| Patent | Date |
|---|
Selective patterning of metallization on a dielectric substrate
Grant 5,830,533 - Lin , et al. November 3, 1 | 1998-11-03 |
Methods for fabricating flat panel display systems and components
Grant 5,601,966 - Kumar , et al. February 11, 1 | 1997-02-11 |
Parallel optical transceiver link
Grant 5,574,814 - Noddings , et al. November 12, 1 | 1996-11-12 |
Electrical interconnect device with customizeable surface layer and interwoven signal lines
Grant 5,544,018 - Sommerfeldt , et al. August 6, 1 | 1996-08-06 |
Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
Grant 5,508,228 - Nolan , et al. April 16, 1 | 1996-04-16 |
Electronic proof of receipt
Grant 5,509,071 - Petrie, Jr. , et al. April 16, 1 | 1996-04-16 |
Pattern recognition neural network with saccade-like operation
Grant 5,500,905 - Martin , et al. March 19, 1 | 1996-03-19 |
High force compression flip chip bonding system
Grant 5,462,217 - Simmons , et al. October 31, 1 | 1995-10-31 |
Diode structure flat panel display
Grant 5,449,970 - Kumar , et al. September 12, 1 | 1995-09-12 |
Pattern recognition neural network
Grant 5,440,651 - Martin August 8, 1 | 1995-08-08 |
Customizable circuitry
Grant 5,438,166 - Carey , et al. * August 1, 1 | 1995-08-01 |
Superconducting semiconducting cross-bar circuit
Grant 5,434,530 - Ghoshal , et al. July 18, 1 | 1995-07-18 |
Continuous superconductor to semiconductor converter circuit
Grant 5,424,656 - Gibson , et al. June 13, 1 | 1995-06-13 |
Method of making field emission tips using physical vapor deposition of random nuclei as etch mask
Grant 5,399,238 - Kumar * March 21, 1 | 1995-03-21 |
Composition for three-dimensional metal fabrication using a laser
Grant 5,393,613 - MacKay February 28, 1 | 1995-02-28 |
Superconductor-semiconductor hybrid memory circuits with superconducting three-terminal switching devices
Grant 5,388,068 - Ghoshal , et al. February 7, 1 | 1995-02-07 |
Method of making three dimensional integrated circuit interconnect module
Grant 5,383,269 - Rathmell , et al. January 24, 1 | 1995-01-24 |
Method of forming etch mask using particle beam deposition
Grant 5,382,315 - Kumar * January 17, 1 | 1995-01-17 |
Compact adapter package providing peripheral to area translation for an integrated circuit chip
Grant 5,379,191 - Carey , et al. January 3, 1 | 1995-01-03 |
Method for producing conductive patterns
Grant 5,358,604 - Lin , et al. October 25, 1 | 1994-10-25 |
Coaxial die and substrate bumps
Grant 5,347,086 - Potter , et al. September 13, 1 | 1994-09-13 |
Field emitter with diamond emission tips
Grant 5,341,063 - Kumar August 23, 1 | 1994-08-23 |
Computer display unit with attribute enhanced scroll bar
Grant 5,339,391 - Wroblewski , et al. August 16, 1 | 1994-08-16 |
Apparatus and method for determining sequential hardware equivalence
Grant 5,331,568 - Pixley July 19, 1 | 1994-07-19 |
Ionized metal cluster beam systems and methods
Grant 5,331,172 - Kumar , et al. July 19, 1 | 1994-07-19 |
Thermally and electrically conductive adhesive material and method of bonding with same
Grant 5,328,087 - Nelson , et al. July 12, 1 | 1994-07-12 |
Computer scalable visualization system
Grant 5,321,505 - Leddy June 14, 1 | 1994-06-14 |
Three-dimensional metal fabrication using a laser
Grant 5,314,003 - Mackay May 24, 1 | 1994-05-24 |
Method of making a field emitter device using randomly located nuclei as an etch mask
Grant 5,312,514 - Kumar May 17, 1 | 1994-05-17 |
Process for making semiconductor electrode bumps by metal cluster ion deposition and etching
Grant 5,290,732 - Kumar , et al. March 1, 1 | 1994-03-01 |
Peripheral to area adapter with protective bumper for an integrated circuit chip
Grant 5,289,346 - Carey , et al. February 22, 1 | 1994-02-22 |
Process for producing electrical circuits with precision surface features
Grant 5,284,548 - Carey , et al. February 8, 1 | 1994-02-08 |
Electrical interconnect device with interwoven power and ground lines and capacitive vias
Grant 5,272,600 - Carey December 21, 1 | 1993-12-21 |
Methods and apparatus for electroplating electrical contacts
Grant 5,271,822 - Nolan , et al. December 21, 1 | 1993-12-21 |
Integrated circuit structure with heat exchanger elements secured thereto and method of making
