Patent | Date |
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Antenna sub-array blocks having heat dissipation Grant 11,411,295 - Micovic August 9, 2 | 2022-08-09 |
Antenna Sub-array Blocks Having Heat Dissipation App 20220094031 - Micovic; Miroslav | 2022-03-24 |
Recursive metal embedded chip assembly Grant 10,483,184 - Herrault , et al. Nov | 2019-11-19 |
Monolithic integration of group III nitride epitaxial layers Grant 10,418,473 - Brown , et al. Sept | 2019-09-17 |
Fabrication of microfluidic channels in diamond Grant 10,217,648 - Brown , et al. Feb | 2019-02-26 |
T-gate field effect transistor with non-linear channel layer and/or gate foot face Grant 10,170,611 - Tang , et al. J | 2019-01-01 |
Surface mount package for semiconductor devices with embedded heat spreaders Grant 10,079,160 - Margomenos , et al. September 18, 2 | 2018-09-18 |
Recursive metal embedded chip assembly Grant 10,026,672 - Herrault , et al. July 17, 2 | 2018-07-17 |
Monolithic integration of group III nitride epitaxial layers Grant 9,954,090 - Brown , et al. April 24, 2 | 2018-04-24 |
Stepped field plate wide bandgap field-effect transistor and method Grant 9,929,243 - Corrion , et al. March 27, 2 | 2018-03-27 |
Integrated RF subsystem Grant 9,842,814 - Herrault , et al. December 12, 2 | 2017-12-12 |
Wafer-level die to package and die to die interconnects suspended over integrated heat sinks Grant 9,837,372 - Herrault , et al. December 5, 2 | 2017-12-05 |
Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices Grant 9,780,014 - Margomenos , et al. October 3, 2 | 2017-10-03 |
E-plane probe with stepped surface profile for high-frequency Grant 9,553,057 - Prophet , et al. January 24, 2 | 2017-01-24 |
Methods relating to a group III HFET with a graded barrier layer Grant 9,525,033 - Brown , et al. December 20, 2 | 2016-12-20 |
Near junction cooling for GaN devices Grant 9,496,197 - Micovic , et al. November 15, 2 | 2016-11-15 |
Methods of fabricating self-aligned FETS using multiple sidewall spacers Grant 9,449,833 - Regan , et al. September 20, 2 | 2016-09-20 |
Etch-based fabrication process for stepped field-plate wide-bandgap Grant 9,419,122 - Corrion , et al. August 16, 2 | 2016-08-16 |
Wafer-level die to package and die to die interconnects suspended over integrated heat sinks Grant 9,385,083 - Herrault , et al. July 5, 2 | 2016-07-05 |
Monolithic integration of group III nitride epitaxial layers Grant 9,378,949 - Brown , et al. June 28, 2 | 2016-06-28 |
Systems, methods, and apparatus for a power amplifier module Grant 9,379,680 - Margomenos , et al. June 28, 2 | 2016-06-28 |
Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers Grant 9,337,124 - Herrault , et al. May 10, 2 | 2016-05-10 |
GaN based active cancellation circuit for high power simultaneous transmit and receive systems Grant 9,331,735 - Margomenos , et al. May 3, 2 | 2016-05-03 |
High performance GaN operational amplifier with wide bandwidth and high dynamic range Grant 9,276,529 - Brown , et al. March 1, 2 | 2016-03-01 |
Apparatus and method for reducing the interface resistance in GaN Heterojunction FETs Grant 9,252,247 - Micovic , et al. February 2, 2 | 2016-02-02 |
Apparatus for mounting microelectronic chips Grant 9,214,404 - Margomenos , et al. December 15, 2 | 2015-12-15 |
Etch-based fabrication process for stepped field-plate wide-bandgap Grant 9,202,880 - Corrion , et al. December 1, 2 | 2015-12-01 |
Enhancement mode normally-off gallium nitride heterostructure field effect transistor Grant 9,190,534 - Hussain , et al. November 17, 2 | 2015-11-17 |
Monolithic integration of field-plate and T-gate devices Grant 9,148,092 - Brown , et al. September 29, 2 | 2015-09-29 |
Stepped field plate wide bandgap field-effect transistor and method Grant 9,142,626 - Corrion , et al. September 22, 2 | 2015-09-22 |
Method and structure for encapsulation and interconnection of transistors Grant 9,093,394 - Margomenos , et al. July 28, 2 | 2015-07-28 |
Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices Grant 9,059,140 - Margomenos , et al. June 16, 2 | 2015-06-16 |
Method of fabricating slanted field-plate GaN heterojunction field-effect transistor Grant 8,980,759 - Corrion , et al. March 17, 2 | 2015-03-17 |
Methods relating to a Group III HFET with a Graded Barrier Layer App 20150056764 - Brown; David F. ;   et al. | 2015-02-26 |
Group III-N HFET with a graded barrier layer Grant 8,860,091 - Brown , et al. October 14, 2 | 2014-10-14 |
Monolithic integration of group III nitride epitaxial layers Grant 8,796,736 - Brown , et al. August 5, 2 | 2014-08-05 |
Self-aligned sidewall gate GaN HEMT Grant 8,766,321 - Shinohara , et al. July 1, 2 | 2014-07-01 |
