loadpatents
name:-0.17066478729248
name:-0.10657000541687
name:-0.012547016143799
Michel; Bruno Patent Filings

Michel; Bruno

Patent Applications and Registrations

Patent applications and USPTO patent grants for Michel; Bruno.The latest application filed is for "compact adsorption heat exchangers".

Company Profile
15.110.103
  • Michel; Bruno - Zurich CH
  • MICHEL; Bruno - Andrezieux Boutheon FR
  • Michel; Bruno - Rueschlikon N/A CH
  • Michel; Bruno - Adliswil CH
  • Michel; Bruno - Yorktown Heights NY
  • Michel; Bruno - Dole FR
  • Michel; Bruno - Adiswil CH
  • Michel; Bruno - Gattikon CH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Compact Adsorption Heat Exchangers
App 20220178592 - Ruch; Patrick ;   et al.
2022-06-09
New Dialkyl Tin Oxide Composition And Process For Producing 2-dimethylaminoethyl (meth)acrylate
App 20210309605 - FAVERO; Cedrick ;   et al.
2021-10-07
Photovoltaic system with non-uniformly cooled photovoltaic cells
Grant 11,094,840 - Loertscher , et al. August 17, 2
2021-08-17
Photovoltaic system with non-uniformly cooled photovoltaic cells
Grant 11,063,167 - Loertscher , et al. July 13, 2
2021-07-13
Ear Device For Heat Stroke Detection
App 20210137457 - Matsumoto; Keiji ;   et al.
2021-05-13
Photovoltaic module
Grant 10,972,048 - Loertscher , et al. April 6, 2
2021-04-06
Photovoltaic module
Grant 10,972,047 - Loertscher , et al. April 6, 2
2021-04-06
Adsorption heat exchanger devices
Grant 10,882,145 - Brunschwiler , et al. January 5, 2
2021-01-05
Solid sorption refrigeration
Grant 10,688,553 - Michel , et al.
2020-06-23
Device and method for converting heat into mechanical energy
Grant 10,683,776 - Burg , et al.
2020-06-16
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20200144169 - Bernstein; Kerry ;   et al.
2020-05-07
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 10,622,294 - Bernstein , et al.
2020-04-14
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 10,586,760 - Bernstein , et al.
2020-03-10
Optical sensing device with multiple field-enhanced nano-volumes
Grant 10,564,091 - Gruber , et al. Feb
2020-02-18
Selectively Functionalized Porous Material
App 20200030784 - Dubois; Geraud J. ;   et al.
2020-01-30
Adsorption heat exchanger devices
Grant 10,533,779 - Goicochea , et al. Ja
2020-01-14
Selectively functionalized porous material
Grant 10,471,418 - Dubois , et al. Nov
2019-11-12
Photovoltaic thermal hybrid systems and method of operation thereof
Grant 10,320,328 - Escher , et al.
2019-06-11
Method and device for cooling a heat generating component
Grant 10,278,306 - Brunschwiler , et al.
2019-04-30
Optical Sensing Device With Multiple Field-enhanced Nano-volumes
App 20190056309 - Gruber; Cynthia ;   et al.
2019-02-21
Photovoltaic System With Non-uniformly Cooled Photovoltaic Cells
App 20180323326 - Loertscher; Emanuel ;   et al.
2018-11-08
Adsorption Heat Exchanger Devices
App 20180281127 - Brunschwiler; Thomas J. ;   et al.
2018-10-04
Method and device for cooling a heat generating component
Grant 10,091,909 - Brunschwiler , et al. October 2, 2
2018-10-02
Photovoltaic Module
App 20180248512 - Loertscher; Emanuel ;   et al.
2018-08-30
Photovoltaic Module
App 20180248511 - Loertscher; Emanuel ;   et al.
2018-08-30
Photovoltaic system with non-uniformly cooled photovoltaic cells
Grant 10,050,165 - Loertscher , et al. August 14, 2
2018-08-14
Adsorption heat exchanger devices
Grant 10,041,709 - Brunschwiler , et al. August 7, 2
2018-08-07
Cooling electronic components and supplying power to the electronic components
Grant 10,031,562 - Doering , et al. July 24, 2
2018-07-24
Light-reflecting grating structure for photovoltaic devices
Grant 9,985,147 - Michel , et al. May 29, 2
2018-05-29
Adsorbing heat exchanger
Grant 9,951,977 - Michel , et al. April 24, 2
2018-04-24
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20180090428 - Bernstein; Kerry ;   et al.
