MicroAssembly Technologies, Inc.
Patent Applications and Registrations
Patent applications and USPTO patent grants for MicroAssembly Technologies, Inc..The latest application filed is for "mems device with integral packaging".
- MicroAssembly Technologies, Inc. - Richmond CA
| Patent | Date |
|---|---|
| MEMS device with integral packaging Grant 8,295,027 - Cohn , et al. October 23, 2 | 2012-10-23 |
| Mems Device With Integral Packaging App 20120193754 - Cohn; Michael B. ; et al. | 2012-08-02 |
| MEMS device with integral packaging Grant 8,179,215 - Cohn , et al. May 15, 2 | 2012-05-15 |
| Microelectromechanical systems using thermocompression bonding Grant 7,750,462 - Cohn , et al. July 6, 2 | 2010-07-06 |
| High force MEMS device Grant 7,692,521 - Cohn April 6, 2 | 2010-04-06 |
| Mems Device With Integral Packaging App 20080272867 - Cohn; Michael B. ; et al. | 2008-11-06 |
| Microelectromechanical systems using thermocompression bonding Grant 7,276,789 - Cohn , et al. October 2, 2 | 2007-10-02 |
| MEMS device with integral packaging Grant 6,872,902 - Cohn , et al. March 29, 2 | 2005-03-29 |
| Microelectromechanical systems using thermocompression bonding Grant 6,853,067 - Cohn , et al. February 8, 2 | 2005-02-08 |
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