loadpatents
Patent applications and USPTO patent grants for Mihelcic; Stan.The latest application filed is for "structured integrated circuit device".
Patent | Date |
---|---|
Structured integrated circuit device Grant 7,463,062 - Or-Bach , et al. December 9, 2 | 2008-12-09 |
Structured Integrated Circuit Device App 20070188188 - Or-Bach; Zvi ;   et al. | 2007-08-16 |
Methods for optimizing package and silicon co-design of integrated circuit Grant 7,117,467 - Ali , et al. October 3, 2 | 2006-10-03 |
Embedded redistribution interposer for footprint compatible chip package conversion Grant 7,098,528 - Vasishta , et al. August 29, 2 | 2006-08-29 |
Methods for optimizing package and silicon co-design of integrated circuit App 20060036987 - Ali; Anwar ;   et al. | 2006-02-16 |
Multi-chip package having a contiguous heat spreader assembly Grant 6,963,129 - Evans , et al. November 8, 2 | 2005-11-08 |
Embedded redistribution interposer for footprint compatible chip package conversion App 20050133935 - Vasishta, Ronnie ;   et al. | 2005-06-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.