loadpatents
Patent applications and USPTO patent grants for Michel; Bruno.The latest application filed is for "compact adsorption heat exchangers".
Patent | Date |
---|---|
Compact Adsorption Heat Exchangers App 20220178592 - Ruch; Patrick ;   et al. | 2022-06-09 |
New Dialkyl Tin Oxide Composition And Process For Producing 2-dimethylaminoethyl (meth)acrylate App 20210309605 - FAVERO; Cedrick ;   et al. | 2021-10-07 |
Photovoltaic system with non-uniformly cooled photovoltaic cells Grant 11,094,840 - Loertscher , et al. August 17, 2 | 2021-08-17 |
Photovoltaic system with non-uniformly cooled photovoltaic cells Grant 11,063,167 - Loertscher , et al. July 13, 2 | 2021-07-13 |
Ear Device For Heat Stroke Detection App 20210137457 - Matsumoto; Keiji ;   et al. | 2021-05-13 |
Photovoltaic module Grant 10,972,048 - Loertscher , et al. April 6, 2 | 2021-04-06 |
Photovoltaic module Grant 10,972,047 - Loertscher , et al. April 6, 2 | 2021-04-06 |
Adsorption heat exchanger devices Grant 10,882,145 - Brunschwiler , et al. January 5, 2 | 2021-01-05 |
Solid sorption refrigeration Grant 10,688,553 - Michel , et al. | 2020-06-23 |
Device and method for converting heat into mechanical energy Grant 10,683,776 - Burg , et al. | 2020-06-16 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20200144169 - Bernstein; Kerry ;   et al. | 2020-05-07 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 10,622,294 - Bernstein , et al. | 2020-04-14 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 10,586,760 - Bernstein , et al. | 2020-03-10 |
Optical sensing device with multiple field-enhanced nano-volumes Grant 10,564,091 - Gruber , et al. Feb | 2020-02-18 |
Selectively Functionalized Porous Material App 20200030784 - Dubois; Geraud J. ;   et al. | 2020-01-30 |
Adsorption heat exchanger devices Grant 10,533,779 - Goicochea , et al. Ja | 2020-01-14 |
Selectively functionalized porous material Grant 10,471,418 - Dubois , et al. Nov | 2019-11-12 |
Photovoltaic thermal hybrid systems and method of operation thereof Grant 10,320,328 - Escher , et al. | 2019-06-11 |
Method and device for cooling a heat generating component Grant 10,278,306 - Brunschwiler , et al. | 2019-04-30 |
Optical Sensing Device With Multiple Field-enhanced Nano-volumes App 20190056309 - Gruber; Cynthia ;   et al. | 2019-02-21 |
Photovoltaic System With Non-uniformly Cooled Photovoltaic Cells App 20180323326 - Loertscher; Emanuel ;   et al. | 2018-11-08 |
Adsorption Heat Exchanger Devices App 20180281127 - Brunschwiler; Thomas J. ;   et al. | 2018-10-04 |
Method and device for cooling a heat generating component Grant 10,091,909 - Brunschwiler , et al. October 2, 2 | 2018-10-02 |
Photovoltaic Module App 20180248512 - Loertscher; Emanuel ;   et al. | 2018-08-30 |
Photovoltaic Module App 20180248511 - Loertscher; Emanuel ;   et al. | 2018-08-30 |
Photovoltaic system with non-uniformly cooled photovoltaic cells Grant 10,050,165 - Loertscher , et al. August 14, 2 | 2018-08-14 |
Adsorption heat exchanger devices Grant 10,041,709 - Brunschwiler , et al. August 7, 2 | 2018-08-07 |
Cooling electronic components and supplying power to the electronic components Grant 10,031,562 - Doering , et al. July 24, 2 | 2018-07-24 |
Light-reflecting grating structure for photovoltaic devices Grant 9,985,147 - Michel , et al. May 29, 2 | 2018-05-29 |
Adsorbing heat exchanger Grant 9,951,977 - Michel , et al. April 24, 2 | 2018-04-24 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20180090428 - Bernstein; Kerry ;   et al. | 2018-03-29 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20180090427 - Bernstein; Kerry ;   et al. | 2018-03-29 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,905,505 - Bernstein , et al. February 27, 2 | 2018-02-27 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,905,506 - Bernstein , et al. February 27, 2 | 2018-02-27 |