Grant 5,265,321 - Nelson , et al. November 30, 1 | 1993-11-30 |
Method of fabricating integrated resistors in high density substrates
Grant 5,254,493 - Kumar October 19, 1 | 1993-10-19 |
JJ-MOS read access circuit for MOS memory
Grant 5,253,199 - Gibson October 12, 1 | 1993-10-12 |
Neural-network content-addressable memory
Grant 5,253,328 - Hartman October 12, 1 | 1993-10-12 |
Alkali barrier superconductor Josephson junction and circuit
Grant 5,250,817 - Fink October 5, 1 | 1993-10-05 |
Method of depositing conductive lines on a dielectric
Grant 5,250,329 - Miracky , et al. October 5, 1 | 1993-10-05 |
Method of patterning metal on a substrate using direct-write deposition of a mask
Grant 5,244,538 - Kumar September 14, 1 | 1993-09-14 |
Method of forming recessed patterns in insulating substrates
Grant 5,240,671 - Carey August 31, 1 | 1993-08-31 |
Rework of polymeric dielectric electrical interconnect by laser photoablation
Grant 5,236,551 - Pan August 17, 1 | 1993-08-17 |
Method and apparatus for fabricating superconducting wire
Grant 5,229,358 - Kumar July 20, 1 | 1993-07-20 |
Forming via holes in a multilevel substrate in a single step
Grant 5,227,013 - Kumar July 13, 1 | 1993-07-13 |
Amalgam composition for room temperature bonding
Grant 5,225,157 - McKay July 6, 1 | 1993-07-06 |
Reroute strategy for high density substrates
Grant 5,224,022 - Weigler , et al. June 29, 1 | 1993-06-29 |
Trenching techniques for forming channels, vias and components in substrates
Grant 5,219,787 - Carey , et al. June 15, 1 | 1993-06-15 |
Method and apparatus for removing bonded connections
Grant 5,216,803 - Nolan , et al. June 8, 1 | 1993-06-08 |
Method of forming field emitter device with diamond emission tips
Grant 5,199,918 - Kumar April 6, 1 | 1993-04-06 |
Method and apparatus for applying a compound of a metal and a gas onto a surface
Grant 5,196,102 - Kumar March 23, 1 | 1993-03-23 |
Protective layer for preventing electroless deposition on a dielectric
Grant 5,192,581 - Hirsch , et al. * March 9, 1 | 1993-03-09 |
Automated interconnect routing system
Grant 5,187,671 - Cobb February 16, 1 | 1993-02-16 |
Cylindrical magnetron sputtering system
Grant 5,178,743 - Kumar January 12, 1 | 1993-01-12 |
Solution for direct copper writing
Grant 5,176,744 - Muller January 5, 1 | 1993-01-05 |
Methods of forming channels and vias in insulating layers
Grant 5,173,442 - Carey * December 22, 1 | 1992-12-22 |
Liquid metal paste for thermal and electrical connections
Grant 5,170,930 - Dolbear , et al. * December 15, 1 | 1992-12-15 |
Selective electroless plating process for metal conductors
Grant 5,167,992 - Lin , et al. December 1, 1 | 1992-12-01 |
Method of making a customizable circuitry
Grant 5,165,166 - Carey November 24, 1 | 1992-11-24 |
Diffusion barrier for copper features
Grant 5,164,332 - Kumar November 17, 1 | 1992-11-17 |
Method of making semiconductor bonding bumps using metal cluster ion deposition
Grant 5,156,997 - Kumar , et al. October 20, 1 | 1992-10-20 |
Correcting a defective metallization layer on an electronic component by polishing
Grant 5,142,828 - Curry, II September 1, 1 | 1992-09-01 |
Fabrication of metal pillars in an electronic component using polishing
Grant 5,137,597 - Curry, II , et al. August 11, 1 | 1992-08-11 |
Diaphragm sealing apparatus
Grant 5,132,873 - Nelson , et al. July 21, 1 | 1992-07-21 |
Method of patterned metal reflow on interconnect substrates
Grant 5,124,175 - Miracky , et al. June 23, 1 | 1992-06-23 |
Multilayer electrical interconnect fabrication with few process steps
Grant 5,118,385 - Kumar , et al. June 2, 1 | 1992-06-02 |
Neural network with semi-localized non-linear mapping of the input space
Grant 5,113,483 - Keeler , et al. May 12, 1 | 1992-05-12 |
Method of making a metal-on-elastomer pressure contact connector
Grant 5,101,553 - Carey , et al. April 7, 1 | 1992-04-07 |
Trenching techniques for forming vias and channels in multilayer electrical interconnects
Grant 5,091,339 - Carey February 25, 1 | 1992-02-25 |
Method and apparatus for using desoldering material
Grant 5,072,874 - Bertram , et al. December 17, 1 | 1991-12-17 |
Method of making an electrical multilayer interconnect
Grant 5,071,518 - Pan December 10, 1 | 1991-12-10 |
