loadpatents
name:-0.020367860794067
name:-0.017693996429443
name:-0.0044419765472412
MIEDA; Tetsuya Patent Filings

MIEDA; Tetsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for MIEDA; Tetsuya.The latest application filed is for "insulating tape for coating connection portion of power cable, method for forming insulating coating on exterior surface of connection portion of power cable, and power cable".

Company Profile
3.15.20
  • MIEDA; Tetsuya - Tokyo JP
  • Mieda; Tetsuya - Nagoya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Insulating Tape For Coating Connection Portion Of Power Cable, Method For Forming Insulating Coating On Exterior Surface Of Connection Portion Of Power Cable, And Power Cable
App 20220157486 - MIEDA; Tetsuya ;   et al.
2022-05-19
Insulating Resin Composition And Production Method Therefor, Insulating Tape And Production Method Therefor, Insulating Layer Formation Method, And Power Cable And Production Method Therefor
App 20220157488 - MIEDA; Tetsuya ;   et al.
2022-05-19
Resin composition for sealing organic electronic device element, resin sheet for sealing organic electronic device element, organic electroluminescent element, and image display apparatus
Grant 11,139,449 - Mieda , et al. October 5, 2
2021-10-05
Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same
Grant 10,988,646 - Mieda , et al. April 27, 2
2021-04-27
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
Grant 10,829,670 - Mieda November 10, 2
2020-11-10
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
Grant 10,829,669 - Mieda , et al. November 10, 2
2020-11-10
Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device
Grant 10,556,974 - Mieda , et al. Feb
2020-02-11
Resin composition for sealing electronic device, and electronic device
Grant 10,196,534 - Asanuma , et al. Fe
2019-02-05
Transparent resin composition for organic electroluminescent element sealing, resin sheet for organic electroluminescent element sealing, and image display device
Grant 10,115,904 - Ishiguro , et al. October 30, 2
2018-10-30
Adhesive Composition, And Method Of Bonding An Adherend And Method Of Producing A Stack, Each Of Which Uses The Same
App 20180291242 - MIEDA; Tetsuya ;   et al.
2018-10-11
Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element
Grant 10,084,153 - Mihara , et al. September 25, 2
2018-09-25
Resin composition for sealing electronic devices, and electronic device
Grant 10,079,360 - Mieda , et al. September 18, 2
2018-09-18
Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device
Grant 10,043,996 - Aoyama , et al. August 7, 2
2018-08-07
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Resin Cured Material, And Electronic Device
App 20180208804 - MIEDA; Tetsuya ;   et al.
2018-07-26
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Resin Cured Material, And Electronic Device
App 20180208805 - MIEDA; Tetsuya
2018-07-26
Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films
Grant 9,913,324 - Mihara , et al. March 6, 2
2018-03-06
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Sealing Resin, And Electronic Device
App 20170327608 - MIEDA; Tetsuya ;   et al.
2017-11-16
Resin Composition For Sealing Electronic Devices, And Electronic Device
App 20170331070 - MIEDA; Tetsuya ;   et al.
2017-11-16
Filler material for organic electroluminescent element and method of sealing organic electroluminescent element
Grant 9,793,511 - Mihara , et al. October 17, 2
2017-10-17
Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image
Grant 9,758,690 - Ishiguro , et al. September 12, 2
2017-09-12
Resin Composition For Sealing Organic Electronic Device Element, Resin Sheet For Sealing Organic Electronic Device Element, Organic Electroluminescent Element, And Image Display Apparatus
App 20170047548 - MIEDA; Tetsuya ;   et al.
2017-02-16
Resin Composition For Sealing Electronic Device, And Electronic Device
App 20160362576 - ASANUMA; Takumi ;   et al.
2016-12-15
Filler Material For Organic Electroluminescent Element And Method Of Sealing Organic Electroluminescent Element
App 20160308164 - MIHARA; Naoaki ;   et al.
2016-10-20
Filler Material For Organic Electroluminescent Element And Method Of Sealing Organic Electroluminiscent Element
App 20160308165 - MIHARA; Naoaki ;   et al.
2016-10-20
Resin composition for sealing organic electroluminescent device; method of producing the same; and adhesive film, gas-barrier film, organic electroluminescent device and organic electroluminescent panel using the resin composition
Grant 9,257,671 - Suzuki , et al. February 9, 2
2016-02-09
Sealant Composition And Sealing Sheet Obtained From The Composition
App 20160017186 - AOYAMA; Masami ;   et al.
2016-01-21
Element Sealing Resin Composition For Organic Electronic Device, Element Sealing Resin Sheet For Organic Electronic Device, Organic Electroluminescence Element, And Image Display
App 20160017197 - MIEDA; Tetsuya ;   et al.
2016-01-21
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device
App 20160020423 - SAITO; Keiji ;   et al.
2016-01-21
Resin Composition For Element Encapsulation For Organic Electronic Devices, Resin Sheet For Element Encapsulation For Organic Electronic Devices, Organic Electroluminescent Element, And Image Display Device
App 20160020426 - AOYAMA; Masami ;   et al.
2016-01-21
Transparent Resin Composition For Organic Electroluminescent Element Sealing, Resin Sheet For Organic Electroluminescent Element Sealing, And Image Diplay Device
App 20160005973 - ISHIGURO; Kunihiko ;   et al.
2016-01-07
Transparent Resin Composition For Sealing Organic Electroluminescence Element, Resin Sheet For Sealing Organic Electroluminescence Element, And Apparatus For Displaying Image
App 20150291824 - ISHIGURO; Kunihiko ;   et al.
2015-10-15
Resin Composition For Sealing Organic Electroluminescent Element, Sealing Film For Organic Electroluminescent Element, Gas-barrier Film For Organic Electroluminescent Element, And Organic Electroluminescent Element Using These Films
App 20150091436 - MIHARA; Naoaki ;   et al.
2015-04-02
Resin Composition For Sealing Organic Electroluminescent Device; Method Of Producing The Same; And Adhesive Film, Gas-barrier Film, Organic Electroluminescent Device And Organic Electroluminescent Panel Using The Resin Composition
App 20140291655 - SUZUKI; Toshihiro ;   et al.
2014-10-02
Semiconductor-sealing resin composition and semiconductor device using it
Grant 6,656,996 - Tsutsumi , et al. December 2, 2
2003-12-02
Semiconductor-sealing resin composition and semiconductor device using it
App 20030027918 - Tsutsumi, Yasuaki ;   et al.
2003-02-06

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