manufacturing The Same
App 20100021627 - Takahashi; Michimasa ;   et al.
2010-01-28
Multilayer Printed Wiring Board
App 20090255111 - Takahashi; Michimasa ;   et al.
2009-10-15
Multilayer Wiring Board And Method Of Manufacturing The Same
App 20090188703 - ITO; Sotaro ;   et al.
2009-07-30
Flex-Rigid Wiring Board and Manufacturing Method Thereof
App 20080289859 - Mikado; Yukinobu ;   et al.
2008-11-27
Flex-rigid wiring board
Grant 7,423,219 - Kawaguchi , et al. September 9, 2
2008-09-09
Printed Wiring Board And Method Of Manufacturing The Same
App 20080185172 - Takahashi; Michimasa ;   et al.
2008-08-07
Flex-rigid Wiring Board
App 20080107802 - Kawaguchi; Katsuo ;   et al.
2008-05-08
Multilayered Printed Circuit Board And The Manufacturing Method Thereof
App 20080007927 - Ito; Sotaro ;   et al.
2008-01-10
Multilayer printed wiring board
App 20070154741 - Takahashi; Michimasa ;   et al.
2007-07-05
Multilayered printed circuit board and method for manufacturing the same
App 20070095471 - Ito; Sotaro ;   et al.
2007-05-03
Multilayered printed wiring board
App 20070096328 - Takahashi; Michimasa ;   et al.
2007-05-03
Rigid-flex wiring board and method for producing same
App 20070012475 - Kawaguchi; Katsuo ;   et al.
2007-01-18
Printed wiring board and method for manufacturing the same
Grant 6,242,079 - Mikado , et al. June 5, 2
2001-06-05

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