Enhancement and depletion mode GaN HMETs on the same substrate Grant 8,748,244 - Corrion , et al. June 10, 2 | 2014-06-10 |
Enhancement mode normally-off gallium nitride heterostructure field effect transistor Grant 8,728,884 - Hussain , et al. May 20, 2 | 2014-05-20 |
Gate metallization methods for self-aligned sidewall gate GaN HEMT Grant 8,698,201 - Regan , et al. April 15, 2 | 2014-04-15 |
Apparatus and method for reducing the interface resistance in GaN heterojunction FETs Grant 8,686,473 - Micovic , et al. April 1, 2 | 2014-04-01 |
Method of mounting electronic chips Grant 8,617,927 - Margomenos , et al. December 31, 2 | 2013-12-31 |
Method of integrating a plurality of benzocyclobutene layers with a substrate and an associated device Grant 8,592,983 - Sharifi , et al. November 26, 2 | 2013-11-26 |
Group Iii-n Hfet With A Graded Barrier Layer App 20130270572 - Brown; David F. ;   et al. | 2013-10-17 |
Gate metallization methods for self-aligned sidewall gate GaN HEMT Grant 8,558,281 - Regan , et al. October 15, 2 | 2013-10-15 |
Monolithic integration of group III nitride enhancement layers Grant 8,470,652 - Brown , et al. June 25, 2 | 2013-06-25 |
Method Of Integrating A Plurality Of Benzocyclobutene Layers With A Substrate And An Associated Device App 20130140579 - Sharifi; Hasan ;   et al. | 2013-06-06 |
SELF-ALIGNED SIDEWALL GATE GaN HEMT App 20130119400 - Shinohara; Keisuke ;   et al. | 2013-05-16 |
Self aligned sidewall gate GaN HEMT Grant 8,383,471 - Shinihara , et al. February 26, 2 | 2013-02-26 |
Integrated structure with transistors and schottky diodes and process for fabricating the same Grant 8,368,119 - Luh , et al. February 5, 2 | 2013-02-05 |
Ohmic metal contact protection using an encapsulation layer Grant 8,030,688 - Hussain , et al. October 4, 2 | 2011-10-04 |
Integrated structure with transistors and Schottky diodes and process for fabricating the same Grant 7,989,277 - Luh , et al. August 2, 2 | 2011-08-02 |
High efficiency linear microwave power amplifier Grant 7,852,153 - Ellis , et al. December 14, 2 | 2010-12-14 |
Thermal management substrate Grant 7,695,564 - Micovic , et al. April 13, 2 | 2010-04-13 |
Ohmic Metal Contact Protection Using An Encapsulation Layer App 20090250725 - HUSSAIN; Tahir ;   et al. | 2009-10-08 |
High power-low noise microwave GaN heterojunction field effect transistor Grant 7,598,131 - Micovic , et al. October 6, 2 | 2009-10-06 |
Ohmic metal contact and channel protection in GaN devices using an encapsulation layer Grant 7,566,916 - Hussain , et al. July 28, 2 | 2009-07-28 |
High efficiency linear microwave power amplifier Grant 7,477,102 - Ellis , et al. January 13, 2 | 2009-01-13 |
High power-low noise microwave GaN heterojunction field effect transistor Grant 7,470,941 - Micovic , et al. December 30, 2 | 2008-12-30 |
GaN DHFET Grant 7,098,490 - Micovic , et al. August 29, 2 | 2006-08-29 |
Tracking temperature change in birefringent materials Grant 7,025,501 - Johs , et al. April 11, 2 | 2006-04-11 |
Fabrication of low resistance, non-alloyed, ohmic contacts to InP using non-stoichiometric InP layers Grant 6,894,325 - Micovic , et al. May 17, 2 | 2005-05-17 |
Ohmic metal contact and channel protection in GaN devices using an encapsulation layer Grant 6,884,704 - Hussain , et al. April 26, 2 | 2005-04-26 |
Ohmic metal contact and channel protection in GaN devices using an encapsulation layer App 20050048747 - Hussain, Tahir ;   et al. | 2005-03-03 |
Ohmic contacts for high electron mobility transistors and a method of making the same Grant 6,852,615 - Micovic , et al. February 8, 2 | 2005-02-08 |
Tracking temperature change in birefringent materials App 20040258128 - Johs, Blaine D. ;   et al. | 2004-12-23 |
GaN DHFET App 20040238842 - Micovic, Miroslav ;   et al. | 2004-12-02 |
Ohmic metal contact and channel protection in GaN devices using an encapsulation layer App 20040029330 - Hussain, Tahir ;   et al. | 2004-02-12 |
InP collector InGaAsSb base DHBT device and method of forming same Grant 6,670,653 - Micovic , et al. December 30, 2 | 2003-12-30 |
Ohmic contacts for high electron mobility transistors and a method of making the same App 20030227027 - Micovic, Miroslav ;   et al. | 2003-12-11 |
High power-low noise microwave GaN heterojunction field effet transistor App 20030218183 - Micovic, Miroslav ;   et al. | 2003-11-27 |
Fabrication of low resistance, non-alloyed, ohmic contacts to InP using non-stoichiometric InP layers App 20030209729 - Micovic, Miroslav ;   et al. | 2003-11-13 |
Fabrication of low resistance, non-alloyed, ohmic contacts to InP using non-stoichiometric InP layers Grant 6,287,946 - Micovic , et al. September 11, 2 | 2001-09-11 |