loadpatents
name:-0.0051388740539551
name:-0.0038979053497314
name:-0.00043010711669922
Miera; Michele L. Patent Filings

Miera; Michele L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miera; Michele L..The latest application filed is for "die crack detector with integrated one-time programmable element".

Company Profile
0.7.7
  • Miera; Michele L. - Gilbert AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Die crack detector with integrated one-time programmable element
Grant 9,646,897 - Sanchez , et al. May 9, 2
2017-05-09
LDMOS minority carrier shunting
Grant 9,123,804 - Ren , et al. September 1, 2
2015-09-01
Die Crack Detector With Integrated One-time Programmable Element
App 20150115266 - SANCHEZ; Audel A. ;   et al.
2015-04-30
Ldmos Device With Minority Carrier Shunt Region
App 20140284716 - Ren; Xiaowei ;   et al.
2014-09-25
LDMOS device with minority carrier shunt region
Grant 8,772,870 - Ren , et al. July 8, 2
2014-07-08
LDMOS Device with Minority Carrier Shunt Region
App 20140117446 - Ren; Xiaowei ;   et al.
2014-05-01
Electronic elements and devices with trench under bond pad feature
Grant 8,134,241 - Jones , et al. March 13, 2
2012-03-13
Electronic Elements And Devices With Trench Under Bond Pad Feature
App 20110266687 - Jones; Jeffrey K. ;   et al.
2011-11-03
Methods for forming an RF device with trench under bond pad feature
Grant 7,998,852 - Jones , et al. August 16, 2
2011-08-16
Rf Device And Method With Trench Under Bond Pad Feature
App 20100140814 - Jones; Jeffrey K. ;   et al.
2010-06-10

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