Cooling device with nested chambers for computer hardware Grant 9,880,595 - Brunschwiler , et al. January 30, 2 | 2018-01-30 |
Solid sorption refrigeration Grant 9,855,595 - Michel , et al. January 2, 2 | 2018-01-02 |
Cooling Device With Nested Chambers For Computer Hardware App 20170357297 - BRUNSCHWILER; Thomas ;   et al. | 2017-12-14 |
Adsorption heat exchanger devices Grant 9,821,418 - Brunschwiler , et al. November 21, 2 | 2017-11-21 |
Photovoltaic System With Non-uniformly Cooled Photovoltaic Cells App 20170294549 - Loertscher; Emanuel ;   et al. | 2017-10-12 |
Working fluid for a device, device and method for converting heat into mechanical energy Grant 9,739,179 - Burg , et al. August 22, 2 | 2017-08-22 |
Adsorption Heat Exchanger Devices App 20170131007 - Brunschwiler; Thomas J. ;   et al. | 2017-05-11 |
Desalination system and method for desalination Grant 9,630,862 - Escher , et al. April 25, 2 | 2017-04-25 |
Selectively Functionalized Porous Material App 20170106362 - Dubois; Geraud J. ;   et al. | 2017-04-20 |
System and method for cooling and delivering power to a computer system Grant 9,591,791 - Cossale , et al. March 7, 2 | 2017-03-07 |
Adsorbing Heat Exchanger App 20170030612 - Michel; Bruno ;   et al. | 2017-02-02 |
Device And Method For Converting Heat Into Mechanical Energy App 20160319703 - Burg; Brian ;   et al. | 2016-11-03 |
Photovoltaic Thermal Hybrid Systems And Method Of Operation Thereof App 20160322933 - Escher; Werner ;   et al. | 2016-11-03 |
Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network Grant 9,471,089 - Gusat , et al. October 18, 2 | 2016-10-18 |
Desalination System And Method For Desalination App 20160289095 - Escher; Werner ;   et al. | 2016-10-06 |
Working Fluid For A Device, Device And Method For Converting Heat Into Mechanical Energy App 20160265390 - Burg; Brian ;   et al. | 2016-09-15 |
Photovoltaic thermal hybrid systems and method of operation thereof Grant 9,437,766 - Escher , et al. September 6, 2 | 2016-09-06 |
Adsorption Heat Exchanger Devices App 20160252278 - Goicochea; Javier V. ;   et al. | 2016-09-01 |
Desalination system and method for desalination Grant 9,416,031 - Escher , et al. August 16, 2 | 2016-08-16 |
Electronic Circuit Device With Electromagnetic Clock Signal Conveyed Along Cooling Fluid Conduit Network App 20160209865 - Gusat; Mircea ;   et al. | 2016-07-21 |
Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium Grant 9,398,730 - Gusat , et al. July 19, 2 | 2016-07-19 |
Transferring heat through an optical layer of integrated circuitry Grant 9,337,122 - Barowski , et al. May 10, 2 | 2016-05-10 |
Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network Grant 9,304,533 - Gusat , et al. April 5, 2 | 2016-04-05 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20160049353 - Bernstein; Kerry ;   et al. | 2016-02-18 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20160049360 - BERNSTEIN; KERRY ;   et al. | 2016-02-18 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,252,071 - Bernstein , et al. February 2, 2 | 2016-02-02 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 9,252,072 - Bernstein , et al. February 2, 2 | 2016-02-02 |
Photovoltaic thermal hybrid solar receivers Grant 9,219,183 - Escher , et al. December 22, 2 | 2015-12-22 |
Photovoltaic module cooling devices Grant 9,153,722 - Escher , et al. October 6, 2 | 2015-10-06 |
Surface treatment Grant 9,110,056 - Amontov , et al. August 18, 2 | 2015-08-18 |
Transferring Heat Through An Optical Layer Of Integrated Circuitry App 20150221575 - Barowski; Harry ;   et al. | 2015-08-06 |