Electrical beam switch
Grant 5,068,580 - Smith , et al. November 26, 1 | 1991-11-26 |
Thermal heat sink encapsulated integrated circuit
Grant 5,057,903 - Olla October 15, 1 | 1991-10-15 |
Liquid metal paste for thermal and electrical connections
Grant 5,056,706 - Dolbear , et al. October 15, 1 | 1991-10-15 |
Electrical connector system
Grant 5,041,003 - Smith , et al. August 20, 1 | 1991-08-20 |
Flip substrate for chip mount
Grant 5,039,628 - Carey August 13, 1 | 1991-08-13 |
Apparatus for replacing defective electronic components
Grant 5,029,747 - Russo , et al. July 9, 1 | 1991-07-09 |
Superconducting-semiconducting circuits, devices and systems
Grant 5,024,993 - Kroger , et al. June 18, 1 | 1991-06-18 |
Method and system for generating dynamic, interactive visual representations of information structures within a computer
Grant 5,021,976 - Wexelblat , et al. June 4, 1 | 1991-06-04 |
Method of reworking an electrical multilayer interconnect
Grant 5,011,580 - Pan , et al. April 30, 1 | 1991-04-30 |
Method of laser bonding electrical members
Grant 5,008,512 - Spletter , et al. April 16, 1 | 1991-04-16 |
Coiled spring heat transfer element
Grant 4,993,482 - Dolbear , et al. February 19, 1 | 1991-02-19 |
Method of assembling stacks of integrated circuit dies
Grant 4,984,358 - Nelson January 15, 1 | 1991-01-15 |
Method of patterning electroless plated metal on a polymer substrate
Grant 4,981,715 - Hirsch , et al. January 1, 1 | 1991-01-01 |
Method of clamping electrical contacts for laser bonding
Grant 4,978,835 - Luijtjes , et al. December 18, 1 | 1990-12-18 |
Low pressure high heat transfer fluid heat exchanger
Grant 4,953,634 - Nelson , et al. September 4, 1 | 1990-09-04 |
Copper etching solution and method
Grant 4,952,275 - Lin , et al. August 28, 1 | 1990-08-28 |
Fluid heat exchanger for an electronic component
Grant 4,940,085 - Nelson , et al. July 10, 1 | 1990-07-10 |
Method and apparatus for removing solder mounted electronic components
Grant 4,934,582 - Bertram , et al. June 19, 1 | 1990-06-19 |
Flip substrate for chip mount
Grant 4,926,241 - Carey May 15, 1 | 1990-05-15 |
Hermetically sealed multilayer electrical feedthru
Grant 4,922,323 - Potter May 1, 1 | 1990-05-01 |
Method of making a multilevel electrical airbridge interconnect
Grant 4,920,639 - Yee May 1, 1 | 1990-05-01 |
Fluid heat exchanger for an electronic component
Grant 4,909,315 - Nelson , et al. March 20, 1 | 1990-03-20 |
Method of fabricating a high density electrical interconnect
Grant 4,899,439 - Potter , et al. February 13, 1 | 1990-02-13 |
Thin film capacitor
Grant 4,890,192 - Smith December 26, 1 | 1989-12-26 |
Customizable circuitry
Grant 4,888,665 - Smith December 19, 1 | 1989-12-19 |
End fed liquid heat exchanger for an electronic component
Grant 4,884,630 - Nelson , et al. December 5, 1 | 1989-12-05 |
Method and apparatus for adjustably mounting a heat exchanger for an electronic component
Grant 4,882,654 - Nelson , et al. November 21, 1 | 1989-11-21 |
Method of deposition of metal into cavities on a substrate
Grant 4,874,493 - Pan October 17, 1 | 1989-10-17 |
Printed wire connector
Grant 4,871,316 - Herrell , et al. October 3, 1 | 1989-10-03 |
Method of making a flexible interconnect
Grant 4,862,588 - MacKay September 5, 1 | 1989-09-05 |
Discretionary interconnect
Grant 4,859,806 - Smith August 22, 1 | 1989-08-22 |
Electrical interconnect tape
Grant 4,860,088 - Smith , et al. August 22, 1 | 1989-08-22 |
Hermetically sealed package having an electronic component and method of making
Grant 4,852,250 - Andrews August 1, 1 | 1989-08-01 |
Multigigahertz probe
Grant 4,829,242 - Carey , et al. May 9, 1 | 1989-05-09 |
Method of making an electrical multilayer copper interconnect
Grant 4,810,332 - Pan March 7, 1 | 1989-03-07 |
Single point bonding method and apparatus
Grant 4,776,509 - Pitts , et al. October 11, 1 | 1988-10-11 |
Gas heat exchanger
Grant 4,777,560 - Herrell , et al. October 11, 1 | 1988-10-11 |
Fluid-cooled integrated circuit package
Grant 4,758,926 - Herrell , et al. July 19, 1 | 1988-07-19 |
Electrical interconnect support system with low dielectric constant
Grant 4,681,655 - Potter July 21, 1 | 1987-07-21 |
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