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name:-0.022278070449829
name:-0.00083518028259277
Michalk; Manfred Patent Filings

Michalk; Manfred

Patent Applications and Registrations

Patent applications and USPTO patent grants for Michalk; Manfred.The latest application filed is for "method to strip a portion of an insulated wire".

Company Profile
0.14.14
  • Michalk; Manfred - Erfurt DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method to strip a portion of an insulated wire
Grant 9,935,433 - Michalk April 3, 2
2018-04-03
Method to strip a portion of an insulated wire
Grant 9,531,171 - Michalk December 27, 2
2016-12-27
Method To Strip A Portion Of An Insulated Wire
App 20160372901 - MICHALK; Manfred
2016-12-22
Multilayer thermoplastic laminated film arrangement and device and method for laminating
Grant 9,044,925 - Michalk June 2, 2
2015-06-02
Functional laminate
Grant 9,023,169 - Michalk , et al. May 5, 2
2015-05-05
Circuit configuration having a prescribed capacitance, and method and device for the production thereof
Grant 9,000,305 - Michalk April 7, 2
2015-04-07
Transponder embedded in a flexible multilayer support
Grant 8,946,099 - Michalk February 3, 2
2015-02-03
Chip Card And Method For Producing A Chip Card
App 20140354490 - Michalk; Manfred
2014-12-04
Circuit Configuration Having a Prescribed Capacitance, and Method and Device for the Production Thereof
App 20120286902 - Michalk; Manfred
2012-11-15
Functional Laminate
App 20120201994 - Michalk; Manfred
2012-08-09
Multilayer Thermoplastic Laminated Film Arrangement and Device and Method for Laminating
App 20120094082 - Michalk; Manfred
2012-04-19
Method For Manufacturing A Functional Laminate, Functional Laminate And Its Use For Security Documents
App 20120038141 - Michalk; Manfred
2012-02-16
Flat transponder and method for the production thereof
Grant 7,967,213 - Michalk June 28, 2
2011-06-28
Method and arrangement for contact-connecting semiconductor chips on a metallic substrate
Grant 7,915,739 - Michalk , et al. March 29, 2
2011-03-29
Circuit layout and method and device for producing a circuit pattern on a substrate
App 20100230151 - Michalk; Manfred
2010-09-16
Method To Strip A Portion Of An Insulated Wire
App 20100201586 - MICHALK; Manfred
2010-08-12
Method and device for contacting semiconductor chips
Grant 7,727,861 - Michalk , et al. June 1, 2
2010-06-01
Functional Laminate
App 20090291271 - Michalk; Manfred ;   et al.
2009-11-26
Method And Arrangement For Contact-connecting Semiconductor Chips On A Metallic Substrate
App 20090085226 - Michalk; Manfred ;   et al.
2009-04-02
Functional Laminate
App 20080258873 - Michalk; Manfred ;   et al.
2008-10-23
Transponder Embedded In A Flexible Multilayer Support
App 20080131669 - Michalk; Manfred
2008-06-05
Flat Transponder And Method For The Production Thereof
App 20070278315 - Michalk; Manfred
2007-12-06
Method and device for contacting semiconductor chips
App 20070163992 - Michalk; Martin ;   et al.
2007-07-19

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