2018-03-29
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20180090427 - Bernstein; Kerry ;   et al.
2018-03-29
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 9,905,505 - Bernstein , et al. February 27, 2
2018-02-27
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 9,905,506 - Bernstein , et al. February 27, 2
2018-02-27
Cooling device with nested chambers for computer hardware
Grant 9,880,595 - Brunschwiler , et al. January 30, 2
2018-01-30
Solid sorption refrigeration
Grant 9,855,595 - Michel , et al. January 2, 2
2018-01-02
Cooling Device With Nested Chambers For Computer Hardware
App 20170357297 - BRUNSCHWILER; Thomas ;   et al.
2017-12-14
Adsorption heat exchanger devices
Grant 9,821,418 - Brunschwiler , et al. November 21, 2
2017-11-21
Photovoltaic System With Non-uniformly Cooled Photovoltaic Cells
App 20170294549 - Loertscher; Emanuel ;   et al.
2017-10-12
Working fluid for a device, device and method for converting heat into mechanical energy
Grant 9,739,179 - Burg , et al. August 22, 2
2017-08-22
Adsorption Heat Exchanger Devices
App 20170131007 - Brunschwiler; Thomas J. ;   et al.
2017-05-11
Desalination system and method for desalination
Grant 9,630,862 - Escher , et al. April 25, 2
2017-04-25
Selectively Functionalized Porous Material
App 20170106362 - Dubois; Geraud J. ;   et al.
2017-04-20
System and method for cooling and delivering power to a computer system
Grant 9,591,791 - Cossale , et al. March 7, 2
2017-03-07
Adsorbing Heat Exchanger
App 20170030612 - Michel; Bruno ;   et al.
2017-02-02
Device And Method For Converting Heat Into Mechanical Energy
App 20160319703 - Burg; Brian ;   et al.
2016-11-03
Photovoltaic Thermal Hybrid Systems And Method Of Operation Thereof
App 20160322933 - Escher; Werner ;   et al.
2016-11-03
Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network
Grant 9,471,089 - Gusat , et al. October 18, 2
2016-10-18
Desalination System And Method For Desalination
App 20160289095 - Escher; Werner ;   et al.
2016-10-06
Working Fluid For A Device, Device And Method For Converting Heat Into Mechanical Energy
App 20160265390 - Burg; Brian ;   et al.
2016-09-15
Photovoltaic thermal hybrid systems and method of operation thereof
Grant 9,437,766 - Escher , et al. September 6, 2
2016-09-06
Adsorption Heat Exchanger Devices
App 20160252278 - Goicochea; Javier V. ;   et al.
2016-09-01
Desalination system and method for desalination
Grant 9,416,031 - Escher , et al. August 16, 2
2016-08-16
Electronic Circuit Device With Electromagnetic Clock Signal Conveyed Along Cooling Fluid Conduit Network
App 20160209865 - Gusat; Mircea ;   et al.
2016-07-21
Fluid-cooled electronic circuit device with cooling fluid conduits having optical transmission medium
Grant 9,398,730 - Gusat , et al. July 19, 2
2016-07-19
Transferring heat through an optical layer of integrated circuitry
Grant 9,337,122 - Barowski , et al. May 10, 2
2016-05-10
Electronic circuit device with electromagnetic clock signal conveyed along cooling fluid conduit network
Grant 9,304,533 - Gusat , et al. April 5, 2
2016-04-05
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20160049353 - Bernstein; Kerry ;   et al.
2016-02-18
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20160049360 - BERNSTEIN; KERRY ;   et al.
