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MICLA; Wedanni Linsangan Patent Filings

MICLA; Wedanni Linsangan

Patent Applications and Registrations

Patent applications and USPTO patent grants for MICLA; Wedanni Linsangan.The latest application filed is for "reliable semiconductor packages".

Company Profile
1.4.5
  • MICLA; Wedanni Linsangan - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Reliable Semiconductor Packages
App 20210391368 - TRESNADO; Dennis Fernandez ;   et al.
2021-12-16
Reliable semiconductor packages
Grant 11,177,301 - Tan , et al. November 16, 2
2021-11-16
Reliable Semiconductor Packages
App 20200161351 - TAN; Hua Hong ;   et al.
2020-05-21
Semiconductor packages and methods of packaging semiconductor devices
Grant 10,354,934 - Suthiwongsunthorn , et al. July 16, 2
2019-07-16
Semiconductor Packages And Methods Of Packaging Semiconductor Devices
App 20180240726 - SUTHIWONGSUNTHORN; Nathapong ;   et al.
2018-08-23
Semiconductor packages and methods of packaging semiconductor devices
Grant 9,978,658 - Suthiwongsunthorn , et al. May 22, 2
2018-05-22
Semiconductor Packages And Methods Of Packaging Semiconductor Devices
App 20170077007 - SUTHIWONGSUNTHORN; Nathapong ;   et al.
2017-03-16
Semiconductor packages and methods of packaging semiconductor devices
Grant 9,508,623 - Suthiwongsunthorn , et al. November 29, 2
2016-11-29
Semiconductor Packages And Methods Of Packaging Semiconductor Devices
App 20150357256 - SUTHIWONGSUNTHORN; Nathapong ;   et al.
2015-12-10

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