Method And Device For Cooling A Heat Generating Component App 20150195955 - Brunschwiler; Thomas J. ;   et al. | 2015-07-09 |
Method And Device For Cooling A Heat Generating Component App 20150176911 - Brunschwiler; Thomas J. ;   et al. | 2015-06-25 |
Transferring heat through an optical layer of integrated circuitry Grant 9,064,080 - Barowski , et al. June 23, 2 | 2015-06-23 |
Desalination System And Method For Desalination App 20150166371 - Escher; Werner ;   et al. | 2015-06-18 |
Transferring heat through an optical layer of integrated circuitry Grant 9,058,461 - Barowski , et al. June 16, 2 | 2015-06-16 |
Integrated circuit package connected to an optical data transmission medium using a coolant Grant 8,989,532 - Barowski , et al. March 24, 2 | 2015-03-24 |
Electronic Circuit Device With Electromagnetic Clock Signal Conveyed Along Cooling Fluid Conduit Network App 20140355204 - Gusat; Mircea ;   et al. | 2014-12-04 |
Fluid-cooled Electronic Circuit Device With Cooling Fluid Conduits Having Optical Transmission Medium App 20140355983 - Gusat; Mircea ;   et al. | 2014-12-04 |
Cooling Electronic Components and Supplying Power to the Electronic Components App 20140293533 - Doering; Andreas C. ;   et al. | 2014-10-02 |
Adsorption Heat Exchanger Devices App 20140238071 - Brunschwiler; Thomas J. ;   et al. | 2014-08-28 |
Integrated circuit package connected to a data transmission medium Grant 8,805,132 - Barowski , et al. August 12, 2 | 2014-08-12 |
Transferring Heat Through An Optical Layer Of Integrated Circuitry App 20140095121 - Barowski; Harry ;   et al. | 2014-04-03 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20140084443 - Bernstein; Kerry ;   et al. | 2014-03-27 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20140084448 - Bernstein; Kerry ;   et al. | 2014-03-27 |
Light-reflecting Grating Structure For Photovoltaic Devices App 20140060642 - Michel; Bruno ;   et al. | 2014-03-06 |
Integrated circuit stack Grant 8,659,898 - Brunschwiler , et al. February 25, 2 | 2014-02-25 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 8,629,554 - Bernstein , et al. January 14, 2 | 2014-01-14 |
Solid Sorption Refrigeration App 20130340253 - Michel; Bruno ;   et al. | 2013-12-26 |
Solid Sorption Refrigeration App 20130298595 - Michel; Bruno ;   et al. | 2013-11-14 |
Photovoltaic Thermal Hybrid Systems And Method Of Operation Thereof App 20130255753 - Escher; Werner ;   et al. | 2013-10-03 |
Photovoltaic Thermal Hybrid Solar Receivers App 20130255752 - Escher; Werner ;   et al. | 2013-10-03 |
Photovoltaic Module Cooling Devices App 20130255750 - Escher; Werner ;   et al. | 2013-10-03 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 8,487,427 - Bernstein , et al. July 16, 2 | 2013-07-16 |
Optimized semiconductor packaging in a three-dimensional stack Grant 8,476,112 - Barowski , et al. July 2, 2 | 2013-07-02 |
Stamp with permeable hydrophylic matrix Grant 8,453,569 - Bietsch , et al. June 4, 2 | 2013-06-04 |
Thermal power plane for integrated circuits Grant 8,427,833 - Barowski , et al. April 23, 2 | 2013-04-23 |
Cooling device Grant 8,413,712 - Brunschwiler , et al. April 9, 2 | 2013-04-09 |
Heat sink integrated power delivery and distribution for integrated circuits Grant 8,405,998 - Barowski , et al. March 26, 2 | 2013-03-26 |
Integrated circuit stack Grant 8,363,402 - Brunschwiler , et al. January 29, 2 | 2013-01-29 |
Heat Spreader App 20130008632 - Brunschwiler; Thomas J. ;   et al. | 2013-01-10 |
Integrated Circuit Stack App 20120331433 - Brunschwiler; Thomas J. ;   et al. | 2012-12-27 |
Printing in a medium Grant 8,336,456 - Bietsch , et al. December 25, 2 | 2012-12-25 |
