| Patent | Date |
|---|
Barrier Structures Between External Electrical Connectors
App 20220230940 - Miao; Chia-Chun ; et al. | 2022-07-21 |
Barrier structures between external electrical connectors
Grant 11,296,012 - Miao , et al. April 5, 2 | 2022-04-05 |
Flip-chip sample imaging devices with self-aligning lid
Grant 11,195,864 - Zhang , et al. December 7, 2 | 2021-12-07 |
Surface mounting semiconductor components
Grant 11,101,238 - Liu , et al. August 24, 2 | 2021-08-24 |
Semiconductor Device And Manufacturing Method Thereof
App 20210210450 - LU; CHUN-LIN ; et al. | 2021-07-08 |
Solder ball protection in packages
Grant 10,985,117 - Miao , et al. April 20, 2 | 2021-04-20 |
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
Grant 10,971,463 - Lu , et al. April 6, 2 | 2021-04-06 |
Interconnect layer contact and method for improved packaged integrated circuit reliability
Grant 10,892,290 - Qian , et al. January 12, 2 | 2021-01-12 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 10,867,957 - Lu , et al. December 15, 2 | 2020-12-15 |
Flip-chip Sample Imaging Devices With Self-aligning Lid
App 20200279880 - ZHANG; Ming ; et al. | 2020-09-03 |
Liquid crystal on silicon panel having less diffraction
Grant 10,761,385 - Zhang , et al. Sep | 2020-09-01 |
Semiconductor device and manufacturing method thereof
Grant 10,720,495 - Yu , et al. | 2020-07-21 |
Solder Ball Protection in Packages
App 20200118947 - Miao; Chia-Chun ; et al. | 2020-04-16 |
Solder ball protection in packages
Grant 10,510,689 - Miao , et al. Dec | 2019-12-17 |
Barrier Structures Between External Electrical Connectors
App 20190333841 - Miao; Chia-Chun ; et al. | 2019-10-31 |
Interconnect Layer Contact And Method For Improved Packaged Integrated Circuit Reliability
App 20190305027 - QIAN; Yin ; et al. | 2019-10-03 |
Curved image sensor using thermal plastic substrate material
Grant 10,418,408 - Zheng , et al. Sept | 2019-09-17 |
Barrier structures between external electrical connectors
Grant 10,347,563 - Miao , et al. July 9, 2 | 2019-07-09 |
Liquid Crystal On Silicon Panel Having Less Diffraction
App 20190196284 - Zhang; Ming ; et al. | 2019-06-27 |
Chip scale package for an image sensor
Grant 10,297,627 - Qian , et al. | 2019-05-21 |
Chip Scale Package for An Image Sensor
App 20190140005 - Qian; Yin ; et al. | 2019-05-09 |
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
App 20190123017 - Lu; Chun-Lin ; et al. | 2019-04-25 |
Integrated circuit underfill scheme
Grant 10,269,588 - Liang , et al. | 2019-04-23 |
Edge reflection reduction
Grant 10,211,243 - Miao , et al. Feb | 2019-02-19 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 10,163,846 - Lu , et al. Dec | 2018-12-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,157,900 - Liang , et al. Dec | 2018-12-18 |
Edge reflection reduction
Grant 10,147,751 - Miao , et al. De | 2018-12-04 |
Solder Ball Protection in Packages
App 20180337144 - Miao; Chia-Chun ; et al. | 2018-11-22 |
Solder ball protection in packages
Grant 10,049,990 - Miao , et al. August 14, 2 | 2018-08-14 |
Edge Reflection Reduction
App 20180226447 - Miao; Chia-Chun ; et al. | 2018-08-09 |
Edge Reflection Reduction
App 20180226448 - Miao; Chia-Chun ; et al. | 2018-08-09 |
Semiconductor structure and manufacturing method thereof
Grant 10,037,959 - Miao , et al. July 31, 2 | 2018-07-31 |
Surface Mounting Semiconductor Components
App 20180211935 - LIU; MING-KAI ; et al. | 2018-07-26 |
Edge reflection reduction
Grant 9,966,404 - Miao , et al. May 8, 2 | 2018-05-08 |
High dynamic range image sensor with reduced sensitivity to high intensity light
Grant 9,966,396 - Qian , et al. May 8, 2 | 2018-05-08 |
Semiconductor device and method of forming the same
Grant 9,953,966 - Miao , et al. April 24, 2 | 2018-04-24 |
Semiconductor chip scale package and manufacturing method thereof
Grant 9,941,240 - Liu , et al. April 10, 2 | 2018-04-10 |
Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby
Grant 9,921,442 - Qian , et al. March 20, 2 | 2018-03-20 |
Semiconductor Device And Manufacturing Method Thereof
App 20180061798 - LU; CHUN-LIN ; et al. | 2018-03-01 |
Edge Reflection Reduction
App 20170317124 - Miao; Chia-Chun ; et al. | 2017-11-02 |
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
Grant 9,806,045 - Lu , et al. October 31, 2 | 2017-10-31 |
Barrier Structures Between External Electrical Connectors
App 20170256477 - Miao; Chia-Chun ; et al. | 2017-09-07 |
