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name:-0.0038950443267822
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Michaeli; Benny Patent Filings

Michaeli; Benny

Patent Applications and Registrations

Patent applications and USPTO patent grants for Michaeli; Benny.The latest application filed is for "coreless cavity substrates for chip packaging and their fabrication".

Company Profile
0.3.3
  • Michaeli; Benny - Nazerth Illit IL
  • Michaeli; Benny - Nazareth Ilit IL
  • Michaeli; Benny - Nazareth Illit IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Advanced multilayer coreless support structures and method for their fabrication
Grant 7,682,972 - Hurwitz , et al. March 23, 2
2010-03-23
Coreless cavity substrates for chip packaging and their fabrication
Grant 7,669,320 - Hurwitz , et al. March 2, 2
2010-03-02
Integrated circuit support structures and their fabrication
Grant 7,635,641 - Hurwitz , et al. December 22, 2
2009-12-22
Coreless Cavity Substrates For Chip Packaging And Their Fabrication
App 20070289127 - HURWITZ; Dror ;   et al.
2007-12-20
Advanced Multilayered Coreless Support Structures and their Fabrication
App 20070281471 - Hurwitz; Dror ;   et al.
2007-12-06
Novel integrated circuit support structures and their fabrication
App 20070082501 - Hurwitz; Dror ;   et al.
2007-04-12

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