Mihara; Naoaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mihara; Naoaki.The latest application filed is for "electrically conductive adhesive film and dicing-die bonding film using the same".

Company Profile

5.12.16

Mihara; Naoaki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same Grant 11,306,225 - Sato , et al. April 19, 2	2022-04-19
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,230,649 - Mihara , et al. January 25, 2	2022-01-25
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,193,047 - Mihara , et al. December 7, 2	2021-12-07
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,136,479 - Mihara , et al. October 5, 2	2021-10-05
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,098,226 - Mihara , et al. August 24, 2	2021-08-24
Electrically conductive adhesive film and dicing-die bonding film using the same Grant 11,066,577 - Mihara , et al. July 20, 2	2021-07-20
Electrically conductive composition Grant 10,689,550 - Mihara , et al.	2020-06-23
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20190016928 - Mihara; Naoaki ; et al.	2019-01-17
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20190016929 - Mihara; Naoaki ; et al.	2019-01-17
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20180346767 - Mihara; Naoaki ; et al.	2018-12-06
Electrically Conductive Adhesive Film And Dicing-die Bonding Film Using The Same App 20180346766 - Mihara; Naoaki ; et al.	2018-12-06
Electrically Conductive Adhesive Agent Composition, And Electrically Conductive Adhesive Film And Dicing-die-bonding Film Using The Same App 20180346768 - Sato; Shunichiro ; et al.	2018-12-06
Electrically Conductive Adhesive Film And Dicing Die Bonding Film App 20180294242 - MIHARA; Naoaki ; et al.	2018-10-11
Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element Grant 10,084,153 - Mihara , et al. September 25, 2	2018-09-25
Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device Grant 10,043,996 - Aoyama , et al. August 7, 2	2018-08-07
Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films Grant 9,913,324 - Mihara , et al. March 6, 2	2018-03-06
Electrically Conductive Adhesive Film And Dicing Die Bonding Film App 20180026003 - MIHARA; Naoaki ; et al.	2018-01-25
Electrically Conductive Composition App 20170369746 - MIHARA; Naoaki ; et al.	2017-12-28
Filler material for organic electroluminescent element and method of sealing organic electroluminescent element Grant 9,793,511 - Mihara , et al. October 17, 2	2017-10-17
Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image Grant 9,758,690 - Ishiguro , et al. September 12, 2	2017-09-12
Conductive Adhesive Film App 20170152411 - MIHARA; Naoaki ; et al.	2017-06-01
Filler Material For Organic Electroluminescent Element And Method Of Sealing Organic Electroluminiscent Element App 20160308165 - MIHARA; Naoaki ; et al.	2016-10-20
Filler Material For Organic Electroluminescent Element And Method Of Sealing Organic Electroluminescent Element App 20160308164 - MIHARA; Naoaki ; et al.	2016-10-20
Sealant Composition And Sealing Sheet Obtained From The Composition App 20160017186 - AOYAMA; Masami ; et al.	2016-01-21
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device App 20160020423 - SAITO; Keiji ; et al.	2016-01-21
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device App 20160020426 - AOYAMA; Masami ; et al.	2016-01-21
Transparent Resin Composition For Sealing Organic Electroluminescence Element, Resin Sheet For Sealing Organic Electroluminescence Element, And Apparatus For Displaying Image App 20150291824 - ISHIGURO; Kunihiko ; et al.	2015-10-15
Resin Composition For Sealing Organic Electroluminescent Element, Sealing Film For Organic Electroluminescent Element, Gas-barrier Film For Organic Electroluminescent Element, And Organic Electroluminescent Element Using These Films App 20150091436 - MIHARA; Naoaki ; et al.	2015-04-02

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