Miersch; Ekkehard F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miersch; Ekkehard F..The latest application filed is for "discrete fabrication of multi-layer thin film, wiring structures".
- Miersch; Ekkehard F. - Schoenaich DE
- Miersch; Ekkehard F. - Rye NY
- Miersch; Ekkehard F. - Mamaroneck NY
- Miersch; Ekkehard F. - Boeblingen DE
| Patent | Date |
|---|---|
| Discrete fabrication of multi-layer thin film, wiring structures Grant 5,232,548 - Ehrenberg , et al. August 3, 1 | 1993-08-03 |
| Method of fabricating nendritic materials Grant 5,185,073 - Bindra , et al. February 9, 1 | 1993-02-09 |
| Forming a pattern on a substrate Grant 5,173,392 - Miersch , et al. December 22, 1 | 1992-12-22 |
| Separable electrical connection technology Grant 5,137,461 - Bindra , et al. August 11, 1 | 1992-08-11 |
| Forming a pattern on a substrate Grant 5,122,439 - Miersch , et al. June 16, 1 | 1992-06-16 |
| Multilevel integrated circuit packaging structures Grant 5,028,983 - Bickford , et al. July 2, 1 | 1991-07-02 |
| Electrically switchable permanent storage Grant 4,445,202 - Goetze , et al. April 24, 1 | 1984-04-24 |
| Thin film metal package for LSI chips Grant 4,295,183 - Miersch , et al. October 13, 1 | 1981-10-13 |
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