Michael; Mihalis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Michael; Mihalis.The latest application filed is for "power management application of interconnect substrates".
- Michael; Mihalis - San Ramon CA
- Michael; Mihalis - Antioch CA
| Patent | Date |
|---|---|
| Power management application of interconnect substrates Grant 10,748,845 - Michael , et al. A | 2020-08-18 |
| Power Management Application Of Interconnect Substrates App 20190341344 - Michael; Mihalis ; et al. | 2019-11-07 |
| Power management application of interconnect substrates Grant 10,332,827 - Michael , et al. | 2019-06-25 |
| Chip-scale packaging with protective heat spreader Grant 9,806,001 - Michael , et al. October 31, 2 | 2017-10-31 |
| Power Management Application Of Interconnect Substrates App 20170125335 - Michael; Mihalis ; et al. | 2017-05-04 |
| Power management applications of interconnect substrates Grant 9,520,342 - Michael , et al. December 13, 2 | 2016-12-13 |
| Chip-Scale Packaging With Protective Heat Spreader App 20150303127 - Michael; Mihalis ; et al. | 2015-10-22 |
| Power Management Applications Of Interconnect Substrates App 20150303132 - Michael; Mihalis ; et al. | 2015-10-22 |
| Power management applications of interconnect substrates Grant 9,099,340 - Michael , et al. August 4, 2 | 2015-08-04 |
| Chip-scale packaging with protective heat spreader Grant 9,070,662 - Michael , et al. June 30, 2 | 2015-06-30 |
| Power Management Applications Of Interconnect Substrates App 20130087366 - Michael; Mihalis ; et al. | 2013-04-11 |
| Chip-Scale Packaging with Protective Heat Spreader App 20100224985 - Michael; Mihalis ; et al. | 2010-09-09 |
| High-performance heat sink for printed circuit boards Grant 6,778,390 - Michael August 17, 2 | 2004-08-17 |
| High-performance heat sink for printed circuit boards App 20020172008 - Michael, Mihalis | 2002-11-21 |
| Interconnect structure App 20010018987 - Tzanavaras, George ; et al. | 2001-09-06 |
| Method for forming interconnects App 20010018800 - Tzanavaras, George ; et al. | 2001-09-06 |
| Method for forming interconnects Grant 6,230,400 - Tzanavaras , et al. May 15, 2 | 2001-05-15 |
| Method of manufacturing a plurality of semiconductor packages Grant 6,214,640 - Fosberry , et al. April 10, 2 | 2001-04-10 |
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