Mieth; Henning

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mieth; Henning.The latest application filed is for "method for manufacturing a wafer level package".

Company Profile

0.4.7

Mieth; Henning - Jahnsdorf DE
Mieth, Henning - Jahnsdorg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing a wafer level package Grant 7,867,817 - Dobritz , et al. January 11, 2	2011-01-11
Method for Manufacturing a Wafer Level Package App 20090194881 - Dobritz; Stephan ; et al.	2009-08-06
Semiconductor Device and Method for Making Same App 20080272503 - Mieth; Henning	2008-11-06
Method of producing a package for semiconductor chips Grant 7,326,593 - Bischof , et al. February 5, 2	2008-02-05
Methods of producing a package for semiconductor chips App 20060211166 - Bischof; Andreas ; et al.	2006-09-21
Support matrix with bonding channel for integrated semiconductors, and method for producing it Grant 6,979,887 - Kahlisch , et al. December 27, 2	2005-12-27
Supporting structure for a chip and method for producing the same App 20040159928 - Kahlisch, Knut ; et al.	2004-08-19
Method of marking substandard parts App 20040022959 - Kahlisch, Knut ; et al.	2004-02-05
Support matrix for integrated semiconductors, and method for producing it Grant 6,605,864 - Kahlisch , et al. August 12, 2	2003-08-12
Support matrix for integrated semiconductors, and method for producing it App 20020006688 - Kahlisch, Knut ; et al.	2002-01-17
Support matrix with bonding channel for integrated semiconductors, and method for producing it App 20020003295 - Kahlisch, Knut ; et al.	2002-01-10

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