Michel; Willy
Patent Applications and Registrations
Patent applications and USPTO patent grants for Michel; Willy.The latest application filed is for "method of bonding two substrates".
- Michel; Willy - Lunel FR
- Michel; Willy - Grenoble FR
- Michel; Willy - Burgdorf CH
| Patent | Date |
|---|---|
| Method of bonding two substrates Grant 8,349,703 - Kerdiles , et al. January 8, 2 | 2013-01-08 |
| Method for fabricating a compound-material wafer Grant 7,892,861 - Ecarnot , et al. February 22, 2 | 2011-02-22 |
| Method Of Bonding Two Substrates App 20100093152 - Kerdiles; Sebastien ; et al. | 2010-04-15 |
| Bonding interface quality by cold cleaning and hot bonding Grant 7,645,682 - Kerdiles , et al. January 12, 2 | 2010-01-12 |
| Bonding Interface Quality By Cold Cleaning And Hot Bonding App 20080200008 - Kerdiles; Sebastien ; et al. | 2008-08-21 |
| Method for fabricating a compound-material and method for choosing a wafer App 20070231931 - Ecarnot; Ludovic ; et al. | 2007-10-04 |
| Sensor system including a port body Grant 6,945,955 - Michel , et al. September 20, 2 | 2005-09-20 |
| Glucose measuring device Grant 5,695,623 - Michel , et al. December 9, 1 | 1997-12-09 |
| Needle system fastening mechanism Grant 5,611,786 - Kirchhofer , et al. March 18, 1 | 1997-03-18 |
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