Patterned structure for a thermal interface Grant 8,327,540 - Michel , et al. December 11, 2 | 2012-12-11 |
Optimized Semiconductor Packaging in a Three-Dimensional Stack App 20120290999 - Barowski; Harry ;   et al. | 2012-11-15 |
Stamp with drainage channels for transferring a pattern in the presence of a third medium Grant 8,267,011 - Bietsch , et al. September 18, 2 | 2012-09-18 |
Method and apparatus for surface treatment Grant 8,268,563 - Amontov , et al. September 18, 2 | 2012-09-18 |
Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp Grant 8,268,544 - Schmid , et al. September 18, 2 | 2012-09-18 |
Stamp With Drainage Channels For Transferring A Pattern In The Presence Of A Third Medium App 20120227601 - Bietsch; Alexander ;   et al. | 2012-09-13 |
Optimized semiconductor packaging in a three-dimensional stack Grant 8,253,234 - Barowski , et al. August 28, 2 | 2012-08-28 |
Transferring Heat Through An Optical Layer Of Integrated Circuitry App 20120189243 - Barowski; Harry ;   et al. | 2012-07-26 |
Integrated Circuit Package Connected To A Data Transmission Medium App 20120148187 - Barowski; Harry ;   et al. | 2012-06-14 |
Integrated Circuit Package Connected To An Optical Data Transmission Medium Using A Coolant App 20120147559 - Barowski; Harry ;   et al. | 2012-06-14 |
Optimized Semiconductor Packaging in a Three-Dimensional Stack App 20120105144 - Barowski; Harry ;   et al. | 2012-05-03 |
Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits App 20120106074 - Barowski; Harry ;   et al. | 2012-05-03 |
Thermal Power Plane for Integrated Circuits App 20120105145 - Barowski; Harry ;   et al. | 2012-05-03 |
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly Grant 8,106,505 - Bernstein , et al. January 31, 2 | 2012-01-31 |
Variable flow computer cooling system for a data center and method of operation Grant 8,107,234 - Brunschwiler , et al. January 31, 2 | 2012-01-31 |
Organic optoelectronic device Grant 8,049,207 - Karg , et al. November 1, 2 | 2011-11-01 |
Variable flow computer cooling system for a data center and method of operation Grant 8,004,832 - Brunschwiler , et al. August 23, 2 | 2011-08-23 |
Printing in a Medium App 20110094404 - Bietsch; Alexander ;   et al. | 2011-04-28 |
Semiconductor device with a high thermal dissipation efficiency Grant 7,928,565 - Brunschwiler , et al. April 19, 2 | 2011-04-19 |
Printing in a medium Grant 7,891,295 - Bietsch , et al. February 22, 2 | 2011-02-22 |
Method And Device For Cooling A Heat Generating Component App 20110036538 - Brunschwiler; Thomas J. ;   et al. | 2011-02-17 |
Variable performance server system and method of operation Grant 7,866,173 - Brunschwiler , et al. January 11, 2 | 2011-01-11 |
Integrated Circuit Stack App 20100290188 - Brunschwiler; Thomas J. ;   et al. | 2010-11-18 |
Variable flow computer cooling system for a data center and method of operation Grant 7,808,780 - Brunschwiler , et al. October 5, 2 | 2010-10-05 |
Variable Flow Computer Cooling System For A Data Center And Method Of Operation App 20100246117 - Brunschwiler; Thomas J. ;   et al. | 2010-09-30 |
Variable Flow Computer Cooling System For A Data Center And Method Of Operation App 20100241278 - Brunschwiler; Thomas J. ;   et al. | 2010-09-23 |
Printing in a Medium App 20100180782 - Bietsch; Alexander ;   et al. | 2010-07-22 |
Patterned structure for a thermal interface Grant 7,748,440 - Michel , et al. July 6, 2 | 2010-07-06 |
Method and device for flowing a liquid on a surface Grant 7,740,472 - Delamarche , et al. June 22, 2 | 2010-06-22 |
Semiconductor Device With A High Thermal Dissipation Efficiency App 20100148358 - Brunschwiler; Thomas J. ;   et al. | 2010-06-17 |
