Michelt; Berthold

Patent Applications and Registrations

Patent applications and USPTO patent grants for Michelt; Berthold.The latest application filed is for "optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head".

Company Profile

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Michelt; Berthold - Wiesbaden DE

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Patent Activity

Patent	Date
Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head Grant 9,982,994 - Schonleber , et al. May 29, 2	2018-05-29
Optical Measuring Method And Measuring Device Having A Measuring Head For Capturing A Surface Topography By Calibrating The Orientation Of The Measuring Head App 20170234678 - Schonleber; Martin ; et al.	2017-08-17
Optical measuring method and measuring device having a measuring head for capturing a surface topography by calibrating the orientation of the measuring head Grant 9,677,871 - Schonleber , et al. June 13, 2	2017-06-13
Optical measuring device and method for acquiring in situ a stage height between a support and an edge region of an object Grant 9,500,471 - Michelt , et al. November 22, 2	2016-11-22
Test device for testing a bonding layer between wafer-shaped samples and test process for testing the bonding layer Grant 9,494,409 - Schonleber , et al. November 15, 2	2016-11-15
Optical Measuring Method And Measuring Device Having A Measuring Head For Capturing A Surface Topography By Calibrating The Orientation Of The Measuring Head App 20150260504 - Schonleber; Martin ; et al.	2015-09-17
Optical Measurement Device for Detecting Distance Differences and Optical Measurement Method App 20140368830 - MICHELT; Berthold ; et al.	2014-12-18
Monitoring apparatus and method for in-situ measurement of wafer thicknesses for monitoring the thinning of semiconductor wafers and thinning apparatus comprising a wet etching apparatus and a monitoring apparatus Grant 8,716,039 - Dusemund , et al. May 6, 2	2014-05-06
Monitoring Apparatus And Method For In-situ Measurement Of Wafer Thicknesses For Monitoring The Thinning Of Semiconductor Wafers And Thinning Apparatus Comprising A Wet Etching Apparatus And A Monitoring Apparatus App 20130034918 - Dusemund; Claus ; et al.	2013-02-07
Test Device For Testing A Bonding Layer Between Wafer-shaped Samples And Test Process For Testing The Bonding Layer App 20120320380 - Schonleber; Martin ; et al.	2012-12-20
Device and method for the contactless measurement of at least one curved surface App 20070242279 - Michelt; Berthold ; et al.	2007-10-18

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