2016-02-18
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 9,252,071 - Bernstein , et al. February 2, 2
2016-02-02
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 9,252,072 - Bernstein , et al. February 2, 2
2016-02-02
Photovoltaic thermal hybrid solar receivers
Grant 9,219,183 - Escher , et al. December 22, 2
2015-12-22
Photovoltaic module cooling devices
Grant 9,153,722 - Escher , et al. October 6, 2
2015-10-06
Surface treatment
Grant 9,110,056 - Amontov , et al. August 18, 2
2015-08-18
Transferring Heat Through An Optical Layer Of Integrated Circuitry
App 20150221575 - Barowski; Harry ;   et al.
2015-08-06
Method And Device For Cooling A Heat Generating Component
App 20150195955 - Brunschwiler; Thomas J. ;   et al.
2015-07-09
Method And Device For Cooling A Heat Generating Component
App 20150176911 - Brunschwiler; Thomas J. ;   et al.
2015-06-25
Transferring heat through an optical layer of integrated circuitry
Grant 9,064,080 - Barowski , et al. June 23, 2
2015-06-23
Desalination System And Method For Desalination
App 20150166371 - Escher; Werner ;   et al.
2015-06-18
Transferring heat through an optical layer of integrated circuitry
Grant 9,058,461 - Barowski , et al. June 16, 2
2015-06-16
Integrated circuit package connected to an optical data transmission medium using a coolant
Grant 8,989,532 - Barowski , et al. March 24, 2
2015-03-24
Electronic Circuit Device With Electromagnetic Clock Signal Conveyed Along Cooling Fluid Conduit Network
App 20140355204 - Gusat; Mircea ;   et al.
2014-12-04
Fluid-cooled Electronic Circuit Device With Cooling Fluid Conduits Having Optical Transmission Medium
App 20140355983 - Gusat; Mircea ;   et al.
2014-12-04
Cooling Electronic Components and Supplying Power to the Electronic Components
App 20140293533 - Doering; Andreas C. ;   et al.
2014-10-02
Adsorption Heat Exchanger Devices
App 20140238071 - Brunschwiler; Thomas J. ;   et al.
2014-08-28
Integrated circuit package connected to a data transmission medium
Grant 8,805,132 - Barowski , et al. August 12, 2
2014-08-12
Transferring Heat Through An Optical Layer Of Integrated Circuitry
App 20140095121 - Barowski; Harry ;   et al.
2014-04-03
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20140084443 - Bernstein; Kerry ;   et al.
2014-03-27
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20140084448 - Bernstein; Kerry ;   et al.
2014-03-27
Light-reflecting Grating Structure For Photovoltaic Devices
App 20140060642 - Michel; Bruno ;   et al.
2014-03-06
Integrated circuit stack
Grant 8,659,898 - Brunschwiler , et al. February 25, 2
2014-02-25
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 8,629,554 - Bernstein , et al. January 14, 2
2014-01-14
Solid Sorption Refrigeration
App 20130340253 - Michel; Bruno ;   et al.
2013-12-26
Solid Sorption Refrigeration
App 20130298595 - Michel; Bruno ;   et al.
2013-11-14
Photovoltaic Thermal Hybrid Systems And Method Of Operation Thereof
App 20130255753 - Escher; Werner ;   et al.
2013-10-03
Photovoltaic Thermal Hybrid Solar Receivers
App 20130255752 - Escher; Werner ;   et al.
2013-10-03
Photovoltaic Module Cooling Devices
App 20130255750 - Escher; Werner ;   et al.
2013-10-03
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 8,487,427 - Bernstein , et al. July 16, 2
2013-07-16
Optimized semiconductor packaging in a three-dimensional stack
Grant 8,476,112 - Barowski , et al. July 2, 2
2013-07-02
Stamp with permeable hydrophylic matrix
Grant 8,453,569 - Bietsch , et al. June 4, 2
2013-06-04
Thermal power plane for integrated circuits
Grant 8,427,833 - Barowski , et al. April 23, 2
2013-04-23
Cooling device
Grant 8,413,712 - Brunschwiler , et al. April 9, 2
2013-04-09
Heat sink integrated power delivery and distribution for integrated circuits
Grant 8,405,998 - Barowski , et al. March 26, 2
2013-03-26
Integrated circuit stack
Grant 8,363,402 - Brunschwiler , et al. January 29, 2
2013-01-29
Heat Spreader
App 20130008632 - Brunschwiler; Thomas J. ;   et al.