Semiconductor device with a high thermal dissipation efficiency Grant 7,713,789 - Brunschwiler , et al. May 11, 2 | 2010-05-11 |
Patterned Structure For A Thermal Interface App 20100037461 - Michel; Bruno ;   et al. | 2010-02-18 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20090311826 - Bernstein; Kerry ;   et al. | 2009-12-17 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20090308578 - Bernstein; Kerry ;   et al. | 2009-12-17 |
Surface Treatment App 20090298161 - Amontov; Sergey ;   et al. | 2009-12-03 |
Variable Performance Server System And Method Of Operation App 20090234705 - Brunschwiler; Thomas J. ;   et al. | 2009-09-17 |
Variable Flow Computer Cooling System For A Data Center And Method Of Operation App 20090218078 - Brunschwiler; Thomas J. ;   et al. | 2009-09-03 |
Stamp For Patterning, Method For Manufacturing Such Stamp And Method For Manufacturing An Object Using The Stamp App 20090208882 - Schmid; Heinz ;   et al. | 2009-08-20 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies Grant 7,547,582 - Brunschwiler , et al. June 16, 2 | 2009-06-16 |
Semiconductor chip assembly with flexible metal cantilevers Grant 7,532,475 - Michel , et al. May 12, 2 | 2009-05-12 |
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly App 20090108435 - Bernstein; Kerry ;   et al. | 2009-04-30 |
System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding Grant 7,504,038 - Bietsch , et al. March 17, 2 | 2009-03-17 |
Printing in a medium App 20090038493 - Bietsch; Alexander ;   et al. | 2009-02-12 |
Fabrication method Grant 7,446,057 - Bietsch , et al. November 4, 2 | 2008-11-04 |
Printing in a medium Grant 7,434,512 - Bietsch , et al. October 14, 2 | 2008-10-14 |
Organic Optoelectronic Device App 20080138555 - Karg; Siegfried F. ;   et al. | 2008-06-12 |
Surface Adapting Cap With Integral Adapting Material For Single And Multi Chip Module Assembly App 20080073775 - Brunschwiler; Thomas J ;   et al. | 2008-03-27 |
High Performance Integrated Mlc Cooling Device For High Power Density Ics And Method For Manufacturing App 20080060792 - Berger; Daniel G. ;   et al. | 2008-03-13 |
Method and device for flowing a liquid on a surface Grant 7,329,111 - Delamarche , et al. February 12, 2 | 2008-02-12 |
Semiconductor Device With A High Thermal Dissipation Efficiency App 20080017978 - Brunschwiler; Thomas J. ;   et al. | 2008-01-24 |
Method and Device for Flowing a Liquid on a Surface App 20080000536 - Delamarche; Emmanuel ;   et al. | 2008-01-03 |
Method and apparatus for manufacturing an optoelectronic device Grant 7,306,970 - Karg , et al. December 11, 2 | 2007-12-11 |
Fabrication Method App 20070275556 - Bietsch; Alexander ;   et al. | 2007-11-29 |
Thermal interface with a patterned structure Grant 7,282,799 - Brunschwiler , et al. October 16, 2 | 2007-10-16 |
Stress release thermal interfaces App 20070230133 - Michel; Bruno ;   et al. | 2007-10-04 |
Semiconductor device with a high thermal dissipation efficiency Grant 7,271,034 - Brunschwiler , et al. September 18, 2 | 2007-09-18 |
High performance integrated MLC cooling device for high power density ICS and method for manufacturing Grant 7,255,153 - Berger , et al. August 14, 2 | 2007-08-14 |
Electrical switch of the normally closed type Grant 7,238,906 - Michel July 3, 2 | 2007-07-03 |
Patterning method Grant 7,235,464 - Bona , et al. June 26, 2 | 2007-06-26 |
Cooling device App 20070119565 - Brunschwiler; Thomas J. ;   et al. | 2007-05-31 |
System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning Grant 7,168,939 - Bietsch , et al. January 30, 2 | 2007-01-30 |
Heat spreader App 20070017659 - Brunschwiler; Thomas J. ;   et al. | 2007-01-25 |
Surface treatment App 20070015153 - Amontov; Sergey ;   et al. | 2007-01-18 |
