MICRO PROCESSING TECHNOLOGY, INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for MICRO PROCESSING TECHNOLOGY, INC..The latest application filed is for "scribing system with particle remover".
- MICRO PROCESSING TECHNOLOGY, INC. - Lafayette CA US
- MICRO PROCESSING TECHNOLOGY, INC. -
| Patent | Date |
|---|---|
| System for separating devices from a semiconductor wafer Grant 9,153,493 - Lindsey, Jr. October 6, 2 | 2015-10-06 |
| Method using fluid pressure to remove back metal from semiconductor wafer scribe streets Grant 8,906,745 - Lindsey, Jr. , et al. December 9, 2 | 2014-12-09 |
| Method of removing back metal from an etched semiconductor scribe street Grant 8,450,188 - Lindsey, Jr. May 28, 2 | 2013-05-28 |
| System for breaking a semiconductor wafer or other workpiece along a scribe line Grant 8,220,685 - Lindsey, Jr. , et al. July 17, 2 | 2012-07-17 |
| Method and apparatus for improving force control in wafer scribing Grant 7,807,479 - Lindsey, Jr. October 5, 2 | 2010-10-05 |
| Scribing system with particle remover Grant 7,415,916 - Lindsey, Jr. August 26, 2 | 2008-08-26 |
| Scribing tool and method Grant 7,392,732 - Lindsey, Jr. , et al. July 1, 2 | 2008-07-01 |
| Apparatus and method for scribing a semiconductor wafer while controlling scribing forces Grant 7,165,331 - Lindsey, Jr. , et al. January 23, 2 | 2007-01-23 |
| Scribing tool and method App 20060162172 - Lindsey; Paul C. JR. ; et al. | 2006-07-27 |
| Scribing system with particle remover App 20060162173 - Lindsey; Paul C. JR. | 2006-07-27 |
| Semiconductor wafer scribing system Grant 6,826,840 - Lindsey , et al. December 7, 2 | 2004-12-07 |
| Method for fabricating an integrated circuit Grant 6,022,807 - Lindsey, Jr. , et al. February 8, 2 | 2000-02-08 |
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