2013-01-10
Integrated Circuit Stack
App 20120331433 - Brunschwiler; Thomas J. ;   et al.
2012-12-27
Printing in a medium
Grant 8,336,456 - Bietsch , et al. December 25, 2
2012-12-25
Patterned structure for a thermal interface
Grant 8,327,540 - Michel , et al. December 11, 2
2012-12-11
Optimized Semiconductor Packaging in a Three-Dimensional Stack
App 20120290999 - Barowski; Harry ;   et al.
2012-11-15
Stamp with drainage channels for transferring a pattern in the presence of a third medium
Grant 8,267,011 - Bietsch , et al. September 18, 2
2012-09-18
Method and apparatus for surface treatment
Grant 8,268,563 - Amontov , et al. September 18, 2
2012-09-18
Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp
Grant 8,268,544 - Schmid , et al. September 18, 2
2012-09-18
Stamp With Drainage Channels For Transferring A Pattern In The Presence Of A Third Medium
App 20120227601 - Bietsch; Alexander ;   et al.
2012-09-13
Optimized semiconductor packaging in a three-dimensional stack
Grant 8,253,234 - Barowski , et al. August 28, 2
2012-08-28
Transferring Heat Through An Optical Layer Of Integrated Circuitry
App 20120189243 - Barowski; Harry ;   et al.
2012-07-26
Integrated Circuit Package Connected To A Data Transmission Medium
App 20120148187 - Barowski; Harry ;   et al.
2012-06-14
Integrated Circuit Package Connected To An Optical Data Transmission Medium Using A Coolant
App 20120147559 - Barowski; Harry ;   et al.
2012-06-14
Optimized Semiconductor Packaging in a Three-Dimensional Stack
App 20120105144 - Barowski; Harry ;   et al.
2012-05-03
Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits
App 20120106074 - Barowski; Harry ;   et al.
2012-05-03
Thermal Power Plane for Integrated Circuits
App 20120105145 - Barowski; Harry ;   et al.
2012-05-03
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
Grant 8,106,505 - Bernstein , et al. January 31, 2
2012-01-31
Variable flow computer cooling system for a data center and method of operation
Grant 8,107,234 - Brunschwiler , et al. January 31, 2
2012-01-31
Organic optoelectronic device
Grant 8,049,207 - Karg , et al. November 1, 2
2011-11-01
Variable flow computer cooling system for a data center and method of operation
Grant 8,004,832 - Brunschwiler , et al. August 23, 2
2011-08-23
Printing in a Medium
App 20110094404 - Bietsch; Alexander ;   et al.
2011-04-28
Semiconductor device with a high thermal dissipation efficiency
Grant 7,928,565 - Brunschwiler , et al. April 19, 2
2011-04-19
Printing in a medium
Grant 7,891,295 - Bietsch , et al. February 22, 2
2011-02-22
Method And Device For Cooling A Heat Generating Component
App 20110036538 - Brunschwiler; Thomas J. ;   et al.
2011-02-17
Variable performance server system and method of operation
Grant 7,866,173 - Brunschwiler , et al. January 11, 2
2011-01-11
Integrated Circuit Stack
App 20100290188 - Brunschwiler; Thomas J. ;   et al.
2010-11-18
Variable flow computer cooling system for a data center and method of operation
Grant 7,808,780 - Brunschwiler , et al. October 5, 2
2010-10-05
Variable Flow Computer Cooling System For A Data Center And Method Of Operation
App 20100246117 - Brunschwiler; Thomas J. ;   et al.
2010-09-30
Variable Flow Computer Cooling System For A Data Center And Method Of Operation
App 20100241278 - Brunschwiler; Thomas J. ;   et al.
2010-09-23
Printing in a Medium
App 20100180782 - Bietsch; Alexander ;   et al.
2010-07-22
Patterned structure for a thermal interface
Grant 7,748,440 - Michel , et al. July 6, 2
2010-07-06
Method and device for flowing a liquid on a surface
Grant 7,740,472 - Delamarche , et al. June 22, 2
2010-06-22
Semiconductor Device With A High Thermal Dissipation Efficiency
App 20100148358 - Brunschwiler; Thomas J. ;   et al.