Electrical switch of the normally closed type App 20070000767 - Michel; Bruno | 2007-01-04 |
Surface treatment App 20060286560 - Amontov; Sergey ;   et al. | 2006-12-21 |
Thermal interface with a patterned structure App 20060286712 - Brunschwiler; Thomas J. ;   et al. | 2006-12-21 |
Surface treatment App 20060286682 - Amontov; Sergey ;   et al. | 2006-12-21 |
High Performance Integrated Mlc Cooling Device For High Power Density Ics And Method For Manufacturing App 20060266497 - Berger; Daniel G. ;   et al. | 2006-11-30 |
Surface treatment Grant 7,070,922 - Amontov , et al. July 4, 2 | 2006-07-04 |
Printing in a medium App 20060096477 - Bietsch; Alexander ;   et al. | 2006-05-11 |
Selective etching of substrates with control of the etch profile Grant 7,041,232 - Bietsch , et al. May 9, 2 | 2006-05-09 |
Method and device for flowing a liquid on a surface App 20060093697 - Delamarche; Emmanuel ;   et al. | 2006-05-04 |
Frame for fitting a smart card connector onto a panel App 20060059746 - Valcher; Fabrice ;   et al. | 2006-03-23 |
Organic optoelectronic device App 20060046342 - Karg; Siegfried F. ;   et al. | 2006-03-02 |
Semiconductor device with a high thermal dissipation efficiency App 20050277280 - Brunschwiler, Thomas J. ;   et al. | 2005-12-15 |
Patterned structure for a thermal interface App 20050263879 - Michel, Bruno ;   et al. | 2005-12-01 |
Smart card receiver allowing two card orientations App 20050233645 - Michel, Bruno ;   et al. | 2005-10-20 |
System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning App 20050191418 - Bietsch, Alexander ;   et al. | 2005-09-01 |
System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding App 20050191582 - Bietsch, Alexander ;   et al. | 2005-09-01 |
Patterning method App 20050124092 - Bona, Gian-Luca ;   et al. | 2005-06-09 |
Method for forming patterns for semiconductor devices App 20040266173 - Andry, Paul S. ;   et al. | 2004-12-30 |
Selective etching of substrates with control of the etch profile App 20040200575 - Bietsch, Alexander ;   et al. | 2004-10-14 |
Liquid crystal display Grant 6,798,464 - Bietsch , et al. September 28, 2 | 2004-09-28 |
Multiple electrical switch arrangement Grant 6,794,589 - Kubat , et al. September 21, 2 | 2004-09-21 |
Method for forming patterns for semiconductor devices Grant 6,767,828 - Andry , et al. July 27, 2 | 2004-07-27 |
Surface treatment App 20040110276 - Amontov, Sergey ;   et al. | 2004-06-10 |
Multiple electrical switch arrangement App 20040000466 - Kubat, Laurent ;   et al. | 2004-01-01 |
Silicone elastomer stamp with hydrophilic surfaces and method of making same Grant 6,596,346 - Bernard , et al. July 22, 2 | 2003-07-22 |
Method for forming patterns for semiconductor devices App 20030068480 - Andry, Paul S. ;   et al. | 2003-04-10 |
Method for printing a catalyst on substrates for electroless deposition Grant 6,521,285 - Biebuyck , et al. February 18, 2 | 2003-02-18 |
Liquid crystal display App 20020167619 - Bietsch, Alexander ;   et al. | 2002-11-14 |
Patterning mask and method App 20020166468 - Schmid, Heinz ;   et al. | 2002-11-14 |
Silicone elastomer stamp with hydrophilic surfaces and method of making same App 20020098364 - Bernard, Andre ;   et al. | 2002-07-25 |
Method of oriented depositing chemically defined bodies Grant 6,096,386 - Biebuyck , et al. August 1, 2 | 2000-08-01 |
Lithographic surface or thin layer modification Grant 5,925,259 - Biebuyck , et al. July 20, 1 | 1999-07-20 |
Stamp for a lithographic process Grant 5,817,242 - Biebuyck , et al. October 6, 1 | 1998-10-06 |
Cantilever deflection sensor and use thereof Grant 5,804,709 - Bourgoin , et al. September 8, 1 | 1998-09-08 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.