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Patent applications and USPTO patent grants for Microelectronics Assembly Technologies, Inc..The latest application filed is for "rigid circuit board with flexibly attached module".
Patent | Date |
---|---|
Rigid circuit board with flexibly attached module Grant 9,746,879 - Clayton , et al. August 29, 2 | 2017-08-29 |
Compression connector system Grant 8,899,994 - Clayton , et al. December 2, 2 | 2014-12-02 |
Flexible circuit board and connection system Grant 8,817,458 - Clayton , et al. August 26, 2 | 2014-08-26 |
Thin multi-chip flex module Grant 8,559,181 - Clayton , et al. October 15, 2 | 2013-10-15 |
Thin multi-chip flex module Grant 8,345,431 - Clayton , et al. January 1, 2 | 2013-01-01 |
Thin multi-chip flex module Grant RE42,252 - Clayton , et al. March 29, 2 | 2011-03-29 |
Thin multi-chip flex module Grant 7,796,399 - Clayton , et al. September 14, 2 | 2010-09-14 |
Thin multichip flex-module Grant 7,787,254 - Clayton , et al. August 31, 2 | 2010-08-31 |
Thin multi-chip flex module Grant 7,724,530 - Clayton , et al. May 25, 2 | 2010-05-25 |
Thin multichip flex-module Grant 7,429,788 - Clayton , et al. September 30, 2 | 2008-09-30 |
Thin multichip flex-module Grant 7,393,226 - Clayton , et al. July 1, 2 | 2008-07-01 |
Thin multichip flex-module Grant 7,394,149 - Clayton , et al. July 1, 2 | 2008-07-01 |
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