High Dynamic Range Image Sensor With Reduced Sensitivity To High Intensity Light
App 20170213863 - Qian; Yin ; et al. | 2017-07-27 |
Method for Forming an Alignment Layer of a Liquid Crystal Display Device and Display Device Manufactured Thereby
App 20170205653 - Qian; Yin ; et al. | 2017-07-20 |
Barrier structures between external electrical connectors
Grant 9,698,079 - Miao , et al. July 4, 2 | 2017-07-04 |
Light Channels With Multi-step Etch
App 20170162621 - Qian; Yin ; et al. | 2017-06-08 |
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps
App 20170141073 - Lu; Chun-Lin ; et al. | 2017-05-18 |
Semiconductor structure and manufacturing method thereof
Grant 9,653,341 - Miao , et al. May 16, 2 | 2017-05-16 |
Package alignment structure and method of forming same
Grant 9,627,325 - Liu , et al. April 18, 2 | 2017-04-18 |
Semiconductor Structure and Manufacturing Method Thereof
App 20170098640 - Liang; Shih-Wei ; et al. | 2017-04-06 |
Edge reflection reduction
Grant 9,608,023 - Miao , et al. March 28, 2 | 2017-03-28 |
High dynamic range image sensor with reduced sensitivity to high intensity light
Grant 9,590,005 - Qian , et al. March 7, 2 | 2017-03-07 |
Mechanisms for forming hybrid bonding structures with elongated bumps
Grant 9,559,071 - Lu , et al. January 31, 2 | 2017-01-31 |
Semiconductor Structure And Manufacturing Method Thereof
App 20170018519 - MIAO; CHIA-CHUN ; et al. | 2017-01-19 |
Semiconductor structure and manufacturing method thereof
Grant 9,543,373 - Liang , et al. January 10, 2 | 2017-01-10 |
Semiconductor structure and manufacturing method thereof
Grant 9,472,523 - Miao , et al. October 18, 2 | 2016-10-18 |
Interposer having a defined through via pattern
Grant 9,460,989 - Liang , et al. October 4, 2 | 2016-10-04 |
Integrated Circuit Underfill Scheme
App 20160254169 - Liang; Shih-Wei ; et al. | 2016-09-01 |
Integrated circuit underfill scheme
Grant 9,355,924 - Liang , et al. May 31, 2 | 2016-05-31 |
Semiconductor Device And Method Of Forming The Same
App 20160133618 - MIAO; CHIA-CHUN ; et al. | 2016-05-12 |
Semiconductor device and method of manufacturing the same
Grant 9,337,154 - Miao , et al. May 10, 2 | 2016-05-10 |
Semiconductor Device And Method Of Manufacturing The Same
App 20160064338 - MIAO; CHIA-CHUN ; et al. | 2016-03-03 |
Semiconductor device
Grant 9,263,405 - Miao , et al. February 16, 2 | 2016-02-16 |
Semiconductor Device And Manufacturing Method Thereof
App 20150364376 - YU; TSUNG-YUAN ; et al. | 2015-12-17 |
Semiconductor device with bump adjustment and manufacturing method thereof
Grant 9,184,143 - Miao , et al. November 10, 2 | 2015-11-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150255273 - MIAO; CHIA-CHUN ; et al. | 2015-09-10 |
Solder Ball Protection In Packages
App 20150255406 - Miao; Chia-Chun ; et al. | 2015-09-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150200173 - MIAO; CHIA-CHUN ; et al. | 2015-07-16 |
Barrier Structures Between External Electrical Connectors
App 20150194400 - Miao; Chia-Chun ; et al. | 2015-07-09 |
Singulated semiconductor structure
Grant 9,064,873 - Miao , et al. June 23, 2 | 2015-06-23 |
Semiconductor Device And Method Of Forming The Same
App 20150162288 - MIAO; CHIA-CHUN ; et al. | 2015-06-11 |
Semiconductor Device And Method Of Forming The Same
App 20150162291 - MIAO; CHIA-CHUN ; et al. | 2015-06-11 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150108635 - LIANG; SHIH-WEI ; et al. | 2015-04-23 |
Semiconductor Device And Manufacturing Method Thereof
App 20150061116 - LU; CHUN-LIN ; et al. | 2015-03-05 |
Semiconductor Device And Manufacturing Method Thereof
App 20150035161 - MIAO; CHIA-CHUN ; et al. | 2015-02-05 |
Semiconductor Device And Manufacturing Method Thereof
App 20150008575 - LIU; MING-KAI ; et al. | 2015-01-08 |
Mechanisms For Forming Hybrid Bonding Structures With Elongated Bumps
App 20150001704 - LU; Chun-Lin ; et al. | 2015-01-01 |
Package Alignment Structure and Method of Forming Same
App 20140252657 - Liu; Ming-Kai ; et al. | 2014-09-11 |
Interposer Having a Defined Through Via Pattern
App 20140162405 - Liang; Shih-Wei ; et al. | 2014-06-12 |
Integrated Circuit Underfill Scheme
App 20140117555 - Liang; Shih-Wei ; et al. | 2014-05-01 |
Interposer having a defined through via pattern
Grant 8,664,768 - Liang , et al. March 4, 2 | 2014-03-04 |
Interposer Having a Defined Through Via Pattern
App 20130292830 - Liang; Shih-Wei ; et al. | 2013-11-07 |
| 