2010-06-17
Semiconductor device with a high thermal dissipation efficiency
Grant 7,713,789 - Brunschwiler , et al. May 11, 2
2010-05-11
Patterned Structure For A Thermal Interface
App 20100037461 - Michel; Bruno ;   et al.
2010-02-18
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20090311826 - Bernstein; Kerry ;   et al.
2009-12-17
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20090308578 - Bernstein; Kerry ;   et al.
2009-12-17
Surface Treatment
App 20090298161 - Amontov; Sergey ;   et al.
2009-12-03
Variable Performance Server System And Method Of Operation
App 20090234705 - Brunschwiler; Thomas J. ;   et al.
2009-09-17
Variable Flow Computer Cooling System For A Data Center And Method Of Operation
App 20090218078 - Brunschwiler; Thomas J. ;   et al.
2009-09-03
Stamp For Patterning, Method For Manufacturing Such Stamp And Method For Manufacturing An Object Using The Stamp
App 20090208882 - Schmid; Heinz ;   et al.
2009-08-20
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
Grant 7,547,582 - Brunschwiler , et al. June 16, 2
2009-06-16
Semiconductor chip assembly with flexible metal cantilevers
Grant 7,532,475 - Michel , et al. May 12, 2
2009-05-12
Assembly Including Plural Through Wafer Vias, Method Of Cooling The Assembly And Method Of Fabricating The Assembly
App 20090108435 - Bernstein; Kerry ;   et al.
2009-04-30
System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding
Grant 7,504,038 - Bietsch , et al. March 17, 2
2009-03-17
Printing in a medium
App 20090038493 - Bietsch; Alexander ;   et al.
2009-02-12
Fabrication method
Grant 7,446,057 - Bietsch , et al. November 4, 2
2008-11-04
Printing in a medium
Grant 7,434,512 - Bietsch , et al. October 14, 2
2008-10-14
Organic Optoelectronic Device
App 20080138555 - Karg; Siegfried F. ;   et al.
2008-06-12
Surface Adapting Cap With Integral Adapting Material For Single And Multi Chip Module Assembly
App 20080073775 - Brunschwiler; Thomas J ;   et al.
2008-03-27
High Performance Integrated Mlc Cooling Device For High Power Density Ics And Method For Manufacturing
App 20080060792 - Berger; Daniel G. ;   et al.
2008-03-13
Method and device for flowing a liquid on a surface
Grant 7,329,111 - Delamarche , et al. February 12, 2
2008-02-12
Semiconductor Device With A High Thermal Dissipation Efficiency
App 20080017978 - Brunschwiler; Thomas J. ;   et al.
2008-01-24
Method and Device for Flowing a Liquid on a Surface
App 20080000536 - Delamarche; Emmanuel ;   et al.
2008-01-03
Method and apparatus for manufacturing an optoelectronic device
Grant 7,306,970 - Karg , et al. December 11, 2
2007-12-11
Fabrication Method
App 20070275556 - Bietsch; Alexander ;   et al.
2007-11-29
Thermal interface with a patterned structure
Grant 7,282,799 - Brunschwiler , et al. October 16, 2
2007-10-16
Stress release thermal interfaces
App 20070230133 - Michel; Bruno ;   et al.
2007-10-04
Semiconductor device with a high thermal dissipation efficiency
Grant 7,271,034 - Brunschwiler , et al. September 18, 2
2007-09-18
High performance integrated MLC cooling device for high power density ICS and method for manufacturing
Grant 7,255,153 - Berger , et al. August 14, 2
2007-08-14
Electrical switch of the normally closed type
Grant 7,238,906 - Michel July 3, 2
2007-07-03
Patterning method
Grant 7,235,464 - Bona , et al. June 26, 2
2007-06-26
Cooling device
App 20070119565 - Brunschwiler; Thomas J. ;   et al.
2007-05-31
System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
Grant 7,168,939 - Bietsch , et al. January 30, 2
2007-01-30
Heat spreader
App 20070017659 - Brunschwiler; Thomas J. ;   et al.
