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Patent applications and USPTO patent grants for Michaeli; Benny.The latest application filed is for "coreless cavity substrates for chip packaging and their fabrication".
Patent | Date |
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Advanced multilayer coreless support structures and method for their fabrication Grant 7,682,972 - Hurwitz , et al. March 23, 2 | 2010-03-23 |
Coreless cavity substrates for chip packaging and their fabrication Grant 7,669,320 - Hurwitz , et al. March 2, 2 | 2010-03-02 |
Integrated circuit support structures and their fabrication Grant 7,635,641 - Hurwitz , et al. December 22, 2 | 2009-12-22 |
Coreless Cavity Substrates For Chip Packaging And Their Fabrication App 20070289127 - HURWITZ; Dror ;   et al. | 2007-12-20 |
Advanced Multilayered Coreless Support Structures and their Fabrication App 20070281471 - Hurwitz; Dror ;   et al. | 2007-12-06 |
Novel integrated circuit support structures and their fabrication App 20070082501 - Hurwitz; Dror ;   et al. | 2007-04-12 |
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