2007-01-25
Surface treatment
App 20070015153 - Amontov; Sergey ;   et al.
2007-01-18
Electrical switch of the normally closed type
App 20070000767 - Michel; Bruno
2007-01-04
Surface treatment
App 20060286560 - Amontov; Sergey ;   et al.
2006-12-21
Thermal interface with a patterned structure
App 20060286712 - Brunschwiler; Thomas J. ;   et al.
2006-12-21
Surface treatment
App 20060286682 - Amontov; Sergey ;   et al.
2006-12-21
High Performance Integrated Mlc Cooling Device For High Power Density Ics And Method For Manufacturing
App 20060266497 - Berger; Daniel G. ;   et al.
2006-11-30
Surface treatment
Grant 7,070,922 - Amontov , et al. July 4, 2
2006-07-04
Printing in a medium
App 20060096477 - Bietsch; Alexander ;   et al.
2006-05-11
Selective etching of substrates with control of the etch profile
Grant 7,041,232 - Bietsch , et al. May 9, 2
2006-05-09
Method and device for flowing a liquid on a surface
App 20060093697 - Delamarche; Emmanuel ;   et al.
2006-05-04
Frame for fitting a smart card connector onto a panel
App 20060059746 - Valcher; Fabrice ;   et al.
2006-03-23
Organic optoelectronic device
App 20060046342 - Karg; Siegfried F. ;   et al.
2006-03-02
Semiconductor device with a high thermal dissipation efficiency
App 20050277280 - Brunschwiler, Thomas J. ;   et al.
2005-12-15
Patterned structure for a thermal interface
App 20050263879 - Michel, Bruno ;   et al.
2005-12-01
Smart card receiver allowing two card orientations
App 20050233645 - Michel, Bruno ;   et al.
2005-10-20
System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
App 20050191418 - Bietsch, Alexander ;   et al.
2005-09-01
System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding
App 20050191582 - Bietsch, Alexander ;   et al.
2005-09-01
Patterning method
App 20050124092 - Bona, Gian-Luca ;   et al.
2005-06-09
Method for forming patterns for semiconductor devices
App 20040266173 - Andry, Paul S. ;   et al.
2004-12-30
Selective etching of substrates with control of the etch profile
App 20040200575 - Bietsch, Alexander ;   et al.
2004-10-14
Liquid crystal display
Grant 6,798,464 - Bietsch , et al. September 28, 2
2004-09-28
Multiple electrical switch arrangement
Grant 6,794,589 - Kubat , et al. September 21, 2
2004-09-21
Method for forming patterns for semiconductor devices
Grant 6,767,828 - Andry , et al. July 27, 2
2004-07-27
Surface treatment
App 20040110276 - Amontov, Sergey ;   et al.
2004-06-10
Multiple electrical switch arrangement
App 20040000466 - Kubat, Laurent ;   et al.
2004-01-01
Silicone elastomer stamp with hydrophilic surfaces and method of making same
Grant 6,596,346 - Bernard , et al. July 22, 2
2003-07-22
Method for forming patterns for semiconductor devices
App 20030068480 - Andry, Paul S. ;   et al.
2003-04-10
Method for printing a catalyst on substrates for electroless deposition
Grant 6,521,285 - Biebuyck , et al. February 18, 2
2003-02-18
Liquid crystal display
App 20020167619 - Bietsch, Alexander ;   et al.
2002-11-14
Patterning mask and method
App 20020166468 - Schmid, Heinz ;   et al.
2002-11-14
Silicone elastomer stamp with hydrophilic surfaces and method of making same
App 20020098364 - Bernard, Andre ;   et al.
2002-07-25
Method of oriented depositing chemically defined bodies
Grant 6,096,386 - Biebuyck , et al. August 1, 2
2000-08-01
Lithographic surface or thin layer modification
Grant 5,925,259 - Biebuyck , et al. July 20, 1
1999-07-20
Stamp for a lithographic process
Grant 5,817,242 - Biebuyck , et al. October 6, 1
1998-10-06
Cantilever deflection sensor and use thereof
Grant 5,804,709 - Bourgoin , et al. September 8, 